iNEMI Kicks Off 2007 Roadmap at Printed Circuits Expo / APEX / Designer Summit Conference; iNEMI Project Activities and Results Will Also Be Discussed.HERNDON, Va. -- The International Electronics Manufacturing This article presents a typical manufacturing process of an electronic assembly. Component manufacturing Components such as resistors, capacitors and integrated circuits are generally made by specialized contractors. Initiative (iNEMI), an industry-led consortium, will kick off its 2007 Roadmap February 6-7 in Anaheim, Ca. The meeting is co-located with SMEMA SMEMA Surface Mount Equipment Manufacturers Association (Association of SMT board assemblers) Council's Printed Circuits Expo / APEX / Designer Summit. In addition, several iNEMI project activities and results will be discussed in conference forums and technical sessions. "This meeting kicks off the work of the Technology Working Groups (TWGs), which provide the core chapters of the iNEMI Roadmap," said Jim Arnold, fellow of the Motorola technical staff and iNEMI's director of roadmapping. "The day-and-a-half session gives the people who are responsible for developing the individual roadmap chapters an opportunity to meet face-to-face and to discuss many of the 'cross-cutting' issues that affect the technology and infrastructure areas covered. It gives everyone some 'context' for their specific chapters, and is a very productive way to begin this important work." Every two years, iNEMI maps the future manufacturing technology needs of the global electronics industry. The roadmap helps companies anticipate shifts in product requirements and provides an early warning of changes in technology or infrastructure. It is recognized not only as an important tool for defining the "state of the art" in the electronics industry, but also for identifying emerging and disruptive technologies A new technology that has a serious impact on the status quo and changes the way people have been dealing with something, perhaps for decades. Music CDs all but wiped out the phonograph industry within a few years, and digital cameras are destined to eliminate the film industry. . In addition, the roadmap fuels development of future iNEMI projects and sets priorities for industry R&D over the next 10 years. iNEMI is currently recruiting industry experts to participate in the 2007 Roadmap. iNEMI membership is not required for participation and, in fact, Arnold says broad participation is encouraged to be sure that the final document accurately reflects the requirements and needs of industry. "By soliciting input from a diverse mix of OEMs, EMS providers, suppliers and R&D institutes, we help ensure that the roadmap will be useful to industry," says Arnold. "We are also actively recruiting participation from Europe and Asia to make sure that we have a global perspective." For additional details about the meeting (including a preliminary agenda), and to download a registration form, go to http://www.inemi.org/cms/calendar/APEX_2006_Roadmap_2007_Mtg.html Other iNEMI Meetings & Presentations iNEMI Halogen-Free Call for Participation Meeting Wednesday, February 8, 8:00 a.m.-noon, Disney's Paradise Pier Paradise Pier is the home to the fun and thrill attractions at Disney's California Adventure Park, one of two theme parks at the Disneyland Resort. With California Screamin' covering the majority of the land, there are various areas of entertainment for Guests of all ages. Hotel, Redondo Room This is an organizational meeting for iNEMI's new halogen-free effort. The objective of this new initiative is to promote standards development by establishing materials, manufacturing, assembly and test guidelines guidelines, n.pl a set of standards, criteria, or specifications to be used or followed in the performance of certain tasks. for halogen-free printed wiring boards based on market segment requirements and technical, commercial and functional viability. F01 -- iNEMI Lead-Free and RoHS Update Wednesday, February 8, 10 a.m.-noon, convention center This session will review iNEMI's activities and recent findings in the areas of lead-free wave soldering Applying liquid solder to the underside of printed circuit boards in order to bond the chips and discrete components that are placed on top of the board and whose metal leads (pins) extend through the board. , lead-free substrate The base layer of a structure such as a chip, multichip module (MCM), printed circuit board or disk platter. Silicon is the most widely used substrate for chips. Fiberglass (FR4) is mostly used for printed circuit boards, and ceramic is used for MCMs. surface finishes, halogen-free PWBs and lead-free BGAs in SnPb assemblies. In addition, the session will discuss details of IPC-1752, Materials Declaration Management, which defines an industry-standard data collection process flow and data format for material composition data exchange, and will review current iNEMI activities to ensure rapid adoption of this new standard. S04 -- Tin Whiskers See metal whiskers. Wednesday, February 8, 10:00-11:00 a.m., convention center This session, which provides a comprehensive summary of all the latest information on tin whisker growth, fundamentals and mitigation strategies, includes recommendations from the iNEMI Tin Whisker User Group regarding lead-free finishes for components used in high-reliability products. F02 -- Roadmapping Interconnect (1) To attach one device to another. (2) A physical port (plug, socket) or wireless port (transmitter, receiver) used to attach one device to another. Technology 2006 Wednesday, February 8, 1:30-3:00 p.m., convention center This session will discuss interconnect technology roadmapping. The IPC (1) (InterProcess Communication) The exchange of data between one program and another either within the same computer or over a network. It implies a protocol that guarantees a response to a request. International Technology Roadmap The context of product management The existence of product managers in the product software industry indicates that software is becoming more and more commercialized as a standard product. will be the primary focus, but the iNEMI, ITRS ITRS International Technology Roadmap for Semiconductors ITRS International Terrestrial Reference System ITRS International Transaction Reporting System (EU) ITRS International Technical Rescue Symposium and JISSO roadmaps will also be discussed. F03 -- Copper vs Optoelectronics in PCBs Thursday, February 9, 9:00-10:00 a.m., convention center In order for the optoelectronics industry to meet its cost and performance targets, the PCB PCB: see polychlorinated biphenyl. PCB in full polychlorinated biphenyl Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound. must be able to carry both electrons and photons in the same substrate. The iNEMI Optoelectronics for Substrates Project investigated the use of optical waveguides in or on PCBs to determine how far copper can be pushed. The team completed a business analysis of copper vs. optoelectronics using a communications industry communications industry, broadly defined, the business of conveying information. Although communication by means of symbols and gestures dates to the beginning of human history, the term generally refers to mass communications. backplane An interconnecting device that has sockets for printed circuit boards to plug into. Passive and Active Although resistors may be used, a "passive" backplane adds no processing in the circuit. as the basis for the analysis. This session presents results to date. iNEMI Medical TIG n. 1. A game among children. See Tag. 2. A capacious, flat-bottomed drinking cup, generally with four handles, formerly used for passing around the table at convivial entertainment. / Medical Components Standards Initiative Thursday, February 9, 8:00 a.m.-noon, Disney's Paradise Pier Hotel, Crystal Cove Room The new iNEMI Medical Technology Integration Group (TIG) is focused on the needs and requirements of high-reliability medical components. This meeting will discuss plans for a proposed project to develop production standards for medical grade components as well as other potential projects. IPC-2581 Industry Adoption Thursday, February 9, 1:30-3:30 p.m., Disney's Paradise Pier Hotel, Crystal Cove Room iNEMI's Data Exchange Convergence Project developed a recommendation for an XML-based data exchange format that "converged" IPC's GenCAM with Valor's ODB ODB Our Daily Bread ODB Object Database ODB Old Dirty Bastard (Wutang clan & rap group) ODB Old Dirty Bastard ODB Open Database ODB Ontario Drug Benefits ODB Cordoba Spain (airport code) ++ to create a single format. This recommendation led to IPC-2581 ("Offspring"), Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology. iNEMI is organizing a follow-on effort to help ensure rapid adoption of this new standard. iNEMI plans to bring together users and suppliers to encourage, evaluate and promote effective solutions that meet the requirements of IPC-2581. iNEMI Pb-Free DPMO DPMO Defects Per Million Opportunities (Six Sigma) DPMO Deployment Process Modernization Office DPMO Defense Prisoner of War (POW)/Missing Personnel (MP) Office Project Thursday, February 9, 1:30-5:00 p.m., Disney's Paradise Pier Hotel, Monterey Room This organizational meeting will discuss new iNEMI efforts to compile Pb-free DPMO rates for printed circuit boards, focusing on DPMO data by package and technology type. About the iNEMI Roadmap Roadmap efforts are organized into Product Emulator Groups (PEGs) and Technology Working Groups (TWGs). The five PEGs, each chaired by a major OEM (Original Equipment Manufacturer) The rebranding of equipment and selling it. The term initially referred to the company that made the products (the "original" manufacturer), but eventually became widely used to refer to the organization that buys the products and in the specific sector covered, define the future technology needs of "virtual products" from five areas: 1) portable/consumer, 2) office/large business systems, including netcom (network/datacom/telecom), 3) automotive, 4) aerospace/defense, and 5) medical products. Each PEG chapter forecasts future product attributes, including cost and density drivers. The TWGs forecast trends for 19 technology and infrastructure areas, and contrast technology trends with anticipated product needs. Composed of experts from OEMs, EMS providers, suppliers, government agencies, universities and related consortia/trade associations, the TWGs predict the evolution of technology and/or business practices, identify gaps and "showstoppers" in existing technology and infrastructure, and develop recommendations for their respective areas. For more information about the 2007 iNEMI roadmap, go to http://www.inemi.org/cms/roadmapping/2007_iNEMI_Roadmap.html The PEGs and TWGs typically meet by teleconference, sometimes as often as once a week. Limited travel is required of the group chairs, and there are only two face-to-face meetings scheduled that include all PEG and TWG TWG Technical Working Group TWG Thematic Working Group (WHO) TWG Trans World Group (base metals traders) TWG Terlato Wine Group TWG Training Working Group TWG Transition Working Group members (this kick-off meeting and a review meeting, which has been scheduled for May 17 at iNEMI's headquarters in Herndon, Va.). About iNEMI The International Electronics Manufacturing Initiative's mission is to assure leadership of the global electronics manufacturing supply chain. Based in Herndon, Va. (in the Washington, DC area), the industry-led consortium is made up of approximately 70 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. For additional information about iNEMI, visit www.inemi.org. VISIT iNEMI at APEX Booth #792 |
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