Printer Friendly

CREE LAUNCHES GAN HEMT PROCESS DESIGN KIT FOR AGILENT.

Cree, Inc. (Nasdaq:CREE), Durham, N.C., launches a leading-edge process design kit (PDK) for GaN HEMT process technology. The Cree PDK, developed for use with Advanced Design System (ADS) from Agilent Technologies, Inc., can enable radio-frequency (RF) and microwave designers to shorten the development cycle for monolithic microwave integrated circuits (MMIC) used in high-power, high-performance electronic systems, resulting in a highly productive design flow.

The Cree GaN kit includes microstrip lines, discontinuities, scalable capacitors, inductors and resistors, pads, vias, airbridges and active devices (HEMTs) at multiple biases.

Cree's GaN foundry is the world's first state-of-the-art, wide-bandgap MMIC facility, and our GaN-on-silicon carbide devices have significantly higher power density, thermal conductivity and operating voltage than traditional GaAs or Silicon MMIC technologies. RF designers can take advantage of this PDK to create MMICs for high-power commercial wireless, wideband military, electronic-warfare and radar applications.

"We are pleased to offer access to our GaN MMIC foundry capability through the Advanced Design System. This kit allows our customers to take advantage of an industry-leading electronic design automation (EDA) technology that provides seamless schematic through layout interoperability with design rule checking (DRC). This integrated design flow can help accelerate our customers' time-to-market by offering an accurate and productive work environment," said Jim Milligan, director of RF and microwave products at Cree.

"GaN is becoming more and more important in the industry. With Cree's GaN process, our mutual customers have access to a powerful MMIC design solution in an integrated flow for leading-edge, high-power applications," said Anitha Swaminathan, foundry program manager with Agilent's EEsof EDA division.

For additional information about the Cree PDK, please call 919/287-7816 or visit http://www.cree.com.

About Agilent

Agilent EEsof EDA is an industry-leading provider of RF-mixed signal circuit and system-design software. Agilent ADS offers powerful simulation, schematic and seamless integration with layout and DRC capability for complete front-to-back MMIC design in an integrated flow. For more information about Agilent's EDA solutions, visit http://www.agilent.com/find/eesof.

About Cree

Cree is leading the LED lighting revolution and setting the stage to obsolete the incandescent light bulb through the use of energy-efficient, environmentally friendly LED lighting. Cree is a market-leading innovator of lighting-class LEDs, LED lighting retrofit solutions, and semiconductor solutions for backlighting, wireless and power applications.

Cree's product families include recessed LED down lights, blue and green LED chips, high-brightness LEDs, lighting-class power LEDs, power-switching devices and radio-frequency/wireless devices. Cree solutions are driving improvements in applications such as general illumination, backlighting, electronic signs and signals, variable-speed motors, and wireless communications.

For more information, visit http;//www.cree.com or call 919/313-5505.
COPYRIGHT 2008 Worldwide Videotex
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2008 Gale, Cengage Learning. All rights reserved.

Article Details
Printer friendly Cite/link Email Feedback
Publication:CAD/CAM Update
Date:Jul 1, 2008
Words:436
Previous Article:IMSI/DESIGN UNVEILS VARIABLE CONSTRAINT SYSTEM.
Next Article:AUTODESK TAKES OWNERSHIP OF MOLDFLOW.
Topics:


Related Articles
PMC-SIERRA ANNOUNCES QUADPHY-II XENPAK/10GE EVAL SYSTEM.
Random samples: products.
Random samples: products.
Random samples: products.
Agilent enlists new life science partners. (Executive briefing: news, trends & market intelligence for instrument executives).
AGILENT DEBUTS FIRST MICROARRAY FOR RICE BLAST DISEASE.
CREE ADDS TWO HIGHER BRIGHTNESS PRODUCTS TO THE XTHIN FAMILY.
Market profile: lab-on-a-chip.
CREE UNVEILS 100-MM ZERO-MICROPIPE SIC SUBSTRATE.
Fujitsu Develops Technology for High-Reliability Gallium Nitride HEMT.

Terms of use | Privacy policy | Copyright © 2020 Farlex, Inc. | Feedback | For webmasters