Who's this issue's expert?Q: I am designing a PWB (Printed Wiring Board) An alternate term for printed circuit board. See printed circuit board. for a high power DC to DC converter In electronic engineering, a DC to DC converter is a circuit which converts a source of direct current (DC) from one voltage level to another. It is a class of power converter. . With a large array of solid state switches, heat generation will be a big issue. Are there board materials that can help with managing the heat? A: There are a lot of possible solution sets for management of heat, ranging from "active" heat sinks with coolant coolant (kōō´l  nt),n water or heat pipes to remove heat to PWB basics such as thermal vias and conventional heat sink technology. The most cost effective solution is to use the least exotic solution that will keep your expensive components from being fried when you power up and are operating at steady state. Arlon has two thermally conductive laminates that are specifically designed to help dissipate dis·si·pate v. dis·si·pat·ed, dis·si·pat·ing, dis·si·pates v.tr. 1. To drive away; disperse. 2. and remove the heat from a PWB. The first product, Arlon's 99ML, is a thermally conductive laminate laminate, n a thin slice of porcelain or plastic fabricated in a dental lab, which is cemented to the front of the teeth to cover gaps, whiten stained teeth, or reshape chipped or broken teeth. and prepreg product with a 170[degrees]C Tg and a thermal conductivity of over 1.0 W/m-K (about 4 times that of standard FR-4). By building a PWB with a thermally conductive material you will have a greater transfer of heat away from any "hot spots hot spots acute moist dermatitis. " on the board. A 5[degrees]C or greater reduction in surface temperature may be achievable by using a thermally conductive laminate system. The second product Arlon offers is a heat sink material, designated 99N, and is based on the same core chemistry as the 99ML, but designed to be a "No-Flow" prepreg for bonding PWB's to heat sinks. With a thermal conductivity of 1.2 W/m-K 99N moves heat from the base of the board where it has been ducted by thermal vias and within-board conduction conduction, transfer of heat or electricity through a substance, resulting from a difference in temperature between different parts of the substance, in the case of heat, or from a difference in electric potential, in the case of electricity. about 4x faster than conventional heat sink bonding prepregs such as Arlon's 47N or 49N. Removal of heat, resulting in lower surface temperatures, will continue to be a growing design consideration in the power industry as well as others. For additional information about Arlon solutions to your thermal problems, contact your Arlon sales or technical service representative or call Arlon directly at (909) 987-9533. Have a question: email us at experts@arlon-med.com Speak with an Arlon Laminate EXPERT at IPC/APEX--Booth # 1507 |
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