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Developments allow shops to pursue new markets and improve margins.

FLATBOND GT, MEC's marquis copper surface treatment, is generating intense interest among shops--and, more recently, OEMs, as a solution for servers and other 25 GHz+ applications. FlatBOND provides a profile-free surface, and improves adhesion by 40% on low dielectric resins, although the treated surface is flat.

As speeds and frequencies move higher, conductor surface roughness produces signal loss. So the goal is to balance signal integrity and layer adhesion, a feat FlatBOND manages exceptionally well.

FlatBOND produces a chemical bond without topographical change and provides for negligible signal loss and distortion on high-frequency applications. It is an elite alternative for "next-gen" applications--and an effective tool for shops hoping to differentiate and compete in new markets.

ETCHBOND CZ-2030 was developed for inner layer preparation prior to dry film or image transfer. This organic acid-type copper treatment delivers performance equal to its predecessor, CT-910, with fewer components.

CZ-2030 has a stable etching rate, and provides maximum soldermask adhesion at a low etch (less than 40 p inch).

CZ-2030's single-component system, coupled with its high copper capacity (55 g/l) reduces storage needs and minimizes waste.

V-BOND 7710 is an H2S04-H2C>2-type microetchant with substantial cost and maintenance advantages compared with conventional oxide alternatives. It is widely regarded as a higher-performing successor to CZ-2030 for oxide treatment, and provides exceptional inner layer adhesion to all resins, including high Tg, HF (halogen-free), and PTFE.

It has the highest peel strength in the industry, and a high copper capacity (45 g/l) for reduced waste. V-Bond is flood immersion or spray compatible, so there's no capital expense burden. The V-Bond process operates over a broad temperature range and can provide greater stability and bonding at reduced etching amounts. It is engineered to remain sludge-free for up to a year.

ETCHBOND CZ-5480 allows the greatest process flow flexibility, with no equipment issues. Its nitric acid formula is primarily used for copper micro-roughening for dry film and soldermask applications. An alternative to CZ-2030, CZ-5480 still provides dry film adhesion and line resolution that is superior to peroxide, persulfate, and tri-acid microetches.

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Publication:Printed Circuit Design & Fab Circuits Assembly
Date:Nov 1, 2014
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