# 2004 IEEE MTT-S technical program.

TUESDAY, JUNE 8, 20048:00 TO 9:40 AM

TU1A ADVANCES IN LOW NOISE SILICON TECHNOLOGY & APPLICATIONS

Chair: F. Danneville * Co-chair: A. Riddle

This session takes silicon from basic CMOS technology to a bipolar receiver-on-a-chip. CMOS device noise performance is described in detail in the first two papers. The next two papers cover wideband applications of BiCMOS silicon and SiGe processes. Our session concludes with the presentation of a 12 GHz Digital Video Broadcast receiver.

TU1A-1: RF Noise Scaling Trend of MOSFETs from 0.5 [micro]m to 0.13 [micro]m Technology Nodes

M.-C. King, A. Chin, M.-T. Yang, C.-W. Kuo, Y. Chang.

TU1A-2: A Low Power DC-7.8 GHz BiCMOS LNA for UWB and Optical Communication

F. Ellinger, D. Barras, H. Jaeckel, M. Schmatz

TU1A-3: Noise Performance of 90 nm CMOS Technology

D. Becher, G. Banerjee, R. Basco, K. Kuhn, W.-K. Shih, C. Hung

TU1A-4: Student Paper: Ultra-Low Power, Low Noise and High Gain Wide Band Amplifier Using SiGe BiCMOS Technology

R. Chan, M. Feng

TU1A-5: A 12 GHz Heterodyne Receiver for Digital Video Broadcasting via Satellite Applications in Silicon Bipolar Technology

S. Smerzi, G. Girlando, A. Castorina, T. Copani, G. Palmisano

TU2A NONLINEAR DEVICE MODELING

Chair: R. Mallavarpu * Co-chair: G. Manes

This session deals with nonlinear modeling of pHEMTs, HBTs, GaN and LDMOS devices. The papers describe enhanced formulations and results for IMD and ACPR prediction in pHEMTs and GaN, as well as electro-thermal effects in HBTs and LDMOS.

TU2A-1: Enhanced Prediction of pHEMT Nonlinear Distortion Using a Novel Charge Conservative Model

M. Wren, T.J. Brazil

TU2A-2: A Symmetric and Thermally De-embedded Nonlinear FETM Model for Wireless and Microwave Applications

J. Wood, D. Root

TU2A-3: A New Physics-based Dynamic Electro Thermal Large Signal Model for RF LDMOS FETs

M. Versleijen

TU2A-4: Large-signal HBT Model Requirements to Predict Nonlinear Behaviour

M. Rudolph, R. Doerner

TU2A-5: Effects of Bias and Load Conditions on Dynamic Self Heating of Bipolar Transistors

S. Cherepko, J. Hwang, W. Curtice

TU2A-6: Student Paper: New Nonlinear Device Model for Microwave Power GaN HEMTs

P. Cabral, J. Pedro, N. Carvalho

TU3A THEORY AND DESIGN OF POWER DIVIDERS

Chair: C. Nguyen * Co-chair: A. Fathy

Five papers are presented in this session. The first paper covers a reconfigurable power-division technique using coupled lines or hybrid. The second paper describes a phase combiner for power amplifiers. The third paper presents a multi-way power divider with arbitrary terminating impedances. The fourth paper describes a planar compact multi-way power divider with very wide bandwidth. The fifth paper presents a design approach with approximate design formulas for a radial power combiner.

TU3A-1: Reconfigurable Power Divider and Combiner with Variable

K.T. Kim, J.H. Kang, D. Ahn, Y. Chung, T. Itoh

TU3A-2: 3-Way Low Loss Phase Combiner for Power Amplifier Sharing in 3-Sector Cellular Networks

C. Metz, T. Baras

TU3A-3: General Design Equations of N-Way Arbitrary Power Dividers

H.-R. Ahn, N.-H. Myung

TU3A-4: A Design of Multi-stage, Multi-way Microstrip Power Dividers with Broadband Properties

M. Kishihara, K. Yamane, I. Ohta, T. Kawai

TU3A-5: A Simplified Approach for the Design of Radial Power Combining Structures

A.E. Fathy, D. Kalokitis

TU4A SPATIAL POWER COMBINING AND QUASI-OPTICAL TECHNIQUES

Chair: K. Mizuno * Co-chair: J. Hacker

This section will present the latest advances in spatial power combining. Both amplifiers and oscillators will be presented with powers up to 10 Ws and frequencies ranging from X-band through W-band.

TU4A-1: A Single Chip Two-stage W-band Grid Amplifier

C.-T. Cheung, M. DeLisio, J. Rosenberg, R. Tsai, R. Kagiwada, D. Rutledge

TU4A-2: A Ka-band Grid Amplifier Module with Over 10 W Output Power

M. DeLisio, B. Deckman, C.-T. Cheung, S. Martin, D. Nakhla, E. Hartmann, C. Rollison, J.B. Pacetti, J. Rosenberg

TU4A-3: Student Paper: Dual Polarized Multibeam Spatial Power Combining System

A. Al-Zayed, L. Schulwitz, A. Mortazawi

TU4A-4: Power Combining by Means of Harmonic Injection Locking

M.R. Kuhn, E.M. Biebl

TU4A-5: Student Paper: An X-band Spatial Power Combiner Using a Planar Array of Stacked Patches for Bandwidth Enhancement

F.-C.E. Tsai, M.E. Bialkowski

TU5A MIXED SIGNAL CIRCUITS FROM 10 TO 144 GB/S

Chair: S. Marsh * Co-chair: J.P. Mattia

This session focuses on high speed mixed-signal circuits and building blocks for communications applications. Starting with a very fast ADC, we follow on with two papers concerning high data rate backplanes, and finish with two papers that push the state-of-the-art for multiplexing high speed data. These papers encompass a range of technologies from InP HBT and HEMT to submicron CMOS to FR-4.

TU5A-1: A 24 Gsps 3 Bit Nyquist ADC Using InP HBTs for Electronic Dispersion Compensation

H. Nosaka, M. Nakamura, M. Ida, K. Kurishima, T. Shibata, M. Tokumitsu, M. Muraguchi

TU5A-2: Student Paper: A 0.18 [micro]m CMOS Equalizer with Improved Multiplier for 4-PAM/20 Gbps Throughput Over 20-inch FR-4 Backplane Channel

M. Maeng, Y. Hur, S. Chandramouli, H. Kim, Y. Kumar, C. Chun, J. Laskar, F. Bien, E. Gebara

TU5A-3: 10 Gb/s Electrical Backplane Transmission Using Duobinary Signaling

J. Sinsky A. Adamiecki, M. Duelk

TU5A-4: DFF-Drivers ICs for 40 Gb/s ETDM in InP DHBT Technology

A. Konczykowska, F. Jorge, M. Riet, S. Blayac, J. Moulu, J. Godin

TU5A-5: 144 Gbit/s Selector and 100 Gbit/s 4:1 Multiplexer Using InP HEMTs

T. Suzuki, Y. Nakasha, T. Takahashi, K. Makiyama, T. Hirose, M. Takikawa

TU6A MICROWAVE SUPERCONDUCTING COMPONENTS AND CIRCUITS

Chair: M. Lancaster * Co-chair: C. Jackson

Microwave components have been produced from superconducting materials for well over a decade, the technology is mature and an industry has formed around it. This session highlights the latest superconducting component development, and although the applications are not new, the passive, microwave devices are. New types of filters, filter banks, delay lines and microwave spectroscopy sensors are discussed. All these devices use the extremly low loss of superconducting materials to achieve the ultimate in performance at frequencies ranging from 4 MHz to 20 GHz.

TU6A-1: Hilbert Fractal Curves for HTS Miniaturized Filters

M. Barra, C. Collado, J. O'Callaghan, J. Mateu

TU6A-2: An HTS Lumped-element Notch Filter

K. Dustakar, S. Berkowitz

TU6A-3: Switched Superconductive Filter-Banks

S.F. Peik, B. Jolley, R. Mansour

TU6A-4: Characterizing a Double Spiralled Meander Superconducting Microstrip Delay Line Using a Resonator Technique

H.T. Su, Y. Wang, F. Huang, M. Lancaster

TU6A-5: A Superconducting Microwave Power Limiter for High Performance Receiver Protection

J.C. Booth, K. Leong, S. Schima

TU6A-6: HTS Sensors for NQR Spectroscopy

C. Wilker, J.D. McCambridge, D.B. Laubacher, R.L. Alvarez, J.S. Guo, C.F. Carter, III, M.A. Pusateri, J.L. Schiano

1:20 TO 3:00 PM

TU1C ADVANCES IN LOW NOISE HEMT TECHNOLOGY

Chair: T. Cisco * Co-chair: M. Gupta

HEMT devices continue to be at the forefront of low-noise technology. Papers in this session report recent work on GaAs mHEMT, GaN HEMT and InP HEMT technologies targeted at low noise applications. Advances include reduced power dissipation, increased bandwidth, improved reliability, higher linearity and enhanced producibility.

TU1C-1: X-band GaAs mHEMT LNAs with 0.5 dB Noise Figure

M. Heins, J. Carroll, M.-Y. Kao, J. Delaney, C. Campbell

TU1C-2: Wideband AlGaN/GaN HEMT MMIC Low Noise Amplifier

G. Ellis, J. Moon, D. Wong, M. Micovic, P. Hashimoto, M. Hu

TU1C-3: High Performance and High Reliability InP HEMT Low Noise Amplifiers for Phased Array Applications

Y.-C. Chou

TU1C-4: Cryogenic 2-4 GHz Ultra Low Noise Amplifier

P.J. Starski

TU2C FREQUENCY CONVERSION AND SIGNAL CONTROL

Chair: B. Nelson * Co-chair: M. Madihian

This session highlights new mixers, multipliers and phase-shifters utilizing silicon and III-V based IC technologies.

TU2C-1: Student Paper: A DC-100 GHz Frequency Doubler in InP DHBT Technology

V. Puyal, A. Konczykowska, S. Blayac, F. Jorge, M. Riet, J. Godin, P. Nouet, S. Bernard

TU2C-2: A Highly Integrated Ka-band MMIC Quadrupler

K. Kamozaki

TU2C-3: A Frequency Doubler with High Conversion Gain and Good Fundamental Suppression

F. Gruson, H. Schumacher, G. Bergmann

TU2C-4: Student Paper: 40 and 60 GHz Frequency Doublers in 90 nm CMOS

M. Ferndahl, B.M. Motlagh, H. Zirath

TU2C-5: 60 GHz Band Intentional Low-leakage APDP Mixer for SSB Self-Heterodyne Transmitter Module

S. Kishimoto, K. Maruhashi, M. Ito, Y. Hamada, K. Ohata

TU2C-6: A Q-band Miniaturized Uniplanar MMIC HEMT Mixer

C.H. Chen, Y.-S. Lin, C.-H. Wang

TU2C-7: Student Paper: A Ku-band MOSFET Phase Shifter MMIC

H.D. Lee, D.-W. Kang, S. Hong, C.-H. Kim

TU3C NOVEL MICROWAVE AND MILLIMETER-WAVE COMPONENTS

Chair: T. Itoh * Co-chair: J. Taub

Novel components are presented in this session that address needs for high quality inductors and transformers for millimeter-wave and microwave ICs. This includes higher Q inductors for silicon ICs, wideband transformers operating up to 15 GHz and millimeter-wave inductors and transformers with self resonance frequencies greater than 100 GHz. The use of LH transmission lines to reduce the size of patch antennas and use of folding techniques to reduce the size of the waveguide resonators and filters.

TU3C-1: On-chip High-Q Cu Inductors Embedded in Wafer-level Chip-scale Package for Silicon RF Application

K. Itoi, M. Sato, H. Abe, T. Ito, H. Sugawara, H. Ito, K. Okada, K. Masu

TU3C-2: Integrated Transmission Line Transformer

J. Horn, G. Bock

TU3C-3: Student Paper: Si-based Inductors and Transformers for 30-100 GHz Applications

T. Dickson, M.-A. LaCroix, R. Beerkens, S. Boret, D. Gloria, S. Voinigescu

TU3C-4: Design of Compact Planar Antennas Using LH-Transmission Lines

M. Schuessler, J. Freese, R. Jakoby

TU3C-5: Compact Folded-waveguide Resonators

J.-S. Hong, J.-S. Hong

TU4C MILLIMETER-WAVE MMIC COMPONENTS AND SUBSYSTEMS

Chair: D. Choudhury * Co-chair: E. Niehenke

This session presents the latest state-of-the-art MMIC components and applications from the 70-125 GHz frequency range. A self-heterodyne transmission technique is used to develop a 70 GHz MMIC transceiver. MMIC components in this session also include SiGe HBT VCO and downconverter, pHEMT multipliers and power amplifiers, InP DHBT power amplifiers and subharmonically pumped resistive mixers using pHEMT process.

TU4C-1: High Receiving Sensitivity 70 GHz Band MMIC Transceiver: Application of Receiving Module Arrayed Self Heterodyne Technique

Y. Shoji, H. Ogawa

TU4C-2: SiGe-based Circuits for Sensor Applications Beyond 100 GHz

M. Steinhauer, H. Irion, M. Thiel, H.-O. Ruoss, M. Schott, W. Heinrich

TU4C-3: Design and Analysis of a W-band Multiplier Chipset

J. Lynch, E. Entchev, B. Lyons, A. Tessmann, H. Massler, A. Leuther, M. Schlechtweg

TU4C-4: W-band InP DHBT MMIC Power Amplifiers

G. Ellis, A. Kurdoghlian, R. Bowen, M. Wetzel, M. Delaney

TU4C-5: Design and Analysis of a Miniature W-band MMIC Subharmonically Pumped Resistive Mixer

M.-F. Lei, P.-S. Wu, T.-W. Hwang, H. Wang

TU5C DESIGN AND CHARACTERIZATION OF FERRITE AND FERROELECTRIC DEVICES

Chair: B. Elsharawy * Co-chair: B. York

This session presents papers on the design and modeling of ferrite and ferroelectric devices. Temperature compensation of ferrite circulators and ferroelectric phase shifters including lumped element implementations are presented, and novel concepts are discussed for the design of microstrip isolators. Modeling of ferroelectric varactors is discussed along with tunable integrated matching networks. A new configuration of absorbing materials is experimentally verified.

TU5C-1: Numerical Studies About the Temperature Compensation of Microwave Circulators

T. Lingel

TU5C-2: Lumped Element Isolator with Lower Symmetrical Configuration of Three Windings

S. Takeda, H. Mikami, Y. Sugiyama

TU5C-3: Nonreciprocal Left-handed Microstrip Lines Using Ferrite Substrate

M. Tsutsumi, T. Ueda

TU5C-4: A New Concept for Functional Electromagnetic Material for Microwave and Millimeter Use

Y. Kotsuka, M. Amano

TU5C-5: Student Paper: Design of Ferroelectric Phase Shifters for Minimum Performance Variation over Temperature

D. Kim, S.-S. Je, J.S. Kenney, P. Marry

TU5C-6: Analog Tunable Matching Network Using BST

L.-Y. Chen, R. Forse, D. Chase, R.A. York

TU5C-7: On-wafer Microwave Characterization of Ferroelectric Thin Film Phase Shifters

P.M. Suherman, T. Jackson, Y. Koutsonas, R. Chakalov, M. Lancaster

TU5C-8: Microwave Measurement and Modeling of Capacitors with Tunable Dielectric Constants

N. Cramer, L. Kammerdiner, E. Philofsky, T.S. Kalkur

TU6C MICROWAVE GENERATION BY OPTICAL TECHNIQUES

Chair: A. Madjar * Co-chair: T. Berceli

In recent years there has been a substantial advancement in the area of microwave low phase noise generation by use of optical techniques. The microwave sources that can be realized this way have substantially better phase noise compared to sources that are realized by the conventional microwave techniques (frequency multiplication, PLL, etc.). The big difference is manifested particularly at higher frequencies, and in particular at millimeter-waves. The initial idea and first optoelectronic microwave oscillator was first published by Maleki and Yao from JPL. Since then, much improvement has been made. The purpose of this focused session is to present the ongoing research in this area and the state of the art.

TU6C-1: THz Photomixing Employing Traveling-wave Photodetectors

A. Stoehr

TU6C-2: Microwave Vector Modulation and Arbitrary Waveform Generation Using Optical Techniques

A. Leven, J. Lin, J. Lee, U.-V. Koc, K.-Y. Tu, Y. Baeyens, Y.-K. Chen

TU6C-3: Optical Generation of Microwave Signals Based on an Unbalanced Fiber Loop Mirror

C. Schaeffer, I. Gonzales

TU6C-4: Progress in the Opto-Electronic Oscillator--A Ten Year Anniversary Review

S. Yao

TU6C-5: Improving the Frequency Stability and Phase Noise of Opto-electronic Oscillators by Harmonic Feedback

T. Banky, T. Berceli, B. Horvath

TU6C-6: Microwave Generation by Active Self Mode Locking of a Nd: YV04/MgO:LiNb03 Microchip Laser

A. Madjar

3:30 TO 5:10 PM

TU1D METAMATERIALS: LEFT-HANDED MATERIALS AND TRANSMISSION LINES

Chair: A.A. Oliner * Co-chair: J. Zebentner

The papers in this session deal with distributed structures that have left-handed or double-negative materials. The papers include backward leaky-wave antennas and transmission lines that are nonlinear or electronically controlled.

TU1D-1: A Via-free Microstrip Left-handed Transmission Line

A. Sanada, K. Murakami, S. Aso, H. Kubo, I. Awai

TU1D-2: Student Paper: Leaky-waves in a Metamaterial-based Two-dimensional Structure for a Conical Beam Antenna Application

C. Allen

TU1D-3: Student Paper: The Nature of Radiation From Leaky Waves on Single-and Double-negative Metamaterial Grounded Slabs

P. Baccarelli, P. Burghignoli, F. Frezza, A. Galli, P. Lampariello, G. Lovat, S. Paulotto

TU1D-4: Student Paper: Electronically-controlled Metamaterial-based Transmission Line as a Continuous-scanning Leaky-wave Antenna

S. Lim, C. Caloz, T. Itoh

TU1D-5: Nonlinear Transmission Lines in Left-handed Media

A. Kozyrev, D. van der Weide

TU3D DIRECTIONAL COUPLER TECHNIQUES

Chair: J. Owens * Co-chair: C. Buntschuh

The inexorable drive toward miniaturization of RF and microwave circuits exerts profound pressure on size-reduction schemes for passive components. This session presents three papers on methods to reduce the size of directional couplers, and one to combine a filtering function within the coupler geometry. Finally, we have a contribution of a new method for providing tighter coupling in a stripline coupler.

TU3D-1: Design of Fractal Rat-Race Coupler

H. Ghali, H. Ragai, T.A. Moselhy

TU3D-2: A Novel Compact Multi-layer MMIC CPW Branchline Coupler Using Thin-film Microstrip Stub Loading at 44 GHz

K. Hettak, M.G. Stubbs, G.A. Morin

TU3D-3: Miniaturized 90[degrees] K Hybrid Circuit Using Quasi-distributed TFMS Line

T. Tanaka, M. Aikawa, K. Nishikawa

TU3D-4: Design of a 90[degrees] Hybrid Coupler with Harmonic Rejection Characteristic

S.-Y. Lee, D. Ahn, Y. Chung, T. Itoh

TU3D-5: Series Configuration of Multi-line Directional Coupler Sections with Improved Coupling

H. Schmiedel

TU4D MILLIMETER-AND SUBMILLIMETER-WAVE COMPONENTS AND TECHNOLOGY

Chair: R. Emrick * Co-chair: J. Wiltse

A wide range of important components and technologies will be discussed for millimeter- and submillimeter-wave systems. Areas of discussion will include micromachining for power combining and filter applications, millimeter-wave printed antenna techniques in addition to THz source technology.

TU4D-1: Student Paper: A Precision Micromachining Technique for the Fabrication of Hybrid Millimeter-wave Circuits and Subassemblies

W.H. Chow, A. Champion, D.P. Steenson

TU4D-2: Student Paper: Micromachined Millimeter-wave Power Combining Module

Y. Lee, J. East, L. Katehi

TU4D-3: Periodic Filters for Performance Enhancement of Millimeter-wave Microstrip Antenna Arrays

E. Channabasappa, R. Anderson, F. Kolak

TU4D-4: Millimeter-wave Corrugated Tapered-slot Antennas

M. Palacios, R. Judaschke

TU4D-5: Student Paper: Terahertz-emitting Devices Based on Boron-doped Silicon

R.T. Troeger, T.N. Adam, S.K. Ray, P. Lv, S. Kim, G. Xuan, S. Ghosh, J. Kolodzey

TU4D-6: Novel Possibilities for Coherent Radiation Sources

Y. Hussein, J. Spencer

TU5D MICROWAVE ACOUSTIC DEVICES

Chair: R. Weigel * Co-chair: S. Stitzer

This session deals with the latest developments in surface and bulk acoustic (SAW and BAW) devices and their microwave applications. Field theory based simulations, design and charcterization issue are addressed. Balanced film bulk acoustic resonator (FBAR) filters and concepts of monolithic integration are presented.

TU5D-1: Bulk Acoustic Wave Filters for GPS with Extreme Stopband Attenuation

M. Handtmann, S. Marksteiner, J. Kaitila, R. Aigner

TU5D-2: Student Paper: Proposal of a New Landing Area for SAW RF Filters in Wireless Applications Ensuring Precisely Predictable Filter Characteristics

H. Bilzer, F.M. Pitschi, J.E. Kiwitt, K.C. Wagner, W. Menzel

TU5D-3: Student Paper: New Modeling of TFBAR and On-Wafer Inductor Effects on the TFBAR Ladder Filter Performance

J.-S. Kim, J.-G. Yook, M.-G. Gu

TU5D-4: Electromagnetic Modeling of Thin-film Bulk Acoustic Resonators

M. Farina, T. Rozzi

TU5D-5: Voltage Controlled SAW Filters on 2DEG AlGaN/GaN Heterostructures

J. Grajal, F. Calle, J. Pedros, T. Palacios

TU5D-6: Balanced Lattice-Ladder Bandpass Filter in Bulk Acoustic Wave Technology

H.K. Jan ten Dolle, A. Tuinhout, J. Foekema, J.-W. Lobeek

TU5D-7: Integration of Bulk Acoustic Wave Filters: Concepts and Trends

L. Elbrecht, R. Aigner, C.-I. Lin, H.-J. Timme

TU6D NUMERICAL MODELING FOR RF/MICROWAVE PHOTONIC APPLICATIONS

Chair: K. Goverdhanam * Co-chair: A. Gopinath

Microwave photonic devices have very important applications in high speed broadband communication systems. The physics of these devices is based on a broad range of topics including electromagnetic and semiconductor physics. Numerical modeling/simulations play a very important role not only in designing but also in understanding the underlying device physics. This focus session will cover a broad range of topics pertaining to numerical modeling of RF/microwave photonic components and systems.

TU6D-1: Student Paper: Characteristics of InP HEMT Harmonic Optoelectronic Mixers and Their Application to 60 GHz Radio-on-Fiber Systems

C.-S. Choi, H.-S. Kang, W.-Y. Choi, D.-H. Kim, K.-S. Seo

TU6D-2: Student Paper: All Optical Harmonic Frequency Up-conversion for a WDM Radio Over Fiber System

H.-J. Song, J.S. Lee, J.-I. Song

TU6D-3: Global EM and Thermal Analysis of a 40 Gb/s All Integrated Optoelectronic Transmitter Module

B. Thon, D. Baillargeat, S. Verdeyme, R. Lefevre

TU6D-4: Student Paper: Performance Analysis of MMoF Systems Considering Laser Phase Noise under Rician Fading

C. Yun, T.-S. Cho, S. Sung, K. Kim

TU6D-5: Student Paper: Effect of Laser and RF Oscillator Phase Noises

T.-S. Cho

WEDNESDAY, JUNE 9, 2004

8:00 TO 9:40 AM

WE1A MEMS FILTERS

Chair: N.S. Barker * Co-chair: P. Blondy

For years, micromachining techniques have been used to enable integrated low-loss microwave and millimeter-wave circuits. This session presents the application of these techniques to high-Q filters, tunable filters, and millimeter-wave integrated coaxial lines. Two of the presented fabrication techniques, new to the microwave symposium, are laser-based polymer stereolithography and a multi-layer microforming process.

WE1A-1: Student Paper: Laser-based Polymer Stereolithography of Vertically Integrated Narrow Bandpass Filters Operating in K-band

X. Gong, L. Katehi, Wi. Chappell

WE1A-2: A Widely Tunable RF MEMS End-coupled Filter

G.M. Kraus, C. Nordquist, C. Dyck, A. Muyshondt, C. Sullivan, C. Goldsmith, P. Finnegan, F. Austin, IV

WE1A-3: High-Q Evanescent-mode Filters Using Silicon Micromachining and Polymer Stereolithography (SL) Processing

X. Gong, A. Margomenos, B. Liu, W. Chappell, L. Katehi

WE1A-4: Student Paper: A Horizontally Integrated Micromachined Filter

L.L. Harle, L. Katehi

WE1A-5: A 60 GHz Branch Line Coupler Fabricated Using Integrated Rectangular Coaxial Lines

J. Reid, R. Webster

WE2A FILTER SYNTHESIS TECHNIQUES

Chair: M. Yu * Co-chair: J. Modelski

This session covers advanced techniques for microwave filter synthesis.

WE2A-1: New Cascaded Trisections with Resonant Cross-Couplings (CTR Sections) Applied to The Design of Optimal Filters

R. Levy

WE2A-2: A Versatile Prototype for the Accurate Design of Homogeneous and Inhomogeneous Wide Bandwidth Direct-Coupled-Cavity Filters

P. Soto, V.E. Boria

WE2A-3: Student Paper: Analytical Synthesis of Microwave Multiport Networks

A. Garcia-Lamperez, M. Salazar-Palma, T.K. Sarkar

WE2A-4: A Third Order In-line Filter with a Transmission Zero Extracted at Its Center

S. Amari, U. Rosenberg

WE2A-5: Dimensional Synthesis for Wideband Waveguide Filters

F.M. Vanin, D. Schmitt, R. Levy

WE2A-6: A Prototype for the Design of Planar Waveguide Filters, Also Containing Transmission Zeros, with Close Correspondence to the Physical Structure

A. Morini, G. Venanzoni, N. Iliev

WE3A NOVEL. PACKAGING TECHNIQUES I

Chair: W. Heinrich * Co-chair: R. Drayton

Packaging techniques discussed in the session include the use of molded compounds at millimeter-wave frequencies, wideband millimeter-wave transitions, wafer-level packaging and stereolithography.

WE3A-1: 1 W Ku-band Power Amplifier MMICs Using Low-cost Quad-flat Plastic Package

A. Bessemoulin

WE3A-2: A 29 GHz Frequency Divider in a Miniaturized Leadless Flip-Chip Plastic Package

M. Engl, K. Pressel, J. Dangelmaier. H. Theuss, W. Eurskens, H. Knapp, W. Simbuerger, R. Weigel

WE3A-3: Layer-by-Layer Polymer Stereolithography Fabrication for Three-Dimensional RF Components

B. Liu, W. Chappell, X. Gong

WE3A-4: 120 GHz Broadband Chip-Interconnects for High Bit-Rate Communication Systems

F.J. Schmueckle, P. Talukder, W. Heinrich

WE3A-5: Student Paper: Ultra-Wideband Silicon Through-Wafer Transmission Lines

D.T. Kollmann, R. Drayton

WE3A-6: Wafer-Level-Package for Bulk Acoustic Wave (BAW) Filters

M. Franosch, K.G. Oppermann, A. Meckes, W. Nessler, R. Aigner

WE4A GUIDED WAVES: STRUCTURES AND EFFECTS

Chair: A. Omar * Co-chair: D.R. Jackson

This session will focus on interesting guided-wave structures, physical effects, and related analytical or computational modeling. Topics include leaky waves in 3D planar interconnects, conductor-backed slotline, mode suppression in NRD guides, high-frequency circuit models, and improved computational methods.

WE4A-1: Leaky Wave Excitation on Three-Dimensional Printed Interconnects

G. Hanson, A. Yakovlev

WE4A-2: A High Frequency Equivalent Circuit for a Gap Source on a Microstrip Line

F. Mesa, R. Rodriguez-Berral, D. Jackson

WE4A-3: Dispersion Characteristics of the Dominant Mode on a Completely Shielded Conductor-Backed Slotline

J. Zehentner, J. Machac, J. Mrkvica

WE4A-4: Analysis of Guided Modes in Vertical Strip Line Embedded in an NRD Guide and Its Application to Design of LSE Mode Suppressor

F. Kuroki, M. Kimura, T. Yoneyama

WE4A-5: Analysis of Uniplanar Electromagnetic Band-Gap (EBG) Structures by the MoM/BI-RME Method

M. Bozzi, S. Germani, L. Minelli, L. Perregrini

WE5A HIGH-POWER AMPLIFIERS FOR COMMUNICATIONS APPLICATIONS

Chair: J. Komiak * Co-chair: S. Cripps

This session defines the state-of-the-art in high power amplifier components. The first paper describes a 20 W, 65 percent PAE C-band IMFET. In the second paper, a 240 W Doherty amplifier at 2 GHz for WCDMA is described. Analysis and design of a 200 W LDMOS Doherty follows in the next paper. A highly efficient Doherty amplifier for CDMA is then described. The next paper follows the developemnt of a high-efficiency feedforward linearized Doherty amplifier at 45 W. The final paper extends InGaP HBT techniques up to 25 W and exposes the importance of low supply impedances at envelope frequencies.

WE5A-1: Over 65 percent Efficiency 300 MHz Bandwidth C-band Internally-matched GaAs FET Desgined with a Large-signal FET Model

H. Otsuka, K. Mori, H. Yukawa, H. Minamide, T. Tsunoda, S. Ogura, Y. Ikeda, T. Takagi, Y. Kittaka

WE5A-2: A 240 W Doherty GaAs Power FET Amplifier with High Efficiency and Low Distortion for W-CDMA Base Stations

I. Takenaka, H. Takahasbi, K. Ishikura, K. Hasegawa, K. Asano, M. Kanamori

WE5A-3: Analysis and Design of a 200 W LDMOS Based Doherty Amplifier for 3G Base Stations

J.R. Gajadharsing

WE5A-4: Highly Efficient Power Amplifier for CDMA Base Stations Using Doherty Configuration

J. Cha, J. Kim, B. Kim, J. Sung Lee, S.H. Kim

WE5A-5: High Efficiency Feed-forward Amplifier Using RF Predistortion Linearizer and the Modified Doherty Amplifier

T. Ogawa, T. Iwasaki, H. Maruyama, Y. Ikeda, H. Kurebayashi, K. Horiguchi, M. Nakayama

WE5A-6: Linearity Improvement of Multi-watts 24-28 V InGaP/GaAs HBT by Low Frequency Low Source Impedance Matching

N. Wang

WE6A ADVANCES IN WIRELESS COMMUNICATIONS TECHNOLOGIES

Chair: P. Heide * Co-chair: B.D. Geller

This session presents technology in two areas: Front-end Module (FEM) integration and wireless transceiver design for cellular and WLAN. The FEM papers present advanced solutions based upon low temperature co-fired ceramics (LTCCs) and liquid crystal polymer (LCP) substrates for system on package (SOP) applications. The wireless transceiver papers cover single package WLAN receiver with integrated antenna, InGaP/GaAs HBT MMICs with on-chip matching, and dual band transmitters for software-defined radio (SDR).

WE6A-1: Student Paper. Dual-band Transmitters of Using Digitally Predistorted Frequency Multipliers for Software Defined Radios

Y. Park, R. Melville, R.C. Frye, M. Chen, J. Stevenson Kenney

WE6A-2: InGaP/GaAs HBT MMICs for 5 GHz Band Wireless Applications: A High PIdB, 23/4 dB Step-Gain Low-Noise Amplifier and a Power Amplifier

K. Yamamoto, S. Suzuki, N. Ogawa, T. Sbimura, K. Maemura

WE6A-3: Single-Package Direct-Conversion Receiver for 802.11a Wireless LAN Enhanced with Fast Converging Digital Compensation Techniques

B. Come, D. Hauspie, W. Diels, W. Eberle, J. Ryckaert, J. Tubbax, S. Donnay, Desics, G. Albasini, S. Brebels, W. de Raedt, H. Minami

WE6A-4: Student Paper: Novel Small Size LTCC-Based WLAN Frontend Modules with Integrated Power Amplifiers

A. Chernyakov, K. Markov, A. Kryshlopin, D. Orlenko, S. Royak, R. Kravchenko, A. Gordiyenko, T. Kerssenbrock, G. Sevskiy, P. Heide

WE6A-5: A Miniaturized LTCC Multi-layered Front-end Module for Dual Band WLAN (802.11a/b/g) Applications

Y.-J. Ko

WE6A-6: Student Paper: RF and mm-Wave SOP Module Platform Using LCP and RF MEMS Technologies

S. Sarkar, V. Palazzari, G. Wang, N. Papageorgiou, D. Thompson, J.H. Lee, S. Pinel, M.M. Tentzeris, J. Papapolymerou, J. Laskar

10:00 AM TO 12:00 PM

WEIB RF MEMS SWITCHES

Chair: T. Weller * Co-chair: N. Hoivik

The papers in this session discuss recent developments in the design and fabrication of RF MEMS switches. Topics include shunt switch designs with air insulators, high contact-force designs, and lateral contact designs. Other papers describe the use of piezoelectric actuators and switches designed for waveguide.

WE1B-1: Dielectric Less Capacitive MEMS Switches

P. Blondy, A. Crunteanu, C. Champeaux, A. Catherinot, P. Tristant, O. Vendier, J.L. Cazaux, L. Marchand

WE1B-2: Student Paper: A Low-voltage High Contact Force RF-MEMS Switch

N. Nishijima, J.-J. Hung. G. Rebeiz

WE1B-3: Student Paper: A Single-pole Double-throw (SPDT) Circuit Using Deep Etching Lateral Metal-contact Switches

M. Tang, P. Win, W.L. Goh, L.C. Law, A.Q. Liu, A. Agarwal

WE1B-4: Silicon Bulk Micromachined RF MEMS Switches with 3.5 V. Operation by Using Piezoelectric Actuator

H.C. Lee, J.Y. Park, K.H. Lee, H.J. Nam, J.U. Bu

WE1B-5: RF MEMS Waveguide Switch

M. Daneshmand, R. Mansour, N. Sarkar

WE2B FILTER REAIJZATIONS

Chair: R.V. Snyder * Co-chair: H.C. Bell

Papers in this session contain practical implementations and applications of modern synthesis techniques.

WE2B-1: A Third Order Ridge Waveguide Filter with Parallel Coupled Resonators

G. Goussetis, A. Feresidis, J. Vardaxoglou, D. Budimir

WE2B-2: Bandstop Filters Using Dielectric Loaded Evanescent Mode Resonators

R.V. Snyder, S. Shin

WE2B-3: Full-Wave Design of Canonical Ridge Waveguide Filters

J.A. Ruiz-Cruz, J. Rebollar, M.E. Sabbagh, K. Zaki

WE2B-4: Wideband Lumped Element Equivalent Circuit Model for Waveguide Slots and Applications

I. Eshrah, A. Kishk, A. Yakovlev, A. Glisson, C. Smith

WE2B-5: Computer-Aided Design of In-line Resonator Filters with Multiple Elliptical Apertures

P. Kozakowski, A. Lamecki, M. Mrozouski, M. Mongiardo, C. Tomassoni

WE2B-6: An Extremely Wideband Ridge Waveguide Filter

Z.M. Liu, K. Zaki, J. Ruiz-Cruz, C. Wang

WE2B-7: Half-wave Dielectric Rod Resonator Filter

M. Yu, D. Smith, M. Ismail

WE3B NOVEL PACKAGING TECHNIQUES II

Chair: Mark Gouker * Co-chair: B. Allen

Packaging techniques discussed in the session include highly integrated LTCC applications, LTCC implementation techniques, and a low-cost plastic packaging approach.

WE3B-1: Student Paper: Ku-band Power Combiner Composed of Metal-Plated Plastic Waveguide Hybrid

H. Asao, K. Henmi, M. Mukuda, N. Yoneda

WE3B-2: Full RF Module with Embedded Filters for 2.4 and 5 GHz Dual Band WLAN Applications

K Matsuge, S. Hiura, M. Ishida, T. Kitahara, T. Yamamoto

WE3B-3: Design of an LTCC Tri-band Transceiver Module for GPRS Mobile Applications

C.H. Chen, Y.-S. Lin

WE3B-4: Student Paper: Novel Cylindrical High-Q LTCC Resonators for Millimeter-wave Applications

A. El-Tager, L. Roy

WE3B-5: Simple Design Formula for Parallel Plate Mode Suppression by Ground

T. Yuasa, T. Nishino, H. Oh-hashi

WE3B-6: A Displacement-error Monitor of a Multi-layer LTCC Module

T. Nishino, H. Oh-bashi, T. Takagi

WE4B REMOTE SENSING AND MEASUREMENT SYSTEM

Chair: I. Gresham * Co-chair: G. Hopkins

This session presents recent advances in remote sensing and position measurement systems. A variety of technologies for widely differing applications is covered.

WE4B-1: Prospects for Industrial Remote Temperature Sensing Using Microwave Radiometry

K.D. Stephan, E. Ryza, J. Pearce, L. Wang

WE4B-2: A New Technology for Precise Local Position Measurement--LPM

A. Stelzer, A. Fischer, M. Vossiek

WE4B-3: Student Paper: The "Smart" Diaper Moisture Detection System

J. Siden A. Koptioug, M. Gulliksson

WE4B-4: Student Paper: Millimeter-wave Doppler Velocimetry for Low-Velocity Measurement

S. Kim, C. Nguyen

WE5B NEW DEVELOPMENTS IN LINEAR AMPLIFIER LINEARIZATION

Chair: K. Ikossi * Co-chair: A. Katz

The need to transmit larger amounts of information over a limited bandwidth has created a demand for greater amplifier linearity. This session presents some of the latest developments in power amplifier linearization. The papers cover both analog and digital linearization technologies and include predistortion, feed forward and feedback approaches.

WE5B-1: Student Paper: Power Amplifier Linearization with Digital Pre-Distortion and Crest Factor Reduction

R. Sperlich, Y. Park, J.S. Kenney, G. Copeland

WE5B-2: A Vector-Locked Loop for Power Amplifier Linearization

R. Kaunisto

WE5B-3: Student Paper: Predistortion Linearization System or High Power Amplifiers

W. Woo, J.S. Kenney

WE5B-4: Implementation of an Adaptive Digital/RF Predistorter Using Direct LUT Synthesis

S. Boumaiza, J. Li, F.M. Ghannouchi

WE5B-5: Student Paper: A Novel Amplifier Linearization Technique Using an Anti-Parallel Reconfigurable Transistor (ART) Pair

T.Y. Yum, Q. Xue, C.H. Chan

WE5B-6: Student Paper: A Varactor Diode-based Predistortion Circuit

N. Gupta, A. Tombak, A. Mortazawi

WE6B LINEAR DEVICE MODELING

Chair: W. Struble * Co-chair: J.S. Atherton

This session includes a variety of papers in the area of linear modeling. Two papers present techniques for active modeling including substrate effects in Si MOSFETs and estimation of statistical variation in FET parameters. An implementable space mapping design framework will be presented followed by two papers showing model reduction techniques applied to transmission line and high frequency subnetworks.

WE6B-1: Student Paper: Statistical Estimation of Small-Signal FET Model Parameters and Their Covariance

K. Andersson, C. Fager, P. Linner, H. Zirath

WE6B-2: Student Paper: A New Analytical Scalable Substrate Network Model for RF MOSFETs

N. Srirattana, H.-M. Park, P. Allen, J. Laskar, D. Heo, A. Raghavan

WE6B-3: Student Paper: An Implementable Space Mapping Design Framework

J. Bandler, Q. Cheng, D. Gebre-Mariam, N. Nikolova

WE6B-4: Student Paper: A Methodology for Generating Compact Passive Macromodels for High-Frequency Interconnect and Microwave Subnetworks

D. Saraswat, R. Achar, M. Nakhla

WE6B-5: Transmission Line Networks Transmission Line Networks Using Model-Reduction Techniques

P. Gugupudi, R. Khazaka, D. Saraswat, M. Nakhls

1:20 TO 3:00 PM

WE1C RECONFIGURABLE NETWORKS

Chair: J.C. Chiao * Co-chair: J. Muldavin

This session presents RF MEMS reconfigurable impedance networks, phase shifters and NxN switch matrices with low-loss performance. Of particular importance is a band-switchable power amplifier with less than 60 percent and less than 1 W power handling at 850-1900 MHz.

WE1C-1: Novel Band-switchable High Efficiency Power Amplifier Employing RF-MEMS Switches

A. Fukuda, H. Okazaki, Y. Yamao, T. Hirota

WE1C-2: Student Paper: A 20-50 GHz Reconfigurable Matching Network for Power Amplifier Applications

T. Vaba-Heikkila, G. Rebeiz

WE1C-3: A Novel MEMS LTCC Switch Matrix

B Yassini, S Choi, A. Zybura, M. Yu, R. Mihailovich, J. DeNatale

WE1C-4: Student Paper: MEMS Phase Shifters Using Cascaded Slow-Wave Structures for Improved Impedance Matching and/or Phase Shift

B. Lakshminarayanan, T. Weller

WE1C-5: Student Paper: A Reconfigurable 6-20 GHz RF MEMS Impedance Tuner

T. Vaba-Heikkila, J. Varis, J. Tuovinen, G. Rebeiz

WE2C INNOVATIONS IN BROADBAND COMMUNICATIONS AND RADARS

Chair: R. Gupta * Co-chair: L. Raffaelli

This session focuses on recent advancements in broadband communications and radars. The first three presentations address communications topics ranging from a 60 GHz highly integrated receiver, a cognitive radio, to a compensation technique for an OFDM transmitter. The second part of the session addresses advances in radar systems including a leakage cancellation technique for FMCW radar, a noise-correlating radar and a TWTA phase-noise reduction technique.

WE2C-1: A Single-Planar Integrated Self-Heterodyne Receiver with a Built-in Beam-Steerable Array Antenna for 60 GHz Band Video Transmission Systems

T. Hiroki, T. Ohira

WE2C-2: Online Modeling of Wireless Channels with Hidden Markov Models and Channel Impulse Responses for Cognitive Radios

T. Rondeau, C. Rieser, T. Gallagher, C. Bostian

WE2C-3: OFDM LINC Transmitter with Digital I/Q Imbalance Compensation

A. Azirar

WE2C-4: Student Paper: A Digital Leakage Cancellation Scheme for Monostatic FMCW Radar

K. Lin, R.H. Messerian, Y. Wang

WE2C-5: First Demonstration of a Retrodirective Noise-Correlating Radar in S-band

E. Brown, A. Cotler, A. Umali, S. Gupta

WE2C-6: Student Paper: Phase Noise Reduction Techniques of Radar's TWTA

J.S. Lee, N.C. Lubmann, Jr., Y. Goren

WE3C NUMERICAL MODELING FOR RF/MICROWAVE PHOTONIC APPLICATIONS

Chair: K. Goverdhanam * Co-chair: A. Gopinath

Microwave photonic devices have very important applications in high speed broadband communication systems. This Focus Session addresses numerical modeling that plays an important role in the design and understanding of the underlying device physics.

WE3C-1: Synthesis of Optical Directional Coupler Modulators with Linear Response

R.T. Schermer, J. Oh, K-H. Baek, A. Gopinath

WE3C-2: Invited: Numerical Methods for Microwave Photonics

A. Rahman, K. Grattan, S. Obayya

WE3C-3: Large Signal E/O Modeling of Traveling Wave Electroabsorption Modulators in an RF Circuit CAD Environment

E Cappelluti, A. Mela, M. Pirola, G. Ghione

WE3C-4: Numerical Modeling of Segmented Traveling Wave Electroabsorption Modulators

G.L. Li, P. Yu

WE3C-5: Numerical Modeling and Analysis of Optical Response of Electro-optic Modulators

Y.A. Hussein, M. Tomeh, S. El-Ghazaly

WE3C-6: Accurate Time Domain Analysis of Micrwave and Optical Signal Interaction in Electro-Optic Devices

A. Di Donato, D. Mencarelli, T. Rozzi

WE4C NONLINEAR SYSTEM AND DEVICE MODELING

Chair: T. Brazil * Co-chair: K. Remley

This session considers nonlinear modeling activities for microwave components at the system and device levels. It addresses all aspects of behavioral model development of devices and systems, from the model extraction procedure and its format, to the prediction of nonlinear distortion effects.

WE4C-1: Student Paper: Analysis of Cross Modulation in W-CDMA Receivers

V. Aparin, L. Larson

WE4C-2: Designing Band-Pass Multisine Excitations for Microwave Behavioral Model Identification

J. Pedro, N. Carvalho

WE4C-3: A Metric for Assessing the Degree of Device Nonlinearity and Improving Experimental Design

D. Schreurs, K.U. Leuven; K.A. Remley, D.F. Williams

WE4C-4: Student Paper: Charge Trapping and Intermodulation in HEMTs

J. Brinkhoff, A. Parker

WE4C-5: Contribution of Self Heating to Intermodulation in FETs

A. Parker, J. Rathmell

WE5C GAAS AND GAN HEMTS AND MONOLITHIC ICS

Chair: T. Tokumitsu * Co-chair: H.A. Hung

This session presents advances in the GaN and GaAs technologies. High voltage (26-28 V) PHEMT power performance will be presented. In addition, recent results in PHEMT vector modulator and transimpedance MMICs will also be discussed. The presentation will be followed by new accomplishments in GaN power and low-noise devices and technologies.

WE5C-1: Broadband SDLVA, SGA, SDGVGA and Vector Modulator Elements for Intelligent RF Microsystems

J.J Komiak

WE5C-2: A 73 GHz, 180 Ohm pHEMT Transimpedance Amplifier Employing GM Tapering for OC768 Optical Receivers

R.A. Fratti, K. Hui

WE5C-3: A High Power Density 26 V GaAs pHEMT Technology 1

B. Green, E. Lan, P. Li, O. Hartin, C. Gaw, M. CdeBaca, E. Johnson, W. Knappenberger, J. Kim, L.S. Klingbeil, P. Fisher, M. Miller, G. Weitzel

WE5C-4: A High Gain L-band GaAs FET Technology for 28 V Operation

K. Inoue, M. Nagabara, N. Ui, H. Haematsu, S. Sano, J. Fukaya

WE5C-5: Student Paper: Single-Tone and Two-Tone Time Domain Large Signal Characterization of GaN HEMTs Operated in Class A

P. McGovern, D. Williams, P. Tasker, J. Bennedikt, J. Powell, K.P. Hilton, R.S. Balmer, T. Martin, T. Martin, M.J. Uren

WE5C-6: Wideband AlGaN/GaN HEMT Low Noise Amplifier for Highly Survivable Receiver Electronics

J.M. Yang

WE5C-7: Performance of AlGaN/GaN HFETs Fabricated on 100 mm Silicon Substrates for Wireless Base Station Applications

W. Nagy, S. Singhal, A. Vescan, R. Borges, J.W. Johnson, P. Rajagopal, R.J. Therrien, A.W. Hanson, J.D. Brown

WE5C-8: Initial Reliability Investigation of GaN-Based Power Transistors for Wireless Infrastructure Applications

S. Peters, S. Singbal, A. Chaudhari, T. Li, R. Nichols, R. Therrien, J. Brown, R. Borges, A. Vescan

WE6C POWER AMPLIFIER ENHANCEMENT TECHNIQUES

Chair: F. Sechi * Co-chair: J. Staudinger

Modern communications systems continue to drive the need for highly linear and more efficient power amplifiers, especially for infrastructure transmitters. This session will focus on advancements in Doherty amplifier techniques, circuit techniques applied to push-pull structures, pre-distortion linearizers, and dual-power level concepts.

WE6C-1: Efficiency Enhancement on Doherty Amplifier with Combination of Class-F and Inverse Class-F Schemes for S-band Base Station Amplifiers

S. Goto, T. Kunii, K. Izawa, A. Inoue, T. Ishikawa, Y. Matsuda

WE6C-2: High Efficiency Power Amplifier Input/Output Circuit Topologies for Base Station and WLAN Applications

M. Akkul, M. Roberts, V. Walker, W. Bosch

WE6C-3: RF High Power Doherty Amplifier for Improving the Efficiency of a Feedforward Linear Amplifier

K.-J. Cho, J.-H. Kim, S.P. Stapleton

WE6C-4: Design of the Doherty Amplifier with Push-pull Structure Using Balun Transformer

H.T. Jeong, M.H. Yeon, I.S. Chang, S.W. Kim

WE6C-5: Pre-distortion Linearizer Module Using InGaP-HBT Based MMIC

T. Hashinaga, T. Hashinaga

WE6C-6: Student Paper: Efficiency-Enhancing Technique: LDMOS Power Amplifier Using Dual-Mode Operation Design Approach

Y. Chung, Y. Wang, D. Ahn, T. Itoh

3:30 TO 5:00 PM

WEID RF VARACTORS AND INDUCTORS

Chair: V. Lubecke * Co-chair: J. Papapolymerou

In this session new implementations are explored to create high performance micomechanical RF varactors and micromachined inductors.

WE1D-1: An Improved Design for Parallel Plate MEMS Variable Capacitors

M. Bakri-Kassem, R. Mansour

WE1D-2: Low Cost Highly Reliable Analog MEMS Varactors

D. Peroulis, L. Katehi, Y. Lu

WE1D-3: Student Paper: A Tunable Capacitor Using An Immiscible Bifluidic Dielectric

S.-O. Choi, Y.-K. Yoon, M. Allen, A. Hunt

WE1D-4: Student Paper: High-Q Integrated 3-D Inductors and Transformers for RFIC Applications

D.-H. Weon, J.-H. Jeon, J.-I. Kim, S. Mohammadi, L Katehi

WE1D-5: Student Paper: Micromachined On-Chip High-Aspect Ratio Air Core Solenoid Inductors for Multi-GHz Applications

H.M. Lu

WE2D HF, VHF AND UHF TECHNOLOGY ADVANCES

Chair: M. Eron * Co-chair: R. Caverly

This session reports on advances in high-efficiency amplifiers and splitter/combiner networks used in their implementation.

WE2D-1: Split-band Modulator for Kahn Technique Transmitters

F.H. Raab

WE2D-2: Output Power Capability of Class-E Amplifiers with Nonlinear Shunt Capacitance

P.M. Gaudo, C. Bernal, A. Mediano

WE2D-3: A Base Control Doherty Power Amplifier for Improved Efficiency in GSM Handsets

D.W. Ferwalt, A. Weisshaar

WE2D-4: Student Paper: Design of Broadband Lumped Element Baluns

D. Kuylenstierna, P. Linner

WE2D-5: Student Paper: A Novel Planar Branch-Line Coupler Design for Dual-band Applications

F.L. Wong, K.K. Cheng

WE2D-6: Student Paper: LINC Digital Component Separator for Multicarrier W-CDMA-Signals/3

W. Gerhard, R. Knoechel

WE3D MICROWAVE ACOUSTIC FILTERS AND THEIR WIRELESS APPLICATIONS (FOCUS SESSION)

Chair: C. Ruppel * Co-chair: D. Adam

Recent advances in film bulk acoustic resonator (FBAR) and surface acoustic wave (SAW) filters are reported. FBAR and SAW filters play a key role in modern wireless terminal applications. In this focused session, leading industrial companies will present their results on passive integration (frontend modules), FBAR and SAW devices for PCS and multiband cell phones, and ultra wideband wave devices

WE3D-1: Invited: Ultra-Miniaturized and High Performance PCS SAW Duplexer with Steep Cut-Off Filters

M. Ueda, J. Tsutsumi, S. Inoue, T. Matsuda, Y. Satoh, O. Ikata

WE3D-2: Ultra Wideband Low Wave Devices Employing Cu-Grating/YX-LiNbO3-Substrate Structure

K.-Y. Hashimoto, H. Asano, T. Omori, M. Yamaguchi

WE3D-3: Invited: Acoustic Frontend Modules

P. Hagn

WE3D-4: Thin Film BAW Filters for Wide Bandwidth ...

K. Lakin

WE3D-5: Coupled Bulk Acoustic Wave Resonator Filters: Key Technology for Single-to-balanced RF Filters

G.G. Fattinger, R. Aigner, W. Nessler

WE3D-6: Acoustic FBAR for Filters, Duplexers and Front End Modules

R. Ruby

WE4D ADVANCES IN NONLINEAR CAD TECHNIQUES

Chair: J.C. Pedro * Co-chair: P. Draxler

This session focuses on new advances in nonlinear CAD techniques for microwave circuits and systems. The topics covered range from new developments in harmonic balance algorithms to stability analysis, electromagnetic compatibility for nonlinear circuits, and novel device models for nonlinear simulation.

WE4D-1: Student Paper: Parametric Circuit Reduction for Steady-State Simulation with Multi-tone Inputs

E.F. Gad, P. Pai, R. Achar, M. Nakhla, R. Khazaka

WE4D-2: New Computational Technique for Periodic Distortion Analysis of Communication Circuits

M. Gourary, S.G. Rusakov, S.L. Ulyanov, M.M. Zharov, K.K. Gullapalli, B.J. Mulvaney

WE4D-3: Analysis and Stabilization Tools for Microwave Amplifiers

A. Suarez, A. Collado, F. Ramirez

WE4D-4: An Evolutionary Approach for Multi-objective Optimization of Nonlinear Microwave Circuits

L. da Cunha Brito, P.H. Portela de Carvalho

WE4D-5: General Electromagnetic Compatibility Analysis for Nonlinear Microwave Integrated Circuits

V. Rizzoli, A. Costanzo, G. Monti

WE4D-6: Distortion Modeling of PIN Diode Switches and Attenuators

R. Caverly

WE5D SILICON DEVICES, ICS AND EMERGING TECHNOLOGIES

Chair: T. Lee * Co-chair: V. Nair

Papers discussing silicon-based devices and ICs for commercial applications are presented. Microwave applications of emerging technologies such as carbon nanotubes and resonance phase transistors are also discussed.

WE5D-1: Student Paper: High Yield Reduced Process Tolerance Self-Aligned Double Mesa Process Technology for SiGe Power Heterojunction Bipolar Transistors (HBTs)

K.Y. Lee, B. Johnson, P. Bhattacharya, S. Mohammadi, L. Katehi

WE5D-2: Frequency Response Improvement of 120 GHz [f.sub.T] SiGe HBT by Optimizing the Contact Configurations

M.W. Hsieh, C.C. Ho, H.P. Wang, Y.J. Chan, C.Y. Lee, G.J. Chen, D.T. Tang

WE5D-3: The Influence of The Gate Leakage Current and The Gate Resistance on The Noise and Gain Performances of 90 nm CMOS for Micro- and Millimeter-wave Frequencies

H.-O. Vickes, M. Ferndabl, A. Masud, H. Zirath

WE5D-4: A 5.2 GHz 16 dB Gain CMFB Gilbert Downconversion Mixer Using 0.35 [micro]m Deep Trench Isolation SiGe BiCMOS Technology

C. Meng, T.-H. Wu, T.-H. Wu, G.-W. Huang

WE5D-5: High Performance SiGeC HBT Integrated Into a 0.25 [micro]m BiCMOS Technology Featuring Record 88 Percent Power-added Efficiency

D. Hartskeerl, B. Huizing, W. Van Noort, P. Magnee, P. Deixler

WE5D-6: Wide-band Low-Power CMOS Transimpedance Preamplifier

R. Tao, M. Berroth

WE5D-7: Student Paper: Carbon Nanotube GHz Nano-Resonator

Sb. Li, Z. Yu, S.-F. Yen, P. Burke, W.C. Tang

WE5D-8: Student Paper: Experimental Verification of the Resonance Phase Transistor Concept

R. Wanner, G. Olbrich, P. Russer, H. Jorke, J.-F. Luy, S. Heim, E. Kasper

WE5D-9: High Voltage Sensitivity GaAs Planar Doped Barrier Diodes for Microwave/Millimeter-wave Power Detector Applications

V.T. Vo, C.N. Dharmasiri, S.C. Subramaniam, A.A. Rezazadeh, K.L. Koon, Z.R. Hu

WE6D ULTRA HIGH POWER MICROWAVE SYSTEMS AND COMPONENTS

Chair: B. Levush

The ultra high power microwave systems and components session contains papers on computationonal techniques used in designing high power RF structures, pulse compression techniques for achieving very RF power used in particle accelerators and advances in ultra high power microwave sources. The first paper describes the current status in the development of high power microwave sources for nonlethal directed energy applications. The second paper describes the advantages in high power microwave tubes at mm-waves. The third paper describes the use of a barrel open cavity for RF pulse compression. The fourth paper reports the work on a novel X-band amplifier array in a high Q circular waveguide cavity. The fifth paper presents an overview of current numerical techniques for modeling overmoded RF structures. The sixth paper talks about the achievements in active RF pulse compression for accelerator applications. The last paper reports results on a 0.5 W S-band transmission and RF pulse compression system.

WE6D-1: High Power Microwave Sources and Applications

E. Schamiloglu

WE6D-2: Photonic Bandgap Structures for High Power Microwave Applications

M.A. Shapiro

WE6D-3: 3 GHz Barrel Open Cavity (BOC) RF Pulse Compressor for CTF3

I. Syratchev

WE6D-4: Student Paper: An Ultra-high Power Amplifier Array on Single Wafer

J. Guo, S. Tantawi

WE6D-5: Analysis and Design of High-Power Overmoded Components

J. Neilson

WE6D-6: Active RF Pulse Compression for Accelerator Applications

J.L. Hirshfield

WE6D-7: A Half Gigawatt Dual-Moded X-band Transmission and RF Pulse Compression System

C.D. Nantista, S. Tantawi

1:30 To 4:30 PM

WEIF WEDNESDAY INTERACTIVE FORUM

Chair: Al Katz * Co-chair: Z. Turski

WEIF-1: Student Paper: High Performance TLM Simulation Using Adjustable Time Steps

V.H.o Melo, C.A.T. de Carvalho, Jr., L.R.A.X. de Menezes

WEIF-2: Student Paper: Acceleration of Finite-Difference Time-Domain (FDTD) Using Graphics Processor Units (GPU)

S.E. Krakiwsky, M. Okoniewski, L. Turner

WEIF-3: Hybrid Transmission Line Matrix (TLM) and Multipole Expansion Method for Time-Domain Modeling of Radiating Structures

P. Lorenz, P. Russer

WEIF-4: Student Paper: Intracell Modeling of Lumped Elements Using the Composite-Cell MRTD Technique

N. Bushyager, M. Tenzeris

WEIF-5: Efficient Full-Wave CAD Tool of Passive Components Based on Coaxial Waveguide Junctions

M. Simeoni

WEIF-6: BSIM4 High-Frequency Model Verification for 0.13 [micro]m RF-CMOS Technology

M.-T. Yang, P.-C. Ho, C.-K. Lin, T.-J. Yeh, Y.-T. Chia, K. Young, S. Voinigescu, M. Tazlauanu

WEIF-7: Compact Modeling of Differential Spiral Inductors in Si-Based RFICs

A. Watson, Y. Mayevskiy, A. Weisshaar, P. Francis, K. Hwang, G. Srinivasan

WEIF-8: Numerical Noise Model for the AlGaN/GaN HEMT

S. Lee, K. Webb

WEIF-9: A New Precise Large Signal LDMOS Model Including Time Delay Effects

R. Follmann, J. Gajadharsing

WEIF-10: 28 V High Power GaAs FET Large Signal Modeling Achieves Power and Linearity Prediction

R. Hajji, J. Shumaker, E. Camargo

WEIF-11: Modeling of High Power RF LDMOS Amplifiers

K. Goverdhanam, J. Lott, D. Farrell, S. Perelli, W. Dai, M. Frei, E. Lau

WEIF-12: InGaP/GaAs HBT I/V Characterization for Volterra Series Analysis

C.-C. Huang, K.-Y. Chen

WEIF-13: Advanced nonlinear Model for Accurate Prediction of Harmonically Terminated Power Amplifier Performance

J.I. Upshur, M. Reece, R. Wallis, C. White

WEIF-14: Inter-Cavity Coupling in Asymmetric Cavity Filters

T. Reeves, N. van Stigt

WEIF-15: Inline Comb Filters with One or Two Transmission Zeros

G. Macchiarella, M. Fumagall

WEIF-16: A Direct Method to Compute the Coupling Between Non-identical Microwave Cavities

A.R. Harish, S.K. Raj

WEIF-17: Dual-band Rejection Filter for Distortion Reduction in RF Transmitters

H. Uchida

WEIF-18: PCB Substrate Integrated Waveguide-Filter Using Via Fences at Millimeter-wave

B.S. Kim, J.W. Lee, K.S. Kim, M.S. Song

WEIF-19: Temperature Compensated Cavity Resonator as Integral Part of a LTCC Baseplate

J. Hesselbarth, D. Stanelli, S. Groth, P. Nuechter, U. Goebel

WEIF-20: Narrow-band HTS Filter on Sapphire Substrate

J.-S. Hong, E.P. McErlean

WEIF-21: Third-order Intermodulation Measurements of Microstrip Bandpass Filters Based on High Temperature Superconductors

H. Sato, J. Kurian, M. Naito

WEIF-22: A Novel Rounded-Patch Dual-Mode HTS Microstrip Filter

G. Bertin, B. Piovano, L. Accatino, G. Dai, R. Tebano, F. Ricci

WEIF-23: Accurate Design of High [T.sub.c] Superconducting Microstrip Filter at UHF Band for Radio Astronomy Front End

G. Shang, M. Lancaster, F. Huang, M. Zhu, B. Cao

WEIF-24: Interest of the Superconductivity at 30 GHz: Application to the HTS Preselect Receive Filters for Satellite Communications

J.-F. Seaux, C. Lascaux, V. Madrangeas, S. Bila

WEIF-25: Student Paper: A Low-Loss High-Reliability Microwave Switch Matrix for Smart Antenna Systems

K. U-yen, L. Dong, J.S. Kenney

WEIF-26: A PIN Diode Switch Operating at Multi-Frequency Bands

S. Tanaka, T. Kimura

WEIF-27: Student Paper: A Highly Linear Broadband Common Base Mixer Based on Combination o f Active and Resistive Concepts

C. Belkhiri, Polytech'Nantes; S. Toutain, T. Razban

WEIF-28: Novel T/R Switch Architectures for MIMO Applications

C.-H. Lee

WEIF-29: Student Paper: pHEMT and mHEMT Ultra Wideband Millimeter-wave Balanced Resistive Mixers

S. Gunnarsson, K. Yhland, H. Zirath

WEIF-30: Student Paper: Signal Generation, Control and Frequency Conversion AlGaN/GaN HEMT MMICs

V. Kaper, R. Thompson, T. Prunty, J. Shealy

WEIF-31: A Modified Weaver Image Rejection of Broadband Direct Conversion Receiver

Y. Umehara, H. Arai

WEIF-32: Student Paper: Tunable Passive Phase Shifter for Microwave Applications Using Highly Anisotropic Liquid Crystals

S. Mueller, P. Scheele, R. Jakoby, C. Weil, M. Wittek, C. Hock

WEIF-33: A Novel Uniplanar 44 GHz MMIC Subharmonic Mixer Using CPW Series Stubs

K. Hettak, K. Verver, M.G. Stubbs, G.A. Morin

WEIF-34: Fully Monolithic 8 W Ku-band High Power Amplifier

Q. Zhang

WEIF-35: A Power Efficient W-CDMA Smart Power Amplifier with Emitter Area Adjusted for Output Power Levels

J.H. Kim

WEIF-36: Effect of Gain Expansion of MMIC Power Amplifier for High Order Modulation OFDM Portable System

J.H. Kim

WEIF-37: Student Paper: InGaP/GaAs HBT RF Power Amplifier with Compact ESD Protection Circuit

Y. Ma, G.P. Li

WEIF-38: Low Power and Small Sized Ku-band MMIC Low Noise Block Downconverter Design Using InGaP/GaAs HBT Process

J. Lee, S. Lee, J.C. Lee, J.H. Kim, B. Lee, N.Y. Kim, S.H. Jeon, J.W. Park

WEIF-39: Application of Feed-forward Principles to Noise Cancellation in Amplifiers

S. Romisch, F. Ascarrunz

WEIF-40: Student Paper: A Micromachined 400 GHz Rectangular Waveguide and 3-Pole Bandpass Filter on a Silicon Substrate

P. Kirby, J. Papapolymerou, D. Pukala, H. Manohara, I. Mehdi

WEIF-41: Student Paper: Q-band Micro-patch Antennas Implemented on a HRS Using the Surface Micromachining Technology

M. Ha, Y.-S. Kwon, Y.-H. Cho, C.-S. Pyo

WEIF-42: A Novel Method to Linearize Phase Response of Single-Ended to Differential Converters for High Bit Rates

N. Michel, N. Weber, H. Humpfer, M. Lang, U. Nowotny

WEIF-43: Student Paper: Microwave Frequency and Distribution Characterization of High Aspect Ratio Through-Wafer Interconnect Vias in Silicon Substrates

L.L.W. Leung, K.J. Chen

WEIF-44: A Ka/IF Down-converter for Space Application with Embedded Microwave Passives and DC Networks

P. Monfraix

WEIF-45: Inexpensive X-band 1/2 W PA Using 3D LTCC Technology

A. Darwish

WEIF-46: A 70+ GHz Package for Multigigabit IC Applications

D. Choudhury, D. Choudhury

WEIF-47: A Novel Integrated Interconnect Network for RF Switch Matrix Applications

M. Daneshmand, R. Mansour, P. Mousavi, S. Choi, B. Yassini, A. Aybura, M. Yu

WEIF-48: Student Paper: A Novel Active Harmonic Load-Pull Setup for On-Wafer Device Linearity Characterization

M. Spirito, L.C.N. de Vreede, M. de Kok, M. Pelk, J. Burghartz, D. Hartskeerl, H.F. Jos, J.E. Mueller

WEIF-49: Further Study on In-situ Measurement of Complex EM Parameters with a Flanged Open-ended Coaxial Probe

C.P. Chen

WEIF-50: Microwave De-Embedding Techniques Applied to Acoustics

C.M. Jackson

WEIF-51: Student Paper: Numerical Multimode TRL Calibration Technique for Extraction of Complex Propagation Constants of Substrate Integrated Waveguide

F. Xu

WEIF-52: Student Paper: Direct Measurement of Thermal Circuit Parameters Using Pulsed IV and the Normalized Difference Unit

C.P. Baylis, II, L. Dunleavy, J. Daniel

WEIF-53: A Novel Cascade-Based De-embedding Method for On-Wafer Microwave Characterization and Automatic Measurement

M.-H. Cho, G.-W. Huang, K.-M. Chen, A.-S. Peng

WEIF-54: Student Paper: Switchable RF MEMS Ka-band Frequency-Selective Surface

B. Schoenlinner, G. Rebeiz, L. Kempel

WEIF-55: Reduction of Complexity for Digital Beamforming in High-Altitude-Platform and Satellite Systems

T. Do-Hong, G. Olbrich, P. Russer

WEIF-56: Student Paper: A Retrodirective Array Using Unbiased Subharmonic Resistive Mixers

A. de Diego, J.A. Garcia, A. Mediavilla

WEIF-57: Student Paper: Frequency-Angle Dependent Compensation of Non-Uniform Components for Wideband Smart Antenna

M. Uthansakul, M. Bialkowski

WEIF-58: Student Paper: A Single RF Channel Smart Antenna Receiver Array with Digital Beamforming for WLAN Application

D.S. Goshi, Y. Wang, T. Itoh

WEIF-59: Student Paper: Results on DoA Finding Using 5-Port

A.J. Braga

WEIF-60: Practical Realization of Self-complementary Broadband Antenna on Low-Loss Resin Substrate for UWB Applications

A. Saitou, K.-I. Sato, T. Koyama, K. Watanabe, T. Iwaki, K. Honjo

WEIF-61: A Novel CMOS/BiCMOS UWB Pulse Generator and Modulator

Y.n Zheng, D. Han, Y.P. Xu

WEIF-62: Student Paper: Direct Antenna Modulation--A Promise for Ultra-Wideband (UWB) Transmitting

W. Yao, Y. Wang

WEIF-63: Student Paper: Novel High-Accuracy LTCC-Integrated Power Monitors for 2.4 and 5 GHz Wireless-LAN Applications

A. Kryshtopin, R. Kravchenko, A. Chernyakov, K. Markov, G. Sevskiy, T. Kerssenbrock, P. Heide

WEIF-64: Student Paper: A Novel RF Front-end Architecture for Multi-band Transceivers

F.R. de Sousa, B. Huyart

WEIF-65: A Novel Dual Band Transmitter for WLAN 802.11a/g Applications

J.H. Jeon, J.H. Choi, T.Y. Kim, W. Choi, K.H. Koo

THURSDAY, JUNE 10, 2004

8:00 TO 9:40 AM

THIA TUNABLE AND ADVANCED CONCEPTS FOR PLANAR FILTERS

Chair: H. Dayal * Co-chair: D. Swanson

This session presents several novel configurations for tunable, reconfigurable, and adaptive filters. It also presents novel concepts for realization of wideband filters, and for passive enhancement of resonator Q.

TH1A-1: Student Paper: A New Electronically Tunable Combline Filter with Simultaneous Continuous Control of Central Frequency and Bandwidth

M. Sanchez-Renedo, R. Gomez-Garcia, J.I. Alonso, C. Briso-Rodriguez

TH1A-2: Tunable Millimeter-wave Bandpass Filter Using Electromagnetic Crystal Sidewalls

H. Xin, J. Higgins, A. Sailer

TH1A-3: Student Paper: Adaptive Duplexer Implemented Using Feedforward Technique with a BST Phase Shifter

T. O'Sullivan, R. York, B. Noren, P. Asbeck

TH1A-4: Student Paper: Absorptive Near-Gaussian Low Pass Filter Design with Applications in the Time and Frequency Domain

J. Breitbarth, D. Schmelzer

TH1A-5: Design and Analysis of UWB Bandpass Filter with Ring Filter

H. Isbida, K. Araki

TH1A-6: Student Paper: A Novel Low Pass Microstrip Filter Using Metal-Loaded Slots in the Ground Plane

R. Zhang

TH1A-7: Passive Enhancement of Resonator Q in Microwave Notch Filters

D.R. Jachowski

TH2A SIGNAL GENERATION TECHNOLOGY FOR 16 TO 80 GHz

Chair: J. Papapolymerou * Co-chair: J. Kuno

Signal sources are an essential part of RF front ends that are used in a variety of radar and communications systems. This session focuses on recent developments of microwave sources operating from 16 GHz up to 80 GHz using various technology platforms such as SOI CMOS, GaAs, InP, and Gunn devices and various circuit techniques.

TH2A-1: Student Paper: A V-band VCO and Frequency Divider MMICs or Phase-locked Loop

O.G. Lee, J.-G. Kim, S. Hong, S.-H. Jeon, J.-W. Park

TH2A-2: Monolithic InP HBT W-band VCO-Static Divider

E. Sovero, B. Li

TH2A-3: 60 GHz VCO with High Frequency Tuning Range Fabricated on VLSI SOI CMOS Technology

F. Ellinger, G. von Bueren, C. Kromer, G. Sialm, L. Rodoni, H. Jaeckel, T. Morf, M. Schmatz

TH2A-4: Student Paper: A Low Phase Noise Ku-band Push-Push Oscillator Using Slot Ring Resonator

H. Xiao, T. Tanaka, M. Aikawa

TH2A-5: Rectangular Waveguide Compatible NRD Guide Gunn Oscillator with Medium Power and Low Phase Noise at 60 GHz

F. Kuroki, H. Shimoi, K. Yamaoka, T. Yoneyama

TH2A-6: Optimizing MMIC Reflection-Type Oscillators

F. Lenk, M. Schott, J. Hilsenbeck, W. Heinrich

TH3A GALLIUM ARSENIDE AND GALLIUM NITRIDE HIGH POWER AMPLIFIERS FOR BASE STATION APPLICATION

Chair: J.L. Heaton * Co-chair: A. Rezazadeh

Design and technology of high voltage high power HEMT power amplifiers based on GaAs and GaN for base station applications will be presented.

TH3A-1: An Over 100 W Output Power GaN HEMT Push-Pull Amplifier with High Reliability

T. Kikkawa, M. Kanamura, K. Joshin

TH3A-2: A 149 W Recessed-Gate AlGaN/GaN FP-FET

Y. Okamoto, Y. Ando, K. Hataya, T. Nakayama, H. Miyamoto, T. Inoue, M. Senda, K. Hirata, M. Kosaki, N. Shibata, M. Kuzuhara

TH3A-3: 50 W MMIC Power Amplifier Design for 2 GHz Applications

M. Akkul, M. Sarfraz, J. Mayock, W. Bosch

TH3A-4: A 28 V, 250 W GaAs Power FET with High Gain of 15.5 dB for W-CDMA Base Stations

M. Nagahara, K. Inoue, S. Sano, H. Takahashi, S. Takase

TH3A-5: A 26 V, 45 W GaAs pHEMT for 2 GHz WCDMA Applications

P. Piel, M. Miller, B. Green

TH4A MODELING AND OPTIMIZATION TECHNIQUES

Chair: N.E. Buris * Co-chair: K.C. Guptar

This session includes papers on optimization and tuning for microwave filters, interconnect modeling and selection of multipoles.

TH4A-1: Student Paper: A Gradient-Based Optimization Technique Employing Determinants for the Synthesis of Microwave Coupled Filters

A. Al-Jayyoussi, M. Lancaster

TH4A-2: Computer-Aided Tuning and Diagnosis of Microwave Filters Using Sequential Parameter Extraction

G. Pape, F.-J. Goertz, H. Chaloupka

TH4A-3: Student Paper: Fast and Efficient Interconnect Modeling Using Finite Element Method and Model Order Reduction

S.-H. You, Univ. of Colorado; E.F. Kuester

TH4A-4: A Numerical Approach for Automatic Detection of the Multipoles Responsible for Ill Conditioning in Generalized Multipole Technique

A.K. Bandyopadhyay, C. Tomassoni, A.S. Omar

TH4A-5: ESPRIT: A Compact Reluctance Based Interconnect Model Considering Lossy Substrate Eddy Current

R. Jiang, C.C.-P. Chen

TH4A-6: Student Paper: Capture Partial Reluctance More Efficiently for Complex Interconnect Structure

Y. Du, D. Liu, W. Dai

TH5A FREQUENCY DOMAIN TECHNIQUES

Chair: J. Bornemann * Co-chair: J.C. Rautio

This session focuses on novel extensions and modifications of frequency-domain techniques. Innovations are mainly applied to the method of moments, but issues related to mode matching, Green's functions, finite elements and the method of lines are also addressed. Applications involve multilayered and planar circuits, waveguide components and radiating structures.

TH5A-1: A New Full-Wave Hybrid Differential-Integral Approach for the Investigation of Multilayer Structures Including Non-Uniformly Doped Diffusions

S. Wane, H. Baudand, D. Bajon, P. Gamand

TH5A-2: Large-Scale Broadband Parasitic Extraction for Fast Layout Verification of 3D RF and Mixed-Signal On-Chip Structures

F. Ling, V. Okhmatovski, W. Harris, S. McCracken, A. Dengi

TH5A-3: A Short-Open De-embedding Technique for S-Domain Modeling of Planar Circuits

P.M. Arcioni, G. Conciauro, M. Repossi

TH5A-4: Efficient Hybrid MM/MoM Technique for the CAD of Circular Combline Filters with Resonators of More General Shape

F. Arndt, V. Catina, J. Brandt

TH5A-5: Accurate Consideration of Metal Losses in Planar Waveguide Junctions Using an Efficient Integral Equation Technique

J. Hueso, S. Cogollos, V. Boria, H. Esteban, B. Gimeno, A. Vidal, M. Guglielmi

TH5A-6: Numerical Evaluation of the Green's Functions for Cylindrical Enclosures by a New Spatial Images Method

P. Vera-Castejon, F.D. Quesada-Pereira, D. Canete-Rebenaque, J. Pascual-Garcia, A. Alvarez-Melcon

TH5A-7: Modified Perturbation Theory for Wideband Finite-Element Model Order Reduction in Eigen-Problems

S.-H. Lee, R.-B. Wu

TH5A-8: Efficiency Enhancement by Reduction of Modal Complexity in the Analysis of Cascaded Planar Circuits by the Mol.

L. Vietzorreck, W. Pascher

TH6A BIOLOGICAL EFFECTS AND MEDICAL APPLICATIONS

Chair: R. Bansal * Co-chair: A. Vander Vorst

The seven papers presented in this session attest to the continued fascination in finding new biomedical applications as well as understanding the safety issues of electromagnetic radiation. These papers deal with the modeling and measurements of radiation absorption in cells in a petri dish as well as in vivo. Three application papers are also presented, one dealing with wireless medical sensors, an important and growing area of research, one on an antenna configuration useful in ablation treatment, and one dealing with the measurement of the properties of biological tissues.

TH6A-1: A Coplanar Waveguide System for Cells Exposure During Electrophysiological Recordings

M. Liberti, F. Apollonio, G. D'Inzeo

TH6A-2: RF Telemetry System for an Implantable Bio-MEMS Sensor

R. Simons, F. Miranda, D. Hall

TH6A-3: Student Paper: Analysis and Experimental Validation of a Triaxial Antenna for the Treatment of Hepatic Neoplasms

C. Brace, D. van der Weide, F. Lee, Jr., L. Sampson

TH6A-4: Student Paper: A Planar-Type Probe with a Coaxial Aperture for Nondestructive Complex Permittivity Measurement of Biological Materials Up to 30 GHz

B. Kang, J. Cho, Y. Kwon, C. Cheon

TH6A-5: Influence of Mobile Communication Signals on Pacemaker Operation

D. Koether, A. Bahr, U. Gollor, F. Gustrau

TH6A-6: Evaluation of Human Absorption in the Near Field of a BTS Antenna

R. Bernardi, M. Cavagnaro, S. Pisa, E. Piuzzi, L. Cristoforetti, M. Mazzurana, R. Pontalti, L. Sandrini

TH6A-7: Comparison of Specific Absorption Rate (SAR) Induced in Child-sized and Adult Heads Using a Dual Band Mobile Phone

H. Abdelhamid, D. Christian, W.M. Fai, W. Joe, L. David, F.H. Victor

10:20 AM TO 12:00 PM

TH1B MINIATURE PLANAR AND INTEGRATED FILTERS

Chair: R. Mansour * Co-chair: P. Blondy

This session presents recent progress in the design, fabrication, and integration of planar compact filters on silicon substrates. New resonator and filters topologies will be presented, along with innovative high volume fabrication techniques.

TH1B-1: Compact Quasi Planar Silicon Bandpass Filters Based on Metallic Periodic Structure for Q- and V-band Applications

P. Ferrand, M. Chatras, D. Baillargeat, P. Blondy, S. Verdeyme, J. Puech, L. Lapierre, J. Galiere, E. Estebe

TH1B-2: MEMS-Based Photonic Bandgap (PBG) Band-Stop Filter

X. Zhang, A. Liu

TH1B-3: Student Paper: Narrow-band Band-pass Filters on Silicon Substrates at 30 GHz

D.S. Yu, K.T. Chan, A. Chin, S.P. McAlister, C. Zhu, M.F. Li, D.-L. Kwong

TH1B-4: Student Paper: Low Loss Coupled Line Filters with Transmission Zeros in Multi-Layer Thin Film MCM-D Technology

G.P. Quijano, G. Carchon, W. De Raedt, B. Nauwelaers

TH1B-5: Miniaturized and Out-of-band Improved Bandpass Filter in Si-BCB Technology

C. Quendo, E. Rius, Y. Clavet, C. Person, F. Bouchriha, L. Bary, K. Grenier

TH1B-6: A Novel Compact Dual-mode Bandpass Filter with Meander Open-loop Arms

K.K. Sun, K.W. Tam

TH1B-7: Super Compact Split Ring Resonators CPW Band-pass Filters

J. Bonache, F. Martin, J. Garcia, I. Gil, F. Falcone, T. Lopetegi, M. Laso, M. Sorolla, R. Marques, F. Medina

TH2B SIGNAL GENERATION TECHNOLOGIES UP TO 10 GHz

Chair: D. Elad * Co-chair: P. Khanna

This session focuses on a wide spread of new technologies as well as new ideas related to improvement of signal generation up to 10 GHz. GzN, SiGe, Si-CMOS, and SiGe-Bi-CMOS technologies with various characteristics and operation frequency will be presented.

TH2B-1: Student Paper: Reconfigurable RFICs for Frequency-Agile VCOs in Si-Based Technology for Multi-Standard Applications

R. Mukhopadhyay, Y. Park, N. Srirattana, S. Nuttinck, J. Laskar

TH2B-2: Student Paper: Wide-band CMOS VCO and Frequency Divider Design for Quadrature Signal Generation

Y. Park, S. Chakraborty, C. Lee, S. Nuttinck, J. Laskar

TH2B-3: Student Paper: A 10 GHz Dielectric Resonator Oscillator Using GaN Technology

P.J. Rice

TH2B-4: Dual-band Frequency Divider, Based on Oscillation Control

A. Suarez, V. Arana, P. Dorta

TH2B-5: A Low Power High Performance 4 GHz SiGe HBT VCO

A.I. Khalil, P. Katzin

TH2B-6: Student Paper: Low Phase-Noise 5 GHz AlGaN/GaN HEMT Oscillator Integrated with BaxSr1-xTiO3 Thin Films

H. Xu, C. Sanabria, N. Pervez, S. Keller, U. Mishra, R. York

TH3B ADVANCED PA DESIGN TECHNIQUES FOR HANDSET AND WLAN APPLICATIONS

Chair: P. Zampardi * Co-chair: C.E. Weitzel

This session presents novel circuit design techniques for improving PA performance using bias control for CDMA handset applications. Next, an HBT technology utilizing advanced thermal management techniques is presented that demonstrates 31 W at S-band. The session concludes with several WLAN PA presentations representing state-of-the-art performance by using novel circuits and packaging techniques.

TH3B-1: Adaptively Preserving Power Amplifier Linearity Under Antenna Mismatch

A. van Bezooijen, C. Chanlo, A.H.M. van Roermund

TH3B-2: Student Paper: An Envelope Elimination and Restoration Power Amplifier Using a CMOS Dynamic Power Supply Circuit

J.-H. Chen, K. U-yen, J.S. Kenney

TH3B-3: Student Paper: CDMA Handset Power Amplifier with a Switched Output Matching Circuit for Low/High Power Mode Operations

S. Kim, J. Lee, B. Kim, J. Shin

TH3B-4: High Power and High Efficiency 30 W Compact S-band HBT Power Chips with Gold or Diamond Heat Spreaders

S. Piotrowicz, E. Chartier, J.C. Jacquet, D. Floriot, J.-M. Coupat, C. Framery, P. Eudeline, P. Auxemery

TH3B-5: Very Low Cost 4 W GaAs WLAN Amplifier Module for 5 GHz

T. Sawa, K. Nishi, S. Sawada, S. Nakajima

TH3B-6: A High Efficiency Chireix Outphasing Power Amplifier for 5 GHz WLAN Applications

J. Grundlingh, K. Parker, G. Rabjohn

TH3B-7: A 2.4 GHz/5.2 GHz CMOS Power Amplifier for Dual Band Applications

Y.S. Eo

TH3B-8: Student Paper: Envelope Tracking Power Amplifier with Pre-Distortion Linearization for WLAN 802.11g

F. Wang, A. Ojo, D. Kimball, P. Asbeck, L. Larson

TH4B NEURAL NETWORKS AND OPTIMIZATION TECHNIQUES FOR MICROWAVE CAD

Chair: A.K. Sharma * Co-Chair: Q.J. Zhang

This session present state-of-the-art in microwave CAD using neural networks and optimization techniques. Advances in neural networks include linear and nonlinear modeling in frequency and time domain, and integration with genetic optimization algorithms. Novel space mapping techniques and their applications in EM-based optimization are also featured.

TH4B-1: Student Paper: Robust Neural Based Microwave Modeling and Design Using Advanced Model Extrapolation

J. Xu, Q.J. Zhang, M.C.E. Yagoub, R. Ding

TH4B-2: Student Paper: A New Nonlinear Transient Modeling Technique for High Speed Integrated Circuit Applications Based on State-Space Dynamic Neural Network

Y. Cao, Q.-J. Zhang, R. Ding

TH4B-3: Student Paper: Modeling and Optimization of RF Multilayer Passives Using Coupled Neural Network and Genetic Algorithms

R.J. Pratap, S. Sarkar, S. Pinel, J. Laskar, G. May

TH4B-4: Filter Approximation by RBF-NN and Segmentation Method

F.J. Nunez, A.K. Skrivervik

TH4B-5: Student Paper: Space Mapping Interpolating Surrogates for Highly Optimized EM-based Design of Microwave Devices

J. Bandler, Q. Cheng, S. Dakroury, D. Gebre-Mariam, A. Mohamed, K. Madsen, F. Pedersen

TH4B-6: Multiple Space Mapping for RF T-Switch Design

M. Ismail, K. Engel, M. Yu

TH6B TERAHERTZ TECHNOLOGY AND BIOLOGY

Chair: P.H. Siegel * Co-Chair: A. Rosen

In order to address expanding interest in the field of Terahertz applications to the biomedical sciences, the MTT-4 (THz Technology) and MTT-10 (Biological Effects and Medical Applications) have teamed up to bring to IMS the First Joint Session on Terahertz Technology and Biology. The session will offer an overview of this new and rapidly evolving field, combining applications with enabling technology developments.

TH6B-1: Terahertz Technology in Biology and Medicine

P.H. Siegel

TH6B-2: Biomedical Applications of THz Imaging

V. Wallace

TH6B-3: Student Paper: Ultra-Sensitive Microwave Detection of Protein Conformational Changes

K. Taylor, D. van der Weide

TH6B-4: Capability of THz Sources Based on Schottky Diode Frequency Multiplier Chains

J.S. Ward, E. Schlecht, J. Gill, F. Maiwald, H. Javadi, I. Mehdi, G. Chattopadhyay, A. Maestrini

TH6B-5: Passive and Active Imaging of Humans for Contraband Detection at 640 GHz

R. Dengler, A. Skalare, P. Siegel

1:20 TO 3:00 PM

TH1C PLANAR FILTERS WITH IMPROVED STOPBAND PERFORMANCE

Chair: V. Boria * Co-chair: R. Chen

The improvement of stopband performance of planar filters is a topic of paramount importance for microwave and millimeter-wave applications. In this session, new techniques and practical configurations for extending and improving the stopband response of planar filters will be presented.

TH1C-1: New Cross-coupled Microstrip Band Reject Filters

R. Wu, S. Amari, U. Rosenberg

TH1C-2: Quasi-Lumped Suspended Stripline Filters with Adjustable Transmission Zeroes

W. Menzel

TH1C-3: A New DGS Resonator and Its Application to Bandpass Filter Design

J.-S. Yoon, C.-S. Park, J.-G. Kim, J.-S. Park, J.-B. Lim, H.-G. Cho

TH1C-4: Design of Two-Stage UIR and SIR Bandpass Filters with an Elliptic Function-Like Response

J.-T. Kuo, W.-H. Hsieh, M. Jiang

TH1C-5: Compact Implementation of Transmission Zeros Using the Zero Shifting Property

D. Canete-Rebenaque, F.D. Quesada-Pereira, J.L. Gomez-Tornero.J. Pascual-Garcia, A. Alvarez-Melcon

TH1C-6: Harmonic Suppression Technique Based on Mode Coupling Control in Microstrip Multistage Coupled Ring Bandpass Filters

A. Griol, D. Mira, J. Marti, J.L. Corral

TH1C-7: Student Paper: A Compact Microstrip [lambda]/4-SIR Interdigital Bandpass Filter with Extended Stopband

H.-K. Pang, K.-M. Ho, K.-W. Tam, R.P. Martins

TH2C TRANSMISSION LINES, INTERCONNECTS AND COUPLING

Chair: G.E. Ponchak * Co-Chair: P. Russer

Transmission lines, coupling, and methods of reducing coupling are presented in the first three papers. A substrate integrated Non-Radiative Dielectric (NRD) waveguide is demonstrated for the first time at millimeter-wave frequencies in the forth paper. In the last paper, the loss of Cu damascene transmission lines on Si substrates is quantified as a function of frequency.

TH2C-1: Student Paper: Data-Dependent Jitter and Crosstalk-Induced Bounded Uncorrelated Jitter in Copper Interconnects

J. Buckwalter, B. Analui, A. Hajimiri

TH2C-2: A Study of Feeding Options Aimed at Canceling Crosstalk in Multiconductor Transmission Lines

T. Ciamulski, W. Gwarek

TH2C-3: Student Paper: A Novel Compact Electromagnetic Band-Gap (EBG) Structure and its Application in Microstrip Antenna Arrays

L. Yang, Tsinghua Univ.; Z. Feng, F. Chen, M. Fan

TH2C-4: Student Paper: Substrate Integrated NRD Guide (SINRD) on High Dielectric Constant Substrate for Millimeter-wave Circuits and Systems

Y.J. Cassivi, K. Wu

TH2C-5: RF-Performance of Thick Damascene Cu Interconnect on Silicon

W. van Noort, C. Detcheverry, A. Jansman, G. Verheijden, P. Bancken, R. Daamen, V. Nguyen, R. Havens

TH3C HIGH FREQUENCY POWER AMPLIFIERS

Chair: A. Platzker * Co-chair: Y. Tkachenko

Latest advancements in high frequency power transistors and amplifiers, from X-band to Q-band, in terms of output power, power densities and efficiencies are presented. Gallium nitride based device and MMIC technology emerges as viable competition to more traditional GaAs PHEMT for multiwatt power amplification at frequencies as high as Ka-band.

TH3C-1: 30 GHz Band 5.8 W High-Power AlGaN/GaN Heterojunction-FET

T. Inoue, Y. Ando, H. Miyamoto, T. Nakayama, Y. Okamoto, K. Hataya, M. Kuzuhara

TH3C-2: Ka-band MMIC Power Amplifier in GaN HFET Technology

M. Micovic, A. Kurdoghlian, H. Moyer, P. Hashimoto, A. Schmitz, I. Milosavljevic, D. Wong, J. Duvall, M. Hu, M. Delaney, D. Chow

TH3C-3: Student Paper: Coplanar AlGaN/GaN HEMT Power Amplifier MMIC at X-band

R. Behtash, H. Tobler, F.-J. Berlec, H. Leier, V. Ziegler, B. Adelseck, T. Martin, R. Balmer, D. Pavlidis, R.H. Jansen, M. Neuburger, H. Schumacher

TH3C-4: A Ku-band 40 W High Efficiency Solid-State Power Amplifier

K. Mori, Y. Sakai, S. Tsuji, H. Asao, K. Seino, T. Takagi, H. Hirose

TH3C-5: 1 W Power Amplifier MMICs for mm-wave Applications

K. Fujii, H. Morkner

TH3C-6: A Ka-/Q-band 2 W MMIC Power Amplifier Using Dual Recess 0.15 [micro]m PHEMT Process

S. Chen

TH3C-7: Design of Low-Cost 4 W & 6 W MMIC High Power Amplifiers for Ka-band Modules

M.R. Lyons, C. Grondahl, S. Daoud

TH4C ADVANCES IN SELF-STEERING ARRAYS

Chair: J. Grimm * Co-chair: W. Shiroma

The papers in this session will discuss new developments in self-steering arrays. Self-steering arrays automatically form a beam in the direction of a pilot signal. This session will cover novel and simple implementations of retro-directive techniques to result in improved system performance.

TH4C-1: A Phased-Array Architecture for Retrodirective Microwave Power Transmission from the Space Solar Power Satellite

C.T. Rodenbeck, M.-Y. Li, K. Chang

TH4C-2: A High-Directivity Transponder Using Self-Steering Arrays

R.Y. Miyamoto, G. Shiroma, B. Murakami, W. Shiroma

TH4C-3: Student Paper: A Quadruple Subharmonic Phase-Conjuating Array for Secure Picosatellite Crosslinks

B.T. Murakami, J.D. Roque, S.S. Sung, G.S. Shiroma, R.Y. Miyamoto, W.A. Shiroma

TH4C-4: Triple Mode PLL Antenna Array

V. Fusco, N. Buchanan

TH4C-5: Student Paper: Full-Duplex Retrodirective Array Using Mutually-Exclusive Uplink and Downlink Modulation Schemes

K. Leong, T. Itoh

TH5C DEVELOPMENTS IN TIME-DOMAIN TECHNIQUES

Chair: S. El-Ghazaly * Co-chair: W.J.R. Hoefer

This session presents new developments of time-domain techniques. Several papers present theoretical advances to FDTD. The new developments are applied to lossy media and passive structures. A technique for embedding active-device equivalent circuits in TLM method is presented. It is applied to a transistor amplifier.

TH5C-1: Generalized-Scattering-Matrix Extraction Using the Finite-Volume Time-Domain (FVTD) Method

D. Baumann, ETH Zurich; C. Fumeaux, P. Leuchtmann, R. Vahldieck

TH5C-2: Embedding of Current-Coupled Lumped Networks in TLM Models

H. Du, P. So, W. Hoefer

TH5C-3: Student Paper: A Hybrid FDTD/Quasistatic Technique for the Accurate Modeling of RF Loss Mechanisms

E. Dalton, M. Tentzeris

TH5C-4: Extended Theory of FDTD S- and P-Eigenmodes in Lossy Media and Its Application to the Analysis of Coupled Problems

M. Celuch-Marcysiak

TH5C-5: Student Paper; Yee's Macrocells in Three Dimensions

L. Kulas, M. Mrozowski

TH5C-6: The Complex Envelope (CE) FDTD Method and Its Numerical Properties

Z. Chen, C.-N. Ma

TH6C NONLINEAR MICROWAVE MEASUREMENTS

Chair: R.D. Pollard * Co-chair: A. Ferrero

The session documents increasing applications maturity in nonlinear measurements. The topics include nonlinear vector network analyzer calibration, measurements of power amplifier properties, intermodulation behavior and mixers.

TH6C-1: An Automated Phase Cancellation Method for Measuring Ultra-High Third Order Intercept Points

P. Blount, M. Olson, R. Tshudy, D. Foote, C. Trantanella

TH6C-2: A Simple Method for Measuring the IM3 Components of Multi-stage Cascaded Power Amplifiers Considering the Phase Characteristics

T. Nakatani, T. Matsuura, K. Ogawa

TH6C-3: Corrections for Nonlinear Vector Network Analyzer Measurements Using a Stochastic Multi-Line/Reflect Method

D.C. DeGroot, Y. Rolain, R. Pintelon, J. Schoukens

TH6C-4: Broadband Identification of Long-Term Memory Effects

K.A. Remley, D. Williams, D. Schreurs, J. Wood

TH6C-5: Vector Mixer Characterization for High Side LO Cases

J. Dunsmore, S. Hebert, D. Williams

3:30 TO 5:00 PM

TH4D SMART ANTENNAS AND PHASED ARRAYS

Chair: J. Navarro * Co-chair: K. Chang

The papers in this session describe recent advances in the field of smart antennas and phased arrays. Smart antennas are being used for 3G data capabilities in wireless systems while improvements in phased arrays are useful for radar and mobile communication applications. This session will present some novel concepts and techniques.

TH4D-1: High Resolution Small Aperture Angle of Arrival Detection Using Nonlinear Analog Processing

Z. Popovic, C. Walsh, C. Dietlein, D. Anderson, P. Matyas

TH4D-2: Fully-Integrated Core Chip for X-band Phased-Array T/R Modules

F.E. van Vliet, A. de Boer

TH4D-3: Student Paper: Ultra Wideband 8 to 40 GHz Beam Scanning Phased Array Using Antipodal Exponentially-tapered Slot Antennas

S.-G. Kim, K. Chang

TH4D-4: Affordable High Performance InP X-band Transceiver Module for Large Aperture Phased Array Applications

J.M. Yang

TH4D-5: Millimeter-wave Beam Focusing/Shaping Phased Antenna Arrays

C.-C. Chang, C.W. Domier, N.C. Luhmann, Jr

TH4D-6: TBD

M. Wagner, U. Goebel, J. Hesselbarth, M. Graeni, P. Nuechter

TH4D-7: A Novel Compact Multiline Phase Shifter for Precise Array Antenna Beam Control

I.-Y. Lee, K.-H. Lee, D.-Y. Kim, Y.-Y. Kim, J.-H. Yea

TH5D NEW APPLICATIONS OF TIME DOMAIN METHODS

Chair: M. Celuch * Co-chair: L. Roselli

This session is concerned with new applications of time domain methods as well as technical problems associated with running time-domain codes on contemporary computers. The first group of papers shows time-domain computed results for metamaterials with negative refractive index, travelling wave photodetectors and hybrid electromagnetic-charge transport problems. The last paper deals with influence of arithmetic overflow on the speed of FDTD simulations.

TH5D-1: Time Domain TLM Modeling of Metamaterials with Negative Refractive Index

P.P.M. So, W. Hoefer

TH5D-2: Student Paper: Rigorous Analysis of Negative Refractive Index Metamaterials Using FDTD with Embedded Lumped Elements

T. Kokkinos, R. Islam, C.D. Sarris, G.V. Eleftheriades

TH5D-3: Student Paper: Application of the TLM Method or the Characterization of Traveling Wave Photodetectors

D. Pasalic, R. Vahldieck

TH5D-4: Time-Domain Electromagnetic-Physics-Based Modeling of Complex Microwave Structures

Y.A. Hussein, S. El-Ghazaly

TH5D-5: On the Influence of Arithmetic Underflow Rounding Standard on the Speed of FDTD Modeling

M. Sypniewski, W. Gwarek

TH6D ON-WAFER AND MATERIAIS MEASUREMENTS

Chair: B. Szendrenyi * Co-chair: J. Martens

This applications-driven session focuses on measurements in challenging environments and with improved data analysis. On-wafer measurements are covered first before moving on to various refinements in permittivity analysis.

TH6D-1: The Thru-line-symmetry (TLS) Calibration Method for On-wafer Scattering Matrix Measurement of Four-port Networks

H.-C. Lu

TH6D-2: Non-Contact Probing of Integrated Circuits and Packages

G. Bridges

TH6D-3: A Non Uniform Thermal De-embedding Approach for Cryogenic On-wafer High Frequency Noise Measurements

S. Delcourt, G. Dambrine, N.E. Bourzgui, S. Lepilliet, C. Laporte, J.-P. Fraysse, M. Maignan

TH6D-4: Multi-layer Processed Probes for Permittivity Measurement

E.M. Jeong, G. Jeong, C. Cheon, J.-M. Kim, J.-H. Park, J.-W. Cho, Y.-K. Kim, Y. Kwon

TH6D-5: Broadband Complex Permittivity Measurements of Dielectric Substrates Using a Split-Cylinder Resonator

M.D. Janezic, J. Baker-Jarvis, E. Kuester

TH6D-6: A Non-destructive Method of Measuring the Dielectric and Magnetic Properties of Laminate Materials in Open Cavities

F.L. Penarada-Foix, P. Plaza-Gonzalez, B. Garcia-Banos, D. Polo-Nieves

TH6D-7: Complex Permittivity Measurements at Varying Temperatures of Low Loss Substrates

J.E. Mazierska, M. Jacob, D. Ledenyov, J. Krupka

1:30 TO 5:00 PM

THIF THURSDAY INTERACTIVE FORUM

Chair: A. Katz * Co-chair: Z. Turski

THIF-1: Frequency Dependencies of Left-Handed and Right-Handed Circuit Unit Cells and Implications for Designing Microwave and Millimeter-wave LHM/RHM Transmission Lines

C. Krowne, D. Jachowski

THIF-2: An Efficient Integral Equation Analysis for Characterizing Lossy Dielectric Resonator

M.-L. Lui, K.-L. Wu

THIF-3: New High-Accuracy Subgridding Technique for the Method of Lines

L.A. Greda, R. Pregla

THIF-4: CAD of Folded Filters and Diplexers by the Generalized Scattering Matrix of the Single Step Discontinuity

C. Tomassoni, L. Marcaccioli, M. Dionigi, M. Mongiardo, R.V. Gatti, R. Sorrentino

THIF-5: A Linear Inverse Space Mapping Algorithm for Microwave Design in the Frequency and Transient Domains

J.E. Rayas-Sanchez, F. Lara-Rojo, E. Martinez-Guerrero

THIF-6: A Parametric Approach to Construct Two-Variable Positive Real Impedance Functions for the Real Frequency Design of Mixed Lumped-Distributed Matching Networks

A. Aksen, H. Pinarbasi, B.S. Yarman

THIF-7: Full-Wave Boundary Contour Mode-Matching Analysis and CAD of Cavities with Partial Height Post and Rounded Corners for Sophisticated Conductor Loaded Cavity and Combline Filter Designs

R. Beyer, J.M. Reiter, U. Rosenberg

THIF-8: Student Paper: Optimization of 3D Multilayer RF Components Using the Design of Experiments (DOE) Technique

N. Bushyager, D. Staiculescu, M. Tentzeris, A. Obatoyinbo

THIF-9: Student Paper: Analysis of ACPR Performance for Memoryless Predistorter Considering Power Amplifier Memory Effects

H. Ku, J.S. Kenney

THIF-10: Student Paper: The Influence of Transistor Nonlinearities on Intrinsic Noise

S. Lee, K. Webb, L. Eastman

THIF-11: Power Amplifier Linearization Using Memory Polynomial Predistorter with Non-uniform Delay Taps

A.M. Ahmed, M. Endalkachew, G. Kompa

THIF-12: Noise Analysis of Modulated Self-oscillating Mixers

S. Sancho, E. de Cos, A. Suarez

THIF-13: U-style Rotary Joint with E01 Mode for Milimeter-waves

V.I. Abramov, H.-J. Park, D.-H. Kim, T.-H. Lee

THIF-14: New Type of MMIC Reduced-Size Shunt/Series Stubs

K. Hettak, K. Verver, M.G. Stubbs, G.A. Morin

THIF-15: A Novel Wide Band 180-Degree Phase Shift Transition on Multilayer Substrates

P. Mousavi, R. Mansour, M. Daneshmand

THIF-16: A Novel Microstrip Line Backward Directional Coupler with High Directivity

Y.-H. Chun, J.-K. Rhee, J.-Y. Moon, S.-W. Yun

THIF-17: A Design of Single and Multi-Section Microstrip Directional Coupler with the High Directivity

C.-S. Kim, D.-J. Kim, D. Abn, J.-S. Lim

THIF-18: A Multi-state Isolator Using Ferrite Edge-mode

T. Kodera

THIF-19: Student Paper: Perturbation Theory Approach to the Ferrite Coupled Stripline

M. Cao, H.C. Wu, R. Pietig, R.G. Gossink

THIF-20: Integration of Parallel-plate Ferroelectric Varactors with BCB-on-silicon Microstrip Circuits

D. Kuylenstierna, A. Vorobiev, S. Gevorgian

THIF-21: Enhancement of Design Parameters for Tunable Ferromagnetic Composite-Based Microwave Devices: Application to Filtering Devices

E. Salahun, G. Tanne, P. Queffelec

THIF-22: Characterization of Thin Ferroelectric Films for Tunable Microwave Devices--Result Analysis According to the PLD Deposit Conditions

J.-F. Seaux, D. Cros, V. Madrangeas, T. Delage, C. Champeaux, A. Catherinot

THIF-23: Large Tuning Range Analog and Multi-bit MEMS Varactors

J. Muldavin, S. Rabe, C. Bozler, C. Keast

THIF-24: Student Paper: Atomic Layer Deposition of Al203/ZnO Nano-scale Films for Gold RF MEMS

F.W. DelRio, C. Herrmann, N. Hoivik, S. George, V. Bright, J. Ebel, R. Strawser, R. Cortez, K. Leedy

THIF-25: Low Phase Noise 70 MHz Micromechanical Reference Oscillators

W.-T. Hsu, J. Clark, K. Cioffi

THIF-26: A DC to 100 GHz High Performance Ohmic Shunt Switch

D. Mercier, P. Berruyer, P. Blondy, P.L. Charvet, C. Zanchi, L. Lapierre, O. Vendier, J.-L. Cazaux

THIF-27: Student Paper: A W-band Surface Micromachined Monopole for Low-cost Wireless Communication Systems

B. Pan, Y.-K. Yoon, P. Kirby, J. Papapolymerou, M. Tentzeris, M. Allen

THIF-28: Student Paper: Asperity Heating for Repair of Metal Contact RF MEMS Switches

B. Jensen, K. Huang, L. Chow, K. Saitou, K. Kurabayashi, J. Volakis

THIF-29: Student Paper: Initial Observation and Analysis of Dielectric-Charging Effects on RF MEMS Capacitive Switches

X. Yuan

THIF-30: The Efficiencies of the Class-F and Inverse Class-F Amplifiers

A. Inoue, A. Ohta, S. Goto, T. Ishikawa, Y. Matsuda

THIF-31: Analysis and Design of Coupled Line Impedance Transformers

K.S. Ang, C.H. Lee, Y.C. Leong

THIF-32: Temperature Effect on Power Characteristics of SiGe HBTs

A.-S. Peng, K.-M. Chen, G.-W. Huang, M.-H. Cho, S.-C. Wang, Y.-M. Deng

THIF-33: Student Paper: A New Class of Selective Filters Using Low-Q Components Suitable for MMIC Implementation

A.C. Guyette, I. Hun

THIF-34: Student Paper: Novel Detector Structure for Automatically Tuned Filters at Microwave Frequencies

E. Neber, L. Billonnet, B. Jarry, M. Hoffmann

THIF-35: A Novel Microstrip Bandpass Filter Having Plural Transmission Zeros Using a Capacitive-Inductive-Capacitive Configuration

Y. Horii

THIF-36: Student Paper: Dual-band Microstrip Bandpass Filter Design

H.-M. Lee, C.-R. Chen, C.-C. Tsai, C.-M. Tsai

THIF-37: Student Paper: Filter Integration Using On-chip Transformers

A.H. Aly, D. Beishline, B. El-Sharawy

THIF-38: Student Paper: Improved Coupled-Line Filter Design Using Effective Even-Mode and Odd-Mode Characteristic Impedances

H.-M. Lee, C.-C. Tsai, C.-M. Tsai

THIF-39: Novel Inductance-incorporated Microstrip Coupled-line Bandpass Filters with Two Attenuation Poles

C.H. Chen, Y.-S. Lin, C.-H. Wang

THIF-40: A Design of a Miniaturized 2-pole Bandpass Filter by Using a Slot and a Hair-pin line

C.-S. Kim, J.-H. Kim, D. Ahn, J.-S. Lim

THIF-41: A New Microstrip Hairpin Diplexer Based on Stepped-Width

M. Chongcheawchamnan, S. Srisathit, S. Patisang, S. Kosalvit

THIF-42: Student Paper: Novel Design Approach or Transversal Notch Filter

A. Benoit, B. Laurent, J. Bernard

THIF-43: Liquid Crystalline Polymer (LCP) Based Lumped-Element Bandpass Filters for Multiple Wireless Applications

S.S. Dalmia, V. Sundaram, M. Swaminathan, G. White

THIF-44: A 30 GHz-band Oscillator Coupled with a Dielectric Resonator Using Flip-chip Bonding Technique

M. Ito, K. Marubashi, S. Kishimoto, T. Hashiguchi, K. Ohata

THIF-45: Push-Push X Band GaInP/GaAs VCO with a Fully Monolithic Microstrip Resonator

C. Florian, M. Pirazzini, R. Cignani

THIF-46: An X-band CMOS Quadrature Balanced VCO

S. Ko, H.D. Lee, D.-W. Kang, S. Hong

THIF-47: Student Paper: New Planar High-Q Active Resonator and Its Application to Low Phase Noise Oscillators

Y.-T. Lee, J. Lee, S. Nam

THIF-48: High Performance Frequency Hopping Transmitters Using Two-Point Delta-Sigma Modulation

K.-C. Peng, C.-H. Huang, C.-N. Pan, T.-S. Horng

THIF-49: Student Paper: Investigations on Noise-Suppression Effects of Nonlinear Feed-Back Loops in Microwave Oscillators

T. Banky, T. Berceli

THIF-50: A UHF Band Digital Predistortion Power Amplifier Using Weight Divided Adaptive Algorithm

K. Horiguchi, M. Miki, J. Nagano, H. Senda, K. Yamauchi, M. Nakayama, T. Takagi

THIF-51: Design of Push-Pull Amplifier Using Slot Line Balun

H.T. Jeong, H.S. Lee, S.W. Kim, I.S. Chang

THIF-52: Student Paper: Linear Power Amplifier Based on 3-Way Doherty Amplifier with Predistorter

B. Shin, J. Cha, J. Kim, Y.Y. Woo, J. Yi, B. Kim

THIF-53: Channel Temperature Model for Microwave AlGaN/GaN Power HEMTs on SiC and Sapphire

J. Freeman

THIF-54: Student Paper: High Efficiency Current-Mode Class-D Amplifier with Integrated Resonator

T.-P. Hung, A. Metzger, P. Asbeck, M. Iwamoto

THIF-55: Thermal Resistance Calculation of AlGaN/GaN on SiC Devices

A. Darwish

THIF-56: Microwave Radiation Force on a Parallel-plate Resonator

S.N. Makarov, S. Kulkarni, A. Berezin

THIF-57: Enhancement of Power Amplifier Efficiency Through Dynamic Bias Switching

A. Khanifar, M. Gurvich

THIF-58: Transmission of Multiple Wireless Standards over a Radio-over-Fiber Network

P.K. Tang, M.L.C. Ong, B. Luo, A. Alphones, M. Fujise

THIF-59: 60 GHz Guided-wave Electro-optic Modulator Using Novel Electrode Structure of Coupled Microstrip Line Resonator

A. Enokihara, H. Furuya, H. Yajima, M. Kosaki, H. Murata, Y. Okamura

THIF-60: Demonstration of 26 GHz Signal Optical Fiber Transmission by Use of Guided-Wave Electro-optic Single-Sideband Modulators with Periodically Polarization-Reversed Schemes

H. Murata, Y. Okamura, H. Sasai, A. Enokihara

THIF-61: Dental Diagnosis and Treatment Using Microwaves

Y. Nikawa, K. Kawai

THIF-62: Broadband Photonic Bandgap Waveguides

P. Young, S. Tse

ARFTG 63RD MICROWAVE MEASUREMENT CONFERENCE MEASUREMENT ACCURACY FRIDAY, JUNE 11 * RADISSON HOTEL 7:00 AM TO 4:00 PM EXHIBITION AND INTERACTIVE FORUM 7:00 TO 8:00 AM CONTINENTAL BREAKFAST 7:00 TO 8:00 AM SPEAKER'S BREAKFAST 8:00 TO 9:45 AM TECHNICAL SESSION 1 9:45 TO 10:30 AM EXHIBITION/POSTER SESSION 10:30 AM TO 12:00 NOON TECHNICAL SESSION 2 12:00 NOON TO 1:15 PM LUNCHEON 1:15 TO 3:00 PM TECHNICAL SESSION 3 3:00 TO 3:45 PM EXHIBITION/POSTER SESSION 3:45 TO 5:00 PM TECHNICAL SESSION 4

RELATED ARTICLE: MICROWAVE APPLICATIONS & PRODUCT SEMINARS ([micro]APS)

TUESDAY, JUNE 8, 9:30 AM TO 5:00 PM

Next Generation DAC Technology-Frequency Planning, P. MADDOX; Atmel's Frequency Conversion Products in SiGe Technology, G. BERGMAN, U. KATHAUS; Band Chipset for Wideband Communication Links (71-76 and 81-86 GHz), M. SIDDIQUI, K. JOHNSON, B. PITMAN, S. DIN, S. CHI, W. DEAL, D. BRUNONE, M. QUIJJE, L. CALLEJO, R. LAI; Power Amplifiers for Broadband Internet Access, R. K. GUPTA; Low Phase Noise High Frequency OCXO, R. BORODITSKY; The Opto-Electronic Oscillator, D. FUNG; Infineon's New Generation SiGe:C Ultra Low Noise Transistors BFP740, C. AHRENS; HMC465 MMIC 0-20 GHz Distributed Driver Amplifier, M. FALLICA; Hittite's New Direct Quadrature Modulators, M. OLSON; Fabrication of RF Microwave Devices Using Thermally Bonded Silicon Wafers, I. BANSAI; Millimeter-wave Linear and QPSK Phase Modulators, T.T. CHILDS

1:40 TO 2:40 PM

W-band Patch Antennas, S. Vahja; Miniature Microwave Thin Film Filters on Hi-K Ceramic, D. BATES; Ultra-low ESR SMT Capacitors Improve Power Amplifier Performance, D. BATES

2:40 TO 4:20 PM

Miniature Broadband Diplexer for CATV/SAT Applications, E. LIANG; Breakthrough in RF High Power Plastic Packaging (200[degrees]C Junction Temperature), D. ABDO, F. DANAHER, A. ELLIOT, M. MAHALINGAM; Guidelines for Use of Surface Mount Power Devices, M. SHAH, R. WETZ, D. ABDO; Low Cost Air Cavity LCP (Liquid Crystal Polymer) Packaging, M. ZIMMERMAN; Premolded Liquid Crystal Polymer Air Cavity Packages with Integrated Impedance Matching for Power Amplifiers, J. W. ROMAN

4:20 TO 4:40 PM

Connecting Business-ELVA Family of Broadband mm-wave Radios, D. KORNEEV

4:40 TO 5:00 PM

High Power RF LDMOS Devices Using Low Thermal Resistivity Package and Thin Die, T. WEI, D. FOWLKES, G. MA, J. OLSON, H. HOYER, N. DIXIT

WEDNESDAY, JUNE 9, 2004, 9:30 AM TO 4:40 PM

Artificial Neural Network (ANN) Model Generator Circuit Simulation and Design Tool, M. RINNE; WASP-NET Microwave Component Design New Advances, F. ARNDT; Automatic Generation of Neural Models for Microwave Components, Q.J. ZHANG; CONCERTO 3D Microwave Software, C. EMSON; Microwave Wizard-Design Solutions Based on Mode Matching Techniques, S. BEYER, J.M. REITER; Advanced Modeling Tools Available with GENESYS 2003.10, B. CLAUSEN; Behavioral Modeling for Black Box RFIC Amplifiers, L. DUNLEAVY, B. CLAUSEN, J. CAPWELL; Efficient Transient Simulations of Microwave Devices Specified by Frequency Dependent S-parameters, E. WASSERMAN, D. NEILSON, T. QUAN; The New SmartGrid[R] Technology in CST MICROWAVE STUDIO v5, J. OAKLEY; Recent Developments in QuickWave Software, M. CELUCH; The 2.5D and Full 3D EM Simulation in the IE3D EM Simulation and Optimization Package, J.-X. ZHENG; CAD MMIC Design Methodologies, B. CHRISTOPHE

2:00 TO 2:40 PM

Microwave Multilayer Printed Circuit Boards, E. SANDOR; Complete Low Loss LTCC Material Systems for High Frequency Microwave Applications, J.D. VOULTOS

2:40 TO 4:40 PM

New Spectrum Analysis Techniques Prove Successful in Emerging RF Applications, K. COBLER; Large Signal Network Analyzer (LSNA), M.V. BOSSCHE, G. SIMPSON; Bridging the Last Mile: Recent Advances in Load Pull Instrumentation, G. SIMPSON, J. SEVIC; Introducing the Dual/Differential Infinity Probe, T. ALAM; Eliminating Environmental Factors from the Test Process, B. HANNA; Frequency Selective Tuner (FST) for Harmonic Load Pull Testing, C. TSIRONIS

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Publication: | Microwave Journal |
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Date: | May 1, 2004 |

Words: | 14498 |

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