Printer Friendly

A diamond coat for chips.

Diamond is an excellent conductor of heat and a poor conductor of electricity. These properties would make diamond a useful material in the manufacture of integrated-circuit chips, if it were possible to produce paper-thin diamond films that could be used as electrical insulators. Recently, researchers at the Hitachi Research Laboratory in Japan took some of the first steps toward bringing diamond films into microelectronics.

The Japanese researchers, reporting their findings at last month's International Chemical Congress of Pacific Basin Societies (PAC CHEM '84) held in Honolulu, found that microscopic diamonds are produced when microwaves irradiate a mixture of methane and hydrogen gas. This treatment forces the gases to decompose to create a plasma of charged particles. Over a period of hours, tiny diamonds, not more than 30 micrometers in diameter, form on the surface of a solid support, such as a silicon wafer, set inside the microwave chamber.

The method, however, is far from ready for industrial application. The ideal conditions for producing diamonds have yet to be identified. Sometimes, for example, graphite and other types of carbon rather than diamonds are deposited, and depending on the position of the solid support, occasionally no deposit forms and silicon is etched away instead.
COPYRIGHT 1985 Science Service, Inc.
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 1985, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

Article Details
Printer friendly Cite/link Email Feedback
Title Annotation:semiconductor chips
Publication:Science News
Date:Jan 26, 1985
Previous Article:As comets strike their suns.
Next Article:Interstellar comets?

Related Articles
Megabit chip builders can't resist this.
Scientists form-fit diamond-like cloak.
A hard step toward diamond circuitry.
Diamond fever: new ways of coating just about anything with diamond may spawn a sparkling new industry.
Air-filled spaces make swifter chips.
New chip-making method may mold the industry. (Making A Little Impression).
Die attach goes mainstream: for IC deposition, printer platforms are supplanting dispensers on die bonders.
Bed liner maker picks up.
City gets option to buy 2 Broadway buildings.
Saw right through it.

Terms of use | Privacy policy | Copyright © 2019 Farlex, Inc. | Feedback | For webmasters