Acid Copper Plating course offered at IPC.
The intense one-day course was created for plating engineers, engineering and production managers, QC engineers, electrolytic equipment designers and manufacturers, and PWB designers.
Electrolytic acid copper is the process that builds the traces that carry the current throughout the PWB. So, how best to optimize your electrolytic acid copper plating for today's challenging designs? (aspect ratios >20:1 for thru hole and >1:1 aspect ratios for blind via fill).
The challenge for acid copper is how it can continue to deliver the next generation of PWB designs, while maintaining tensile strength, elongation and thickness distribution.
George Milad has 28 years in PCB manufacturing and is the Manager for Technology at UIC/Uyemura. George holds a Master's Degree in Physical Organic Chemistry from the American University in Washington DC, and is the author of the chapters on "Plating" and "Surface Finishing" in Clyde Coomb's "Printed Circuit Handbook." He has also authored numerous publications on electrolytic plating and is the recipient of the 2009 IPC President's Award.