Printer Friendly

Black pad has multiple causes.

Phil Zarrow's April column narrowly assumes causes of black pad. And recommending more gold as mitigation is harmful advice (assuming many readers may miss his 4 [micro]in maximum as the reasonable upper limit). Japanese science has proven, in this case, less is better.

Black pad has several causes. The mistake assumes all ENIG chemistries are created equal. We have proven that is not true. Black pad is rare, but can be created by 1) an electroless nickel with less than 5.5% phosphorus content in the plated layer; 2) an overly aggressive gold chemistry (either the chemistry is too acidic, or the gold is permitted to run below recommended levels in the bath, or boards are simply left in the bath too long); 3) the gold layer is too thick (gold deposits by replacing nickel; if this is permitted to continue too long, then the surface is compromised and black pad is guaranteed).

We still fight standards (even military: "But that is what the spec says") that require a minimum 8 [micro]in of immersion gold. Hopefully, such specs also accept total responsibility for black nickel! We also fight erroneous thinking that the solution is high phosphorus nickel (so much for good solderability).

The key steps are a consistent nickel and gentle gold that give complete coverage (porous gold layers do not protect the nickel surface) with limited thickness. We prefer two or three [mu]in. As a supplier, this reduces our sales but saves customers money and, most important, it is based on years of research and field service.

Another battle fought over the years was the concept of ENIG with a layer of electroless palladium between the nickel and gold (ENEPIG) as the universal finish. However, this does not create as strong a solder joint as regular ENIG, provided leaded solders are used. For non-leaded solders, ENEPIG offers better solderability and eliminates black pad, as the palladium layer acts as a protective barrier between nickel and gold.

Another flexible alternative is adding a layer of electroless (autocatalytic) gold over ENIG (a process called ENAG), for purposes of gold wire bonding.

Don Walsh Director of Operations Uyemura International Corp.
COPYRIGHT 2008 UP Media Group, Inc.
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2008 Gale, Cengage Learning. All rights reserved.

Article Details
Printer friendly Cite/link Email Feedback
Title Annotation:Letters
Author:Walsh, Don
Publication:Circuits Assembly
Date:Jun 1, 2008
Previous Article:In case you missed it.
Next Article:Spin cycle.

Related Articles
Waste not, want not: simplify BGA rework by reusing leftover solder.
Afraid of the dark? We'll examine the effect of severe black pad defect on solder bonds on BGAs.
Black pad on ENIG PCBS: the discovery of "extreme dewetting" prompted a search for the source--in Shenzhen.
In case you missed it.
Black pad--a scourge on your boards: the potential failure mechanism can reside randomly and unpredictably.

Terms of use | Privacy policy | Copyright © 2019 Farlex, Inc. | Feedback | For webmasters