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AMOCO DEVELOPS LOW-COST ADDITIVE PROCESSES FOR MAKING MCM-D/L AND HIGH DENSITY WIRING BOARDS

 CHICAGO, Jan. 4 /PRNewswire/ -- Ultradel Microelectronic Coatings, a marketing unit of Amoco Chemical Company, in alliance with Hadco Corporation, Toranaga Technologies, Inc. and other material suppliers, has announced new approaches to building MCM-D/L and high density wiring boards.
 These technology alternatives are believed to represent a breakthrough in processing low-cost, high performance multichip modules (MCM) and high density interconnect.
 The processes are based on Ultradel(R) 7500 photosensitive polyimides from Amoco. These commercially available dielectrics have unique properties including low cure temperatures, high glass transition temperatures, copper compatibility, and can be processed in a wide range of coating thicknesses. Alternative metallization technologies are being developed for specific industry segments.
 One metallization approach uses electroless/electrolytic copper plating chemistry with the photosensitive Ultradel polyimide. Adhesion of electroless copper to the polyimide is provided through a customized plating formulation. The resulting fine-line MCMs have reduced layer count and incorporate photodefined blind vias. The superior thermal properties of the Ultradel polyimide and the high density achievable with this system are ideally suited to advanced die-attach techniques, such as flip-chip.
 Another metallization approach uses Ormet(TM) conductive ink from Toranaga Technologies, Inc. and Ultradel photosensitive polyimide. This fully additive process eliminates processing steps, thus reduces costs. Ormet has high conductivity, good adhesion, sinters at low temperatures, and is solderable by all commonly used methods.
 Both metallization approaches lower costs, use standard equipment, produce fine lines and thinner layers, and incorporate blind vias.
 Amoco, Toranaga, and an electroplating chemistry supplier will work closely with Hadco to develop compatible and manufacturable dielectric and conductor systems for these applications. As a leading supplier of high density interconnect systems, Hadco will make prototype modules and, ultimately, establish a high volume capability. The alliance is seeking additional cooperation from original equipment manufacturers (OEMs) to demonstrate the cost and performance benefits of this thin film on laminate technology in commercial applications.
 Amoco Chemical Company, a subsidiary of Chicago-based Amoco Corporation (NYSE: AN), is the worldwide manufacturer and marketer of petrochemicals, plastics, and high performance materials.
 Hadco Corporation (NASDAQ: HDCO), based in Salem, N.H., is a leading supplier of electronic interconnect products and services to the broad electronics OEMs and to contract assemblers for the computer, telecommunications, automotive, medical instruments, and industrial automation sectors of the electronics industry. Hadco operates six manufacturing facilities in the United States, providing techologically complex printed circuits, backplane assemblies, and added-value sub- assemblies.
 Toranaga Technologies, Inc. of Carlsbad, Calif., developed the Ormet(TM) family of conductive inks for a wide variety of cost- and performance-driven circuit applications. Ormet inks overcome problems relating to conductivity, adhesion, and solderability associated with PTF inks.
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 /CONTACT: John Hoback, 708-420-5454, or David Nethero, 312-856-6617, both of Amoco; Bruce Sorenson of Hadco, 603-898-8010; or Martin Knestrick of Toranaga, 619-931-7090/
 (AN HDCO)


CO: Amoco Chemical Company; Hadco Corporation; Toranaga Technologies ST: Illinois, New Hampshire, California IN: CPR SU:

BM -- CL009 -- 8960 01/04/94 14:23 EST
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Publication:PR Newswire
Date:Jan 4, 1994
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