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Articles from Circuits Assembly (February 1, 2007)

1-49 out of 49 article(s)
Title Author Type Words
$1B park in Vietnam next up for Foxconn. Buetow, Mike 134
'45 [micro]m accuracy' pick-and-place. 81
20-feeder MSD cabinet. 113
A mixed technology reliability assessment: using a mix of lead and Pb-free components, the authors found failure similar mechanisms for SAC and SnPb eutectic solder. Nahorniak, Mike 1796
A novel low melting point Pb-free solder: a SnBiX solder showed a melting point of about 186[degrees]C and cut the material cost. Chen, Zhenhua 1605
A tale of two schools. Buetow, Mike Company overview 871
AIT issued patterned leadframe patent. Buetow, Mike 164
All you really want to know about XRF: XRF is an effective means for validating the presence of certain restricted elements. Zarrow, Phil 1068
Blowholes in Pb-free wave soldering: even for humidity-soaked boards, the culprit is barrel cracking. Schouten, Gert 773
Class 100 cleanroom dispenser. 110
Confessions of a rookie manufacturing engineer: how a simple question forever altered my perspective. Whiteman, Lee 828
Conformal coating and board cleanliness: ensuring product cleanliness and durability in any application. DeBenedetto, Matt 1168
Cover your shorts: dendritic growth--metallic short circuits--can be eliminated. Munson, Terry 415
Dual-head soldering system. 84
Electronics equipment demand to uptick in 2007. Drysdale, Chelsey 213
Extending tip life in Pb-free hand soldering: improved heater control and tip profiles eliminate overshoot, improve thermal transfer to the joint and reduce idle temperature. Zamborsky, Ed 1513
Factors affecting voiding in Pb-free solder joints: voiding is sensitive to a particular flux constituent, and copper pad finishes more susceptible than AuNi or immersion Ag. Steen, H.A.H. 1938
Final EPA TRI rule eases reporting burden. Buetow, Mike 453
Haier to take stake in Founder PC Group. Buetow, Mike 163
Hard lessons of RoHS; Environmental legislation should do one thing: improve the environment. 1255
Heading East. Interview 876
High-speed wire bonder. 117
IC inventories in check, SIA says. Drysdale, Chelsey 159
In case you missed it. 825
Industry market snapshot. Drysdale, Chelsey 98
IPC purges Government Relations committee. Buetow, Mike 599
iSuppli: IC sales to rise 10.6% this year. Drysdale, Chelsey 129
Jabil completing Taiwan Green Point buy. Buetow, Mike 129
Lessons from Asia: while data on emerging technology are always welcome, most want the nuts-and-bolts. Belmonte, Joe 774
Mathematical modeling of solder paste stenciling for process control: a DoE for characterizing solder paste stencil printing and measuring paste bricks by 3-D AOI is described. Wright, Tim 2146
Metals index. Drysdale, Chelsey 84
Microvia-in-pad: possible outcomes and solutions; The features that enable portable technology can cause assembly process predicaments. Jean, Denis 2245
New orders and production growing, deliveries slowing. Drysdale, Chelsey 194
Organic and printed electronics: the next big thing? New printing processes promise high throughput at low costs. Zhang, Jie 2107
Parallel AOI/AXI 3-D inspection. 86
Pb-free wave solder design guidelines: it's best to review every aspect, from pad design to lead length. Jean, Denis 1155
PCB Design Conference East issues call for abstracts. Buetow, Mike 155
Process mapping and design: a detailed process map can help reduce everything from cycle time to defects to process steps. Linton, Jonathan 2068
Report: China's OEMs narrowing sales gap. Buetow, Mike 133
Sanmina-SCI's financial woes continue. Buetow, Mike 279
Semiaqueous flux cleaner. 82
Sensor underfill encapsulant. 90
SMT Automation line. 86
The PCB design outsource proposition: is outsourcing the right solution for your company? Zaccari, Joseph Company overview 3166
TTI to be sold to famous investment group. Buetow, Mike 139
Un-PC. Drysdale, Chelsey 171
Vitronics' XPM3 reflow soldering system. 561
Wave soldering myths, Part 2: peel-off is more critical than ever; care must be taken to attain the best possible setup. 1134
When to use underfill with BGAs: some non-underfilled parts pass high-rel thermal cycle tests. 334

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