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DoD ESI Announces Popular Category BPAs Awarded: Save time, save money with enterprise agreements.

The Department of Defense Enterprise Software Initiative is pleased to announce that Computer-Aided Design/Computer-Aided Manufacturing, Modeling, Simulation & Engineering Software and Solutions BPAs are now available to all DoD organizations. These are 10-year agreements with a period of performance from 1 April 2019 to 31 March 2029.

Blanket Purchase Agreements were awarded to Adacel Inc., DLT Solutions LLC (Autodesk), Carahsoft Technology Inc. (Trimble), Immix Technology (PTC) and Simigon Inc. under the DoD ESI for CAD/CAM products. Products include software licenses, software maintenance support, subscriptions, and information technology professional services.

Products include: Computer Aided Design, 3D Modelling, 2D Drafting, Product Data Management (PDM), Simulation/Computer-Aided Engineering (CAE), Product Life-Cycle Management (PLM), Concurrent Engineering, Computer-Aided Machining (CAM), Building Information Modeling (BIM), Advanced Real Time Rendering, Mobile Access to CAD, Augmented/Virtual Reality, 3D Printing Solutions, and Support Services.

For more information on these BPAs, go to: Adacel, Autodesk, PTC, SimiGon, Trimble.

IT Research and Informative Services Category-Based BPAs Awarded

Additionally, the DoD ESI announced that it has awarded Category-based BPAs available to all DoD organizations that provide Information Technology Research and Informative Services consisting of expert advice on a broad range of technical topics that specifically focus on industry and market trends aimed at saving time, mitigating risk, and empowering clients to make informed business development decisions.

These are 10-year agreements with a period of performance of 25 March 2019 through 24 March 2029. For more information, please click on the following links: Fedmine, Forrester, and Gartner .

TAGS: Cybersecurity, Efficiencies, ELA, Enterprise Services, IA, Infrastructure, NEN, NNE

By CHIPS Magazine - April-June 2019

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Publication:CHIPS
Date:Apr 1, 2019
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