WJ Communications Research Scientist to Present at 9th ITHERM Conference Conducted by IEEE-CPMT & ASME-EPDD.

Business Editors/High-Tech Writers

ITHERM 2004

SAN JOSE, Calif.--(BUSINESS WIRE)--May 19, 2004

WJ Communications, Inc (NASDAQ:WJCI), a leading designer and supplier of high-performance RF semiconductors and multi-chip modules (MCM), today announced that Mr. Satbir Madra, Senior Research Scientist at WJ, will present a technical paper at the Ninth ITHERM Intersociety Conference to be held in Las Vegas, Nevada, June 1-4, 2004. This premier conference will address the latest developments in research and technology regarding thermal and thermomechanical phenomena in microelectronic systems, and is held jointly under the auspices of both academia and several key technology companies including Motorola, General Electric, Intel, National Semiconductor, IBM Corporation and Fujitsu Laboratories of America.

The topic of Mr. Satbir's presentation will be, "Carrier Depletion Effects and Heat Generation in Nanoscale Thermal Modeling of GaInP/pGaAs HBT's," and will be presented in the "Emerging Technologies" track of Nanoscale Phenomena in Microelectronics.

Mr. Satbir's paper will also be available on the WJCI web site at www.wj.com/techpubs/index.asp.

Mr. Robert Bayruns, Vice President of Engineering at WJ said, "Satbir's work highlights WJ's keen commitment to semiconductor product quality and reliability. Thermal effects assume paramount significance in today's state-of-the-art semiconductor devices in general, and compound semiconductor HBT designs in particular. In-depth characterization and detailed understanding of semiconductor products is essential vis-a-vis optimal performance and long-term reliability. This work provides a thorough understanding of the relationship between solid state physics and accurate thermal modeling of HBT semiconductor products."

Mr. Satbir Madra said, "Usually an a-priori assumption is made of the nature and location of heat generating regions for thermal modeling of HBT's. Accurate temperature determination continues to be challenging and somewhat speculative, often relying on broad based assumptions. This paper establishes the nature of heat sources, heat transport and temperature distribution in contemporary HBT devices from the considerations of device physics and numerical modeling. Considerations have been made for various effects including bandgap narrowing with temperature and thermal conductivities of various materials have been carefully considered as functions of temperature and doping levels."

Author Profile: Mr. Satbir Madra is a Senior Research Scientist at WJ Communications. He is a member of Pi Tau Sigma -- National Honorary Society. He is also a member of the IEEE, of the Materials Research Society (MSR), and of the International Microelectronics and Packaging Society (IMAPS). He has extensive experience in the area of semiconductor manufacturing, electronic packaging and solid state physics applications. He received his bachelor and graduate degrees in mechanical engineering with a special focus on VLSI fabrication. Some of his interests lie in the areas of gettering of silicon, development of low-dielectric IMD films, CVD and High Density Plasma Deposition, X-ray Diffraction (XRD), Atomic Force Microscopy (AFM) and Fourier Transform Infrared Microscopy (FTIR). His interests also lie in the areas of disk drive mechanics, thermal characterization, carrier transport, numerical analyses and analytical modeling of microelectronic packages.

About ITHERM 2004:

Itherm 2004 is the premier International Conference on Thermal, Mechanics and Thermomechanical Phenomena in Electronic Systems sponsored by IEEE Components, Packaging and Manufacturing Technology Society (http://www.cpmt.org) and the EPPD of the American Society of Mechanical Engineers (http://www.asme.org.divisions/eppd/). It will be held from June 1-4, 2004 in Las Vegas, Nevada, USA at the Mirage Hotel and Casino (http://www.mirage.com). The conference will be held concurrently with the 54th Electronic Components and Technology Conference (ECTC) (http://www.ectc.net). Dr. K. Ramakrishna from the CMOS Platform Device Deployment (Digital DNA Laboratories) of Motorola's Semiconductor Products Sector shall be the General Chair for this event.

About WJ Communications

WJ Communications Inc. is a leading RF semiconductor company focusing on the design and manufacture of high-quality devices, chip sets and multi-chip modules (MCMs) for telecommunications, RF identification (RFID) and homeland security systems worldwide. WJ's highly reliable amplifiers, mixers, RF integrated circuits (RFICs), RFID reader modules, chipsets and MCM products are used to transmit, receive and process signals that enable current and next generation wireless and wireline services. For more information visit www.wj.com or call 408-577-6200.

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This press release contains forward-looking statements including financial projections, statements as to the plans and objectives of management for future operations, and statements as to the Company's future economic performance, financial condition or results of operations. These forward-looking statements are not historical facts but rather are based on current expectations and our beliefs. The Company's actual results may differ materially from those projected in these forward-looking statements as a result of a number of factors including those described from time to time in the Company's filings with the Securities and Exchange Commission. Readers of this release are cautioned not to place undue reliance on these forward-looking statements. The Company undertakes no obligation to publicly update or revise the forward-looking statements contained herein to reflect changed events or circumstances after the date of this press release.