WJ Communications Research Scientist to Present at Sixth International Electronic Materials and Packaging Conference -- EMAP 2004 -- Conducted by IEEE-CPMT.

SAN JOSE, Calif. -- WJ Communications, Inc (Nasdaq:WJCI), a leading designer and supplier of high-performance RF semiconductors and multi-chip modules (MCM), today announced that Mr. Satbir Madra, Senior Research Scientist at WJ, will present a technical paper at the Sixth International Conference on Electronic Materials and Packaging, to be held in Penang, Malaysia, December 5-7, 2004. This IEEE-CPMT sponsored conference will be held under the auspices of both academia and several key technology companies. Mr. Satbir's paper will also be available on the WJCI web site at www.wj.com/techpubs/index.asp.

The topic of Mr. Madra's presentation will be, "Fracture Mechanics and Thermomechanical Stresses in Thin-Film Alumina -- X-ray Diffraction and Correlation with Analytical and Finite Element Numerical Models."

Paper Synopsis: The nature and profile of thermomechanical stresses generated in high purity thin-film alumina for microelectronic packages have been characterized through X-ray diffraction (XRD) techniques using the sin2(psi) technique and X-ray elastic constants for residual stress determination. Fracture mechanics behavior was modeled using the stress intensity factors and compared to the modules of rupture (MOR) of the material to establish the fast fracture behavior. Analytical models -- Suhir model and Bernoulli models have been employed. Moreover, the generated stress has been determined numerically, using Finite Element Analysis. Excellent agreement was found between the experimental, analytical and numerical (FEA) results, allowing meaningful failure predictions through fast fracture and cumulative fatigue failure events.

Author Profile: Mr. Satbir Madra is a Senior Research Scientist at WJ Communications. He is a member of the IEEE, of the Materials Research Society (MRS), and of the International Microelectronics and Packaging Society (IMAPS). Mr. Madra is an honorary member of Pi Tau Sigma. He has extensive experience in the area of semiconductor manufacturing and solid state physics applications. He received his bachelor and graduate degrees in mechanical engineering with a special focus on VLSI fabrication. Some of his interests lie in the areas of gettering of silicon, development of low-k IMD films, CVD and High Density Plasma Deposition, X-ray Diffraction (XRD), Atomic Force Microscopy (AFM) and Fourier Transform Infrared Microscopy (FTIR). His interests also lie in the areas of disk drive mechanics, thermal characterization, numerical analyses, carrier transport, device physics, and analytical modeling.

About EMAP 2004

The International Electronic Materials and Packaging Conference is a premier electronic materials and packaging conference, and shall be held in Penang, Malaysia from December 5-7, 2004. (http://www1.eng.usm.my/mekanik/emap2004.html). The conference shall be inaugurated by Rt. Hon. Tan Sri Dr. Koh Tsu Koon, Chief Minister of Penang, Malaysia, while Dr. Zaidi M. Ripin shall be the General Chair for the event.

About IEEE-CPMT

The Components, Packaging & Manufacturing Technology (CPMT) Society (www.cpmt.org) is a Division I technical society of the Institute of Electrical and Electronics Engineers (IEEE) Inc. (www.ieee.org).

About WJ Communications

WJ Communications Inc. is a leading RF semiconductor company focusing on the design and manufacture of high-quality devices, chip sets and multi-chip modules (MCMs) for telecommunications, RF identification (RFID) and homeland security systems worldwide. WJ's highly reliable amplifiers, mixers, RF integrated circuits (RFICs), RFID reader modules, chipsets and MCM products are used to transmit, receive and process signals that enable current and next generation wireless and wireline services. For more information visit www.wj.com or call 408-577-6200.

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This press release contains forward-looking statements including financial projections, statements as to the plans and objectives of management for future operations, and statements as to the Company's future economic performance, financial condition or results of operations. These forward-looking statements are not historical facts but rather are based on current expectations and our beliefs. The Company's actual results may differ materially from those projected in these forward-looking statements as a result of a number of factors including those described from time to time in the Company's filings with the Securities and Exchange Commission. Readers of this release are cautioned not to place undue reliance on these forward-looking statements. The Company undertakes no obligation to publicly update or revise the forward-looking statements contained herein to reflect changed events or circumstances after the date of this press release.