Printer Friendly

Articles from EE-Evaluation Engineering (August 1, 2016)

1-23 out of 23 article(s)
Title Author Type Words
60-GHz development system. 121
Accurate and integrated temperature measurement. Lecklider, Tom 1793
Algorithms, instruments rev up 5G. Nelson, Rick Conference news 2785
Building parts one layer at a time. Lecklider, Tom 2455
ChipMOS selects Xcerra test cell for high-volume MEMS test. Brief article 254
Companies collaborate on industrial M2M SoC. Brief article 211
DC/DC converter. 141
DMMs extended and refine. Lecklider, Tom 2387
FFT option. 138
Functional test platform. 123
GaN shows promise for transportation, communications applications. Nelson, Rick 829
High-density receptacles. 109
High-voltage reed relays. 116
Impacting accuracy of chipmaker's quality tests. Sarson, Peter; Schatzberger, Gregor; Wild, Andreas 1585
IMS sees chips and instruments targeting mmWave applications. 899
Keeping EMI in its place. Lecklider, Tom 1583
Sensors Expo topics span MEMS to robots and drones. Nelson, Rick Conference news 854
Spectrum monitoring module. 102
SwissQual AG monitors mobile network at CERN's LHC. Brief article 215
Taking the pulse of the industry. Lecklider, Tom 1914
TEDS force sensors. 102
USB hub. 103
Westinghouse's 19-inch rack accommodates 8x8 MIMO test. Nelson, Rick Editorial 589

Terms of use | Privacy policy | Copyright © 2019 Farlex, Inc. | Feedback | For webmasters