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Browse Westerlaken, Eli

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Title Type Date Words
Solder paste thixotropy impacts rheometric results: a sample preparation method reduces thixotropy's impact in paste testing. Reprint Jul 1, 2007 449
Running Pb-free reflow profiles without nitrogen: TGA/DSC data show paste can be used in extended reflow profiles with reduced [DELTA]Ts even at fast printing speeds. May 1, 2006 2932

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