X-FAB Announces Major Technology Advancements in BiCMOS Platform to Enable New Optoelectronics Applications.Innovative Light Shield Module, Blue PIN Diode A PIN diode is a diode with a wide, undoped intrinsic semiconductor region between p-type semiconductor and n-type semiconductor regions.A PIN diode obeys the standard diode equation only for very slow signals. and Other Options Deliver "More than Moore" for Optoelectronics Market ERFURT, Germany -- X-FAB Silicon Foundries, the leading analog/mixed-signal foundry and expert in "More than Moore" technologies, today announced five new options for its 0.6 micrometer micrometer (mīkrŏm`ətər, mī`krōmē'tər). 1 Instrument used for measuring extremely small distances. BiCMOS technology platform, two of which deliver first-of-a-kind capabilities for the emerging and rapidly expanding optoelectronics market. The technology advancements include a new, innovative and cost-efficient Light Shield module that overcomes previous barriers to better protect light-sensitive areas on a chip; and a new, sophisticated Blue pin module with especially high light sensitivity that approaches the theoretical limits. In addition, X-FAB announced a new Field Effect Transistor See FET. (electronics) field effect transistor - (FET) A transistor with a region of donor material with two terminals called the "source" and the "drain", and an adjoining region of acceptor material between, called the "gate". (FET FET: see transistor. (Field Effect Transistor) One of two major categories of transistor; the other is bipolar. FETs use a gate element that, when charged, creates an electromagnetic field that changes the conductivity of a silicon ) module for low-noise applications, a new polyimide Pronounced "poly-ih-mid." A type of plastic (a synthetic polymeric resin) originally developed by DuPont that is very durable, easy to machine and can handle very high temperatures. Polyimide is also highly insulative and does not contaminate its surroundings (does not outgas). option for compensation of mechanical stress, and Schottky diodes with enhanced forward current capabilities. All options are available now, and X-FAB believes no other foundry offers as wide a scope of capabilities for rapidly emerging optoelectronics applications. X-FAB's new Light Shield module enables the protection of light-sensitive areas on a chip by using a special protective layer of black resistive resistive /re·sis·tive/ (re-zis´tiv) pertaining to or characterized by resistance. on top of passivation passivation the final stage in instrument manufacture, passing the finished instruments through a bath of nitric acid which removes foreign particles and promotes the formation of a protective coating of chromium oxide. . Such protection is required for the non-light-sensitive parts of optoelectronic integrated circuits Integrated circuits Miniature electronic circuits produced within and upon a single semiconductor crystal, usually silicon. Integrated circuits range in complexity from simple logic circuits and amplifiers, about 1/20 in. (1. , and also can be used in bare-die or chip-on-board applications to cover the entire surface of the die. In contrast to the conventional way of protecting light sensitive parts by using an additional metal layer that reflects light, creating some interference and causing parasitic capacitances, X-FAB's light shield layer offers very low transmission reflection; approximately 95 percent of the visible light is absorbed. The new Light Shield module is also more cost-effective than other approaches for protecting circuits from light. X-FAB's new blue PIN module with a photodiode A light sensor (photodetector) that allows current to flow in one direction from one side to the other when it absorbs photons (light). The more light, the more the current. Used to detect light pulses in optical fibers and other light-sensitive applications, it works the opposite of a optimized for the blue light portion of the light spectrum is especially useful for Blu-ray applications. In addition, its sensitivity for other wavelengths up to 850 nanometers makes it ideal for applications from ultraviolet to infrared. X-FAB's junction FET module allows special transistors to be used for low-noise applications. A newly available polyimide option - a resilient barrier layer on top of the passivation - compensates for mechanical stress, or delamination delamination /de·lam·i·na·tion/ (de-lam?i-na´shun) separation into layers, as of the blastoderm. de·lam·i·na·tion n. 1. A splitting or separation into layers. 2. , between die and package during soldering. X-FAB also expanded its portfolio of primitive devices with additional Schottky diodes that are scaleable in layout and offer better current capability in forward mode. Dr. Jens Kosch, chief technical officer, said, "With our comprehensive BiCMOS platform, X-FAB offers a wealth of process options and primitive devices to address the broadest range of optical applications. Today's announcement demonstrates again X-FAB's expertise in delivering 'More than Moore' technologies for our customers." Availability The Light Shield process module is available now for X-FAB 0.6 micrometer BiCMOS technology. It will be available for all other X-FAB 0.6 micrometer technologies by the end of the year. The enhanced blue PIN option, polyimide layer, junction FET module and new Schottky diodes in the 0.6 micrometer BiCMOS technology (XB06) are available now. About X-FAB X-FAB is the leading analog/mixed-signal foundry group manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs). X-FAB maintains wafer production facilities in Erfurt and Dresden (Germany), Plymouth (UK), Lubbock, Texas (US) and Kuching, Sarawak (Malaysia), and employs approximately 2,600 people worldwide. Wafers are manufactured based on advanced modular CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes. and BiCMOS processes with technologies ranging from 1.0 to 0.18 micrometers, for applications primarily in the automotive, communications, consumer and industrial sectors. For more information, please visit www.xfab.com. |
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