Printer Friendly

A PTH corner crack--or is it? Drilling may be behind 'false' gaps.

THE MICROSECTION IN FIGURE 1 was taken from the knee of a plated through-hole during board examination. The section shows a gap between the edge of the original copper foil and the through-hole copper plating. This is not a crack in the plating, however. Rather, there is resin smear on the copper foil edge, and the copper plating to the surface of the board and into the through-hole has simply covered the resin, giving the appearance of a crack or the copper folding. As resin smear is the most likely cause on the edge of the copper foil, a full review of the steps during and after drilling needs to be examined. Test sections taken after panel plating should be considered to demonstrate any improvements in the copper plating adhesion to the edge of the foil. Reference should be made to IPC-A-600 or internal company procurement standards.



DR. DAVIDE DI MAID is with the National Physical Laboratory Industry and Innovation division (;
COPYRIGHT 2009 UP Media Group, Inc.
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2009 Gale, Cengage Learning. All rights reserved.

Article Details
Printer friendly Cite/link Email Feedback
Comment:A PTH corner crack--or is it? Drilling may be behind 'false' gaps.(THE DEFECTS DATABASE)
Author:Maio, Davide Di
Publication:Circuits Assembly
Date:Nov 1, 2009
Previous Article:When icicles cool yields: resolving unwanted solder protrusions.
Next Article:5DX implementation on the production floor: setup isn't easy, but the tester is only as valuable as its implementation is correct.

Terms of use | Privacy policy | Copyright © 2019 Farlex, Inc. | Feedback | For webmasters