Director of product management, TE connectivity, touch solutions.
Driven by attractive and convenient consumer electronics, the trend in medical devices is toward increasingly powerful yet smaller devices, with the added complication of designs that eliminate fan assisted cooling. Air gaps within these devices must be kept to a minimum and much of the heat must therefore be conducted to the interior walls of the enclosure, transferred to air utilizing natural convection or radiated away from the source, in a combination that keeps operating temperatures below design limits. As the density of PCBs increased, problems were inevitable. Resolution has been through a multi-faceted approach that included thermal modeling and verification, testing a variety of designs to address hot spots, and coupling heat generators so that virtually every exterior surface of these devices is performing as a thermal sink. Additional time must be allocated for the (design/modeling/verification/testing at design limits) cycle that will likely require several iterations to achieve a successful product design. New designs incorporate thermal extraction considerations from the outset.
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|Title Annotation:||Perspectives On Miniaturization|
|Publication:||Medical Design Technology|
|Date:||Nov 1, 2011|
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