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Anti-tombstoning solder paste.

Multicore[R] 63S4 solder pastes, formulated with 63S4 alloy that eliminates costly tombstone defects and reduces component misalignment, produce safe residues and are effective over a wide range of reflow profiles in air or nitrogen. Suitable for fine-pitch printing to 0.4 mm and high speed stencil printing up to 150 mm/sec, these products contain a high activity, no-clean flux that is effective on difficult to solder substrates such as HASL, OSP copper, gold over nickel and silver immersion.

Loctite Multicore, Rocky Hill, CT

Circle 119

[ILLUSTRATION OMITTED]
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Title Annotation:Product Spotlight
Publication:Circuits Assembly
Date:Feb 1, 2002
Words:89
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