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Ed Healy and Abhay Misra Join Cubic Wafer Management Team; Austin Company Enables Dense Vertical Integration (3D Chips) and Restores Moore's Law for the Integration Possibilities of the Semiconductor Industry.

AUSTIN, Texas -- Cubic Wafer expands its management team by naming Ed Healy, chief executive officer, and Abhay Misra, vice president of operations and engineering. The new leadership team brings years of expertise and relationships within the semiconductor industry. Additionally, the Cubic Wafer headquarters have been relocated to Austin to accommodate growth as the company brings its patented, proprietary process technology to market. Cubic Wafer develops a proprietary process technology for vertical integration of semiconductor die at the chip level, which will benefit everything from gaming, memory, cameras and wireless, to data communication, data storage, PCs, printers, networking and more.

"The benefit of having a management team in place with the skills Ed and Abhay bring is their ability to immediately capitalize on our technology by implementing a strategic plan for achieving a revenue stream in the short term without losing sight of our long-term objectives," said Russ Johnsen, chairman of the board of Cubic Wafer. "We are confident Cubic Wafer is positioned to create an industry shift to transform and advance the integration possibilities of the semiconductor industry."

"A truly unique dimension Cubic Wafer offers is our ability to bring relevance to Moore's Law using today's technology," said Ed Healy, chief executive officer of Cubic Wafer. "Attracting superior talent with a demonstrated ability and strong track record for establishing and maintaining operational excellence is not an easy accomplishment; however, we have succeeded in doing just that with Abhay's commitment to join our team."

Healy and Misra plan to focus on developing partnerships with leading semiconductor companies who will be implementing the Cubic Wafer process for developing highly integrated circuits (ICs) for breakthrough applications while enhancing production and dramatically reducing costs. The team will target Asian foundries, assembly and packaging companies to transfer the Cubic Wafer manufacturing process to achieve high volume capabilities.

Mr. Healy succeeds Russ Johnsen, interim CEO and chairman of the board. Healy was previously vice president of wireless products with Silicon Laboratories, a global leader in mixed-signal integrated circuit technology with 2004 revenues of $456 million. In his role there, Mr. Healy established the company's wireless business, growing it from a start-up venture in 1998 to a business generating more than $230 million in annual revenue. Mr. Healy's experience spans 15 years and includes serving as general manager of the Magnetic Storage Division at Crystal Semiconductor/Cirrus Logic, Zilog and GEC Plessey Semiconductor.

Mr. Misra brings extensive experience to his position, as vice president engineering and manufacturing operations. Formerly, Misra served as director of Manufacturing Technology and Supplier Management during his seven-year tenure at Silicon Laboratories. In this role, Misra's responsibilities included defining manufacturing strategies, outlining technology roadmap, directing technology usage, formulating operations strategy as well as managing and directing all outsourced suppliers. Misra's expertise includes overseeing product lines from conception to volume production and providing regular insight and leadership to the Assembly, Foundry, Failure Analysis (FA) and CAD teams. Prior to joining Silicon Laboratories, Misra served as director of Worldwide Foundry Operations for Cyrix Corporation, which was acquired by National Semiconductor. Misra has also held positions with Dallas Semiconductor, American Research Corporation and Louisiana State University.

About Cubic Wafer

Cubic Wafer is a privately owned company that delivers proprietary platform technology to accomplish 3D chip stacking and integration without the size and scalability limitations of conventional flip-chip and wire bond approaches. Cubic Wafer's technology fuses integrated circuits (ICs) at the die or wafer level thereby replacing expensive system-on-chip or system-in-package solutions by providing unlimited integration capabilities and leveraging best-in-category materials and suppliers. The result enables breakthrough high-density, high-performance, multi-material and multi-functional ICs for the consumer electronics, digital, wireless and data communications industries. Based in Austin, Texas, Cubic Wafer has a development center in Merrimack, New Hampshire. For more information on Cubic Wafer, visit www.cubicwafer.com or email info@cubicwafer.com.
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Publication:Business Wire
Date:Sep 12, 2005
Words:635
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