Xanoptix Changes its Name to Xan3D Technologies to Better Reflect Underlying Technology.MERRIMACK, N.H. -- Xan3D Technologies will continue to lead the industry in 3D semiconductor integration and transceiver hybrid integrated circuits A Hybrid Integrated Circuit, Hybrid Circuit, or simply Hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors and diodes) and passive components (e.g. . Xanoptix(R), a technology leader in 3D semiconductor integration and transceiver hybrid integrated circuits for high-density parallel optics modules, today announced it has changed its corporate name to Xan3D Technologies(TM). "We chose to rename Re`name´ v. t. 1. To give a new name to. Verb 1. rename - assign a new name to; "Many streets in the former East Germany were renamed in 1990" our company to more clearly reflect our core technology of the most advanced three-dimensional integration available for semiconductor technology," said Russ Johnsen, Executive Chairman of Xan3D Technologies. " Utilizing our semiconductor technology and manufacturing processes we will continue to offer the Xan-Optix Transceiver Integrated Circuit integrated circuit (IC), electronic circuit built on a semiconductor substrate, usually one of single-crystal silicon. The circuit, often called a chip, is packaged in a hermetically sealed case or a nonhermetic plastic capsule, with leads extending from it for , as well as other design and manufacturing solutions for high-density three-dimensional integrated circuits Integrated circuits Miniature electronic circuits produced within and upon a single semiconductor crystal, usually silicon. Integrated circuits range in complexity from simple logic circuits and amplifiers, about 1/20 in. (1. ." Xan3D's unique integration process provides significant, inherent benefits such as: high connection density, up to 8 million contacts per square centimeter, material flexibility, compatibility with semiconductor and optoelectronic processes, robust thermal properties, shear strengths of 1,600 kg/cm2, scalability, and cost-efficient manufacturability. About Xan3D Technologies Xan3D commercializes a revolutionary new approach to semiconductor manufacturing - chip level direct die-to-die interconnection of integrated circuits, allowing system designers a modular building Modular buildings are sectional prefabricated buildings that are manufactured in a plant, and delivered to the customer in one or more complete modular sections. Modular buildings are considerably different from mobile homes. block approach for chip level solutions. Utilizing this Chip Stacking Technology to combine silicon integrated circuits and/or compound semiconductors, Xan3D offers cost effective die integration services to component and system owners. Xan3D is headquartered in Merrimack, NH, where the company performs all product design, development, and manufacturing. Xan3D, the Xan3D logo, and XTM XTM XML Topic Maps XTM Experimental Test Model are trademarks of Xan3D. All other trademarks and service marks are the property of their respective owners. |
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