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Browse Westby, George 1-4 out of 4 article(s) Title Type Date Words MLF assembly challenges: high-yield MLF assembly is possible with proper process controls. Oct 1, 2002 722 Substrates for flip chip assembly: optimize substrate design and technology selection to reduce assembly defect levels and overall substrate costs--before the production phase. Jun 1, 2002 623 Lead-free wave soldering: with the adoption of lead-free alloys in the electronics industry, soldering is the most critical assembly process! Apr 1, 2002 690 Optoelectronics development: with the surge of optoelectronics packaging, component alignment issues need to be resolved. Feb 1, 2002 712

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