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Back to back assembled 1 mm pitch BGA GHz socket combination.

Ironwood Electronics' Socket combination (assembled back-to-back)--SG-BGA-6130 allows 1 mm pitch 3,528 position (total pin count) BGA ICs to be used in socket and operate without compromising performance in very high speed communication or computing applications where the devices are assembled back-to-back on to the target PCB. The GHz bandwidth socket combination easily supports high pin count BGA devices using a conductive elastomer connector. The contact resistance is normally 10 m[ohm]. The sockets have a precision design, which guides the IC to the exact position for connection of each ball and uses aluminum heat sink screws to provide compressive force to ensure full electrical contact. The socket shown is SG-BGA-6130 for 42.5 mm IC body size. The socket combination accommodates IC packages such as the Xilinx FF1704 BGA, 1 mm pitch, 42 X 42 arrays. When large BGAs are mounted back to back, the amount of PCB circuitry for chip-chip interconnect is reduced, and PCB wiring loading is also reduced. The individual socket is 8.48 mm high and 2.5 mm per side larger than the actual IC packages, minimizing footprint on system boards while maximizing system speeds. Pricing for the socket combination SG-BGA-6130 is $1,492 in quantities of 100. Ironwood Electronics


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Title Annotation:Boards & Modules
Publication:ECN-Electronic Component News
Date:Dec 1, 2004
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