DNP and Unimicron to Establish Printed Wiring Board Joint Venture.
Demand for high function, high density printed wiring boards is forecast to see further expansion going forward, in line with the spread in high function mobile phones in recent years. In many instances, manufacturing of mobile phone terminals is carried out in China and the Asian region, and there are increasing calls for printed wiring board makers to make it possible to answer that demand in a timely fashion from a location closer to the factories of the mobile terminal makers, which serve as their clients.
The new company will sign a patent license agreement covering B2it technology with DNP, and manufacture and market printed wiring boards based on this technology. The new company will contract manufacturing to the Unimicron factory in Kunshan, China, and will market end products to DNP and Unimicron in the first instance.
In addition to helping DNP strengthen its production system for printed wiring boards based on B2it, and further expand its business, by providing B2it related manufacturing technology support to Unimicron, the establishment of this new company will also pave the way for the global standardization of B2it technology, itself. As far as Unimicron is concerned, adopting B2it technology will help the company to strengthen its production system for high function, high density printed wiring boards, and Unimicron plans to enhance its cost reduction effect through mass production.
Overview of the New Company
Company name: UD Alliance Technology Limited Location: Hong Kong Paid in capital: HKD 40 million Investment ratio: Unimicron 66.5%, DNP 33.5% To be established: Late June 2008 Rep. Directors: Unimicron will send in two directors, and DNP one. Business content: The manufacture and marketing of printed wiring boards based on B2it(TM) technology.
About B2it Technology
"B2it(TM)" is a DNP unique technology for buildup printed wiring boards, which connects adjacent conductive layers by the bumps made of a high conductivity paste, formed by screen printing and penetrated insulating layer. As there is no plated through hole for electrically connecting between the conductive layers, that leaves a broader area on which to mount parts, and as the wiring layout can be freely carried out throughout all the layers this technology also has the characteristic of allowing for broad latitude in wiring design.
About Dai Nippon Printing
Dai Nippon Printing Co., Ltd. ('DNP'; TSE: 7912) celebrated the 130th anniversary of its founding in October 2006. Today, DNP has established itself as the leader in the world in the field of comprehensive printing. Currently, DNP employs about 35,000 people. In Japan, DNP has 20 division offices in major cities, 49 sales bases, and 37 production plants, while overseas it has another 21 sales offices and seven production plants. The DNP group includes 82 consolidated subsidiaries and 9 affiliated companies that are accounted for by the equity method. For more information, please visit www.dnp.co.jp .
About Unimicron Technology Corp.
Unimicron Technology Corp. (Unimicron) is the world's largest manufacturer of printed wiring board for use on mobile phones and the top 3 PWB producing company with turnover of US$1.5 billion in 2007. Unimicron supplies a broad range of PWB solutions including advanced PWB (which contributed to 70% of its turnover such as IC carrier and HDI PWB) as well as conventional PWB with manufacturing bases in Taiwan and China. For more information, please visit http://www.unimicron.com/
Source: Dai Nippon Printing
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|Date:||Apr 8, 2008|
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