View Global & Regional Market Trends & Forecasts for the Wireless Connectivity Industry.DUBLIN, Ireland -- Research and Markets (http://www.researchandmarkets.com/reports/c40024) has announced the addition of "Global Wireless Connectivity Report" to their offering. This market report analyzes and forecasts the global market for wireless connectivity technologies. The report includes a thorough evaluation of emerging wireless connectivity technologies including UWB (Ultra-WideBand) A wireless technology that uses less power and provides higher speed than 802.11 Wi-Fi networks or first-generation Bluetooth products. UWB is expected to provide wireless video transmission for home theater systems, cable TV, auto safety and , Bluetooth, and IEEE 802.11n This article or section contains information about scheduled or expected future events. It may contain tentative information; the content may change as the event approaches and more information becomes available. IEEE 802.11n is a proposed amendment to the IEEE 802. . Analysis includes an assessment of market by UWB protocol (e.g. DS-UWB DS-UWB Direct Sequence Ultra-Wideband from Freescale, CW-UWB from PulseLink, and MB-OFDM MB-OFDM Multi-Band Orthogonal Frequency Division Multiplexing UWB from the WiMedia Alliance). Included is analysis of the WiMedia Alliance, wireless USB, the UWB Forum. The report includes global & regional market trends & forecasts, regulatory issues, standards development, economic effects, and strategic developments. Year Subscription includes main report and 3 additional quarterly updates. Wireless Connectivity is truly the focus of nearly every large OEM (Original Equipment Manufacturer) The rebranding of equipment and selling it. The term initially referred to the company that made the products (the "original" manufacturer), but eventually became widely used to refer to the organization that buys the products and today. With the increased capabilities of controllers and RF chips, combined with the advances in manufacturing process techniques that have driven costs down, the notion of 'wireless everywhere' is within reach. The IEEE (Institute of Electrical and Electronics Engineers, New York, www.ieee.org) A membership organization that includes engineers, scientists and students in electronics and allied fields. 802.11 family of specifications has advanced to the point of migrating a once quirky solution to real competition to wired broadband. Once the IEEE 802.11n specification is complete and products begin development, the spec. will offer real competition to UWB. Bluetooth, the standard that nearly became obsolete, has captured a real market in wireless connectivity of communications devices and so received a second life cycle. The market may not be as large as once imagined by many, but it is significant. Consider how many mobile phones are shipped each year. Given the recent extension of Bluetooth into automotive segments for the purpose of hands-free communications, the Bluetooth market is expanding. There are beginning to be real opportunities for equipment manufacturers and application software providers in the sector. The trend is likely to continue throughout the year, as Bluetooth has no significant competition in the segments that it now occupies, and currently is poised to extend into high data rate areas with the aid of UWB. This report describes established technologies and protocols specifically applicable to the wireless connectivity sector. These include ultrawideband (UWB), Bluetooth, and the various types of IEEE 802.11 protocols including Wi-Fi. Existing industry alliances and SIGs are described, as well as the existing standards and specifications. Current market opportunities for wireless connectivity are quantified by protocol and technology and by market segment in terms of sales Terms of sale Conditions under which a firm proposes to sell its goods or services for cash or credit. , shipments, and average selling price The average sales price of goods or commodities. Especially used in the retail sector and technology distribution. for the component chipset. For more information visit http://www.researchandmarkets.com/reports/c40024 |
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