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Browse de Tino, Ursula Marquez 1-8 out of 8 article(s) Title Type Date Words Reflow environment effects on OSP board solderability: nitrogen helps, but is best only in reflow areas. Feb 1, 2009 545 Analyzing Pb-free defects using partial DoE; Optimal assemblies don't come about drop-in materials replacement. Dec 1, 2008 756 DPMO analysis implementation: yield improvement is one good way to reduce costs. May 1, 2008 714 Soldering atmosphere's impact on solder joint formation: a Flextronics-Vitronics study finds the delivery method's impact is minimal. Mar 1, 2008 701 Breaking the tape: a high-mix, high-rel EMS finds selective tops masking and taping. Feb 1, 2008 571 Selective soldering with Pb-free alloys: the new family of solders flows differently through the nozzles. Jan 1, 2008 554 The glowing dross residues phenomenon: when black powdery oxides are present, a slow exothermal reaction takes place. Dec 1, 2007 580 General settings for a wave process: machine and product aspects must fit to ensure the best joints. Nov 1, 2007 1102

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