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Xilinx announces industry's lowest cost configuration solution.


Xilinx Inc. (Nasdaq:XLNX) has announced a new family of low cost, in-system programmable Refers to programmable logic chips (PLDs) that are programmed after they are attached to the circuit board. Also called "in-circuit programmable," devices that use static RAM (SRAM) are in-system programmable by nature because they are loaded at startup. See PLD.  PROMs for configuration of Xilinx FPGAs. The new Platform Flash PROMs provide the industry's lowest cost per megabit for FPGA (Field Programmable Gate Array) A type of gate array that is programmed in the field rather than in a semiconductor fab. Containing up to hundreds of thousands of gates, there are a variety of FPGA architectures on the market.  configuration storage and are available in a range from 1 to 32 Mbits. Offered in two ultra-small packages, including a 6.4mm x 6.5mmVO20 TSSOP TSSOP Thin Shrink Small Outline Package
TSSOP Thin Scale Small Outline Package
 and a 8mm x 9mm FS48 thin flat ball grid array “BGA” redirects here. For other uses, see BGA (disambiguation).

A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits.
, the Xilinx Platform Flash PROM family also provides the smallest footprint in the industry.

The Platform Flash product consists of six devices, all implemented in flash technology for full in-system reprogrammability. The 1, 2, and 4 Mbit densities are available in the VO20 package and support serial configuration for all Xilinx FPGAs. The 8, 16, and 32 Mbit versions are available in the FS48 package, and support both serial and parallel configuration modes. The larger density devices also support advanced compression technology that provides for storage of up to 50% more bits, allowing the use of a smaller density, lower cost PROM.

"Our customers asked for configuration PROMs at a very low price, coupled with in-system programmability and a small footprint," said Mustafa Veziroglu, general manager of the Configuration Solutions Division at Xilinx. "To meet this demand, we have driven down costs and developed innovative packaging solutions to deliver a flexible configuration solution for all Xilinx FPGAs.

The Platform Flash PROMs comply with the industry standard IEEE (Institute of Electrical and Electronics Engineers, New York, www.ieee.org) A membership organization that includes engineers, scientists and students in electronics and allied fields. 1532 interface, allowing designers to use existing equipment to program and test the PROMs. With the higher density devices, designers can program multiple designs into a single PROM, allowing one PROM to support multiple FPGAs in a daisy-chain configuration, thereby reducing part count and component costs. The high-density devices also offer `Design Revisioning' capabilities, allowing customers to use the same board level product and components for multiple applications, reducing manufacturing and inventory costs.

The 1 Mbit XCF XCF eXperimental Computing Facility (graphics software for Irix SGI; file extension)
XCF Cross-System Coupling Facility
XCF X-Ray Crystallography Facility
XCF Xenos Christian Fellowship
XCF Xilinx Constraint File
XCF Xml Companion File
01S, available in May 2003, is priced at $1.05 for 100K units in 2005. The 32 Mbit XCF32P, available by Q4 of 2003, is priced at $10.40 for 100K units in 2005. Programming support for the Platform Flash PROMs is available within Xilinx PROM programming equipment and cables, as well as the iMPACT software in the Xilinx ISE Ise (ē`sā), city (1990 pop. 104,164), Mie prefecture, S Honshu, Japan, on Ise Bay. It is one of the foremost religious centers of Shinto, the site of the shrines of Ise.  development tools.
COPYRIGHT 2003 Millin Publishing, Inc.
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2003, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Publication:EDP Weekly's IT Monitor
Geographic Code:1USA
Date:May 5, 2003
Words:375
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