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iNEMI Workshop on Availability of SnPb-Compatible BGAs Rescheduled.


Workshop Will Be Held March 1 in Cupertino Cu·per·ti·no  

A city of western California west of San Jose. It has an electronics industry. Population: 50,000.
, Calif.

HERNDON, Va. -- The International Electronics Manufacturing This article presents a typical manufacturing process of an electronic assembly. Component manufacturing
Components such as resistors, capacitors and integrated circuits are generally made by specialized contractors.
 Initiative's (iNEMI's) workshop on the availability of SnPb-compatible BGAs, originally scheduled for January 24, has been moved to Thursday, March 1, to allow greater participation of the global supply base. The meeting will be hosted by iNEMI member, Hewlett-Packard, at its Cupertino campus (19483 Pruneridge Avenue, Building 48).

This important workshop is being organized by iNEMI's SnPb BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used.  Availability Task Group and is intended to facilitate discussion among high-reliability electronic product manufacturers and makers of electronic components manufactured in ball grid array “BGA” redirects here. For other uses, see BGA (disambiguation).

A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits.
 (BGA) packages, in an effort to initiate closer collaboration Working together on a project. See collaborative software.  within the supply chain.

The reliability of Pb-free assembly has not been sufficiently demonstrated for long-life, mission-critical applications, and many of the manufacturers who produce these types of products will continue to use SnPb processes until Pb-free reliability can be predicted with the same certainty as SnPb assembly. However, BGA suppliers are rapidly converting to Pb-free packages, and this rapid transition of the supply chain to meet the high-volume needs of consumer electronics is affecting the availability of SnPb versions of critical components. The use of Pb-free connection finishes often presents compatibility issues -- especially with BGAs -- for those manufacturers who plan to continue using SnPb assembly processes.

"This workshop is not intended to develop technical engineering solutions," said Jun Ma, director, supplier engineering at Sun Microsystems Sun Microsystems, Inc. (NASDAQ: JAVA[3]) is an American vendor of computers, computer components, computer software, and information-technology services, founded on 24 February 1982. , and co-chair of the iNEMI SnPb BGA Availability Task Group. "Instead, our goal is to bring together decision-makers to discuss how OEMs, EMS providers and the BGA component supply base can work together to support SnPb-compatible BGAs, assist with questions of long-term Long-term

Three or more years. In the context of accounting, more than 1 year.


long-term

1. Of or relating to a gain or loss in the value of a security that has been held over a specific length of time. Compare short-term.
 reliability, and/or develop other solutions to address general availability concerns."

"OEMs and EMS providers want device makers to understand the extent and criticality of the need for SnPb BGAs until reliability concerns are resolved," said Ken Stuchlik, SCN SCN Scan
SCN Sustainable Communities Network
SCN System Change Number (Oracle)
SCN Scientology
SCN Suprachiasmatic Nucleus
SCN Switched Circuit Network
SCN Standing Committee on Nutrition (UN) 
 processor and I/O (Input/Output) The transfer of data between the CPU and a peripheral device. Every transfer is an output from one device and an input to another. See PC input/output.

I/O - Input/Output
 technical manager for Alcatel-Lucent, and co-chair of iNEMI's task group. "At the same time, device makers need users to understand and appreciate the full impact of maintaining a dual supply chain for a relatively small portion of the device business. Our goal is to bring everyone together in this workshop to discuss their concerns and find ways to resolve the issues to the benefit of all stakeholders Stakeholders

All parties that have an interest, financial or otherwise, in a firm-stockholders, creditors, bondholders, employees, customers, management, the community, and the government.
."

iNEMI's SnPb BGA Availability Task Group has assembled as·sem·ble  
v. as·sem·bled, as·sem·bling, as·sem·bles

v.tr.
1. To bring or call together into a group or whole: assembled the jury.

2.
 information that will be shared with BGA device makers, including:

* a list of critical BGA component families;

* estimated total available market (TAM) for these devices in SnPb assembly versions;

* a general business case based on TAM; and

* scenarios to support this critical market need until reliability issues are resolved for high-reliability, long-life electronic assemblies.

Workshop registration information and directions are available at http://www.inemi.org/cms/projects/ese/SnPb_BGAs.html

About iNEMI

The International Electronics Manufacturing Initiative's mission is to identify and close technology gaps, which includes the development and integration of the electronics industry supply infrastructure. Based in Herndon, Va., this industry-led consortium is made up of approximately 70 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. For additional information about iNEMI, visit www.iNEMI.org.
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Copyright 2006, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Date:Dec 18, 2006
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