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DSPC Introduces New 1.8V Single-chip PDCharm Solution; New DSP and ARM Integrated PDCharm Enables More Than 70% Reduction in Current and Power Consumption.

CUPERTINO, Calif.--(BUSINESS WIRE)--July 6, 1999--

DSP Communications, Inc. (NYSE:DSP) today announced the introduction of its single-chip PDCharm(TM) offering the highest level of integration and more than 70% reduction in power consumption for its PDC baseband solution. This significant power savings enables a 15-20% increase in talk time of PDC handsets. Featuring Texas Instruments' TMS320C54x DSP core and advanced .5mm pitch MicroStar BGA(TM) packaging, PDCharm provides significant savings in cost and board area. PDCharm engineering samples have already been delivered to several customers and production ramp-up is planned in the second half of 1999.

"PDCharm provides a highly effective, power-saving solution for PDC baseband processing and represents an important step towards a completely integrated solution for PDC handsets," said Gabi Hilevitz, General Manager of DSPC Technologies, Ltd. "PDCharm together with the availability of DSPC's single-chip RFIC in 2000 will allow handset manufacturers access to a complete two-chip system solution including baseband and RFIC."

"Advances in TI's wireless DSP and analog solutions integrated in the latest process and package technology bring increased performance and cost savings to DSPC's PDC customers," said Ethan Davis, PDCharm(tm) program manager at Texas Instruments. "The functionality integrated in the one chip PDCharm was just a year ago three separate chips. Reductions in board area, power and cost will enable handset manufacturers to bring competitive handsets to market quickly."

PDCharm incorporates the latest technological innovations to significantly reduce component count, power consumption and bill of materials cost. By using Texas Instruments' TMS320C54x DSP core and advanced .5mm pitch MicroStar BGA(TM) packaging, PDCharm significantly cuts cost and PCB area. In addition, PDCharm uses TI's 0.21 micron drawn (or 0.18 micron L-effective) silicon process and GS20 ASIC library to integrate a DSP core, ARM7TDMI CPU, logic and analog circuits on a single chip. These enhancements enable an even more powerful, flexible platform and processing capability, while significantly reducing power consumption using 1.8V supply.

PDCharm also features new system software to support two new PDC full rate vocoders and recently introduced data services. The new generation chip provides advanced audio functions such as enhanced noise suppression, echo cancellation, and a high quality voice memo pad. Combined with DSPC's single-chip radio frequency (RF) solution, PDCharm is designed to allow PDC handsets to achieve optimal power savings and operating performance.

DSPC introduced its first generation PDC chipset in 1993 as a full-rate two-chip baseband solution for the RCR-27B standard. DSPC has successfully introduced multiple generations of products for the full-rate and dual-rate RCR-27C standard. As of June 1999, approximately 43 million consumers subscribe to the PDC system in Japan according to Japan's Ministry of Posts and Telecommunications.

DSP Communications, Inc. is a leading developer of chipsets, hardware and software for cellular, personal communication services (PCS), and wireless local loop (WLL) markets. Headquartered in Cupertino, CA, the Company develops, markets, licenses, and supports application specific integrated circuits (ASICs), reference designs and software based on digital signal processing (DSP) technology for a variety of wireless applications. The Company's products comply with leading standards for Personal Digital Cellular (PDC), Time Division Multiple Access (TDMA), and Code Division Multiple Access (CDMA). The Company's leading customers include Fujitsu, Kenwood, Kyocera, Kokusai, NEC, Pioneer, Sanyo, Sharp, and SK Teletech. For more information, please visit DSPC's Web site at http://www.dspc.com.

This press release contains forward-looking statements that are based on current management expectations. These statements may differ materially from actual future events or results as a result of certain risks and uncertainties, including the impact of competition in the PDC market, risks associated with product development and potential unforseen problems with the PDCharm(TM) chip that may require corrections or further development, commercialization of the PDCharm(TM) chip and potential technological difficulties associated with gearing up for mass production of the PDCharm(TM) chip, and other risks detailed in the documents filed by DSPC with the SEC from time to time, specifically the most recent reports on Form 10-K and 10-Q.

Editor's Note: All products and company names used herein are trademarks or registered trademarks of their respective companies.
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Publication:Business Wire
Geographic Code:1USA
Date:Jul 6, 1999
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