Veteran Electronics Technologies Expert John T. Hoback Joins NanoPierce Board of Directors.

Business Editors

DENVER--(BUSINESS WIRE)--April 11, 2002

NanoPierce Technologies, Inc. (OTCBB:NPCT) today announced that Mr. John T. Hoback was appointed to its Board of Directors on April 5, 2002.

As a Director, John T. Hoback brings extensive experience in building electronic materials businesses from a zero base to multi-million dollars in revenues. He has an enviable record of starting businesses from ideas or concepts, guiding them through commercialization and then participating in the demanding management environment of growing those businesses to revenue levels approaching $100 million. His success has been due to accelerating the time to market of numerous new products, coupled with both company/technology acquisitions, and establishing strategic partnerships that were aimed at achieving long-term competitive position.

Mr. Hoback's current consulting practice leverages his skills and accomplishments to assist international companies in shaping and realizing their growth objectives. His clients range from Fortune 500 companies to fledgling start-up companies that have sprung up in high-growth regions like Northeastern Pennsylvania.

Mr. Hoback has over twenty-five years of industry experience with polymeric and organo-metallic specialty materials. These products span the spectrum of materials used to manufacture semiconductors, hybrid circuits, passives, rigid/flex printed circuits, multichip modules, LEDs, flat panel displays, MEMs, and optoelectronics. They include materials used to protect or attach circuits/devices during packaging and assembly operations.

Mr. Hoback graduated from Gettysburg College, Gettysburg, Pa., with an AB degree. He attended the University of Maryland in College Park, Md., where he did graduate work in Biochemistry. Mr. Hoback received a Certificate in Entrepreneurial Management from the Wharton School of Management, Philadelphia, Pa. He has been active in electronics industry associations (IPC, IMAPS, Semi/SEMATECH suppliers round table) as a member, session chairperson, standards committee chair and an international presenter. He holds numerous patents in high-performance polymers.

He has held positions such as a Research Scientist at Knoll Labs, Product Manager, Manufacturing Shift Supervisor, while at General Electric, Schenectady, N.Y.; business group-Manager of Business Analysis/Finance, VIU Salesman at DuPont, Wilmington, Del.; Manager New Business Development Electronics (including M&A), Director of Marketing EMCA at Rohm and Hass, Philadelphia, Pa.; VP Marketing & Sales, President, at Electro-Kinetic Systems Inc., Trainer, Pa.; Venture Manager Electronics at Amoco Chemical, Chicago, Ill.; and President of Z&H Enterprise Solutions LTD, his own consulting company in East Stroudsburg, Pa.

Mr. Hoback said: "I have been fortunate during my career to have been associated with several innovative new technologies that became major multi-million dollar global businesses. Each proved to offer truly enabling capabilities to certain segments of the electronics Industry. As examples, let me name dry film photoresists, and positive acting liquid & dry film photoresists. I believe that NanoPierce Connection System (NCSTM), coupled with the application processes they have developed, will have far greater potential to exceed the revenues than any of the enabling technologies that I just mentioned. Why? Simply, because it is based on two factors. First, the application process involves currently well-understood and practiced manufacturing processes used today in electronics. Couple this with the fact that the technology has the ability to reduce several manufacturing steps while increasing yields and/or offering improved performance features for devices interconnected using the NanoPierce process. What we have is the potential for NanoPierce Connection System (NCSTM) to significantly create value for its customers by lower total cost of ownership. Once companies have the opportunity to experience first hand the value creation possibilities inherent with the NanoPierce technology you will see an avalanche of end users adopting it for diverse uses such as high-performance flip chip interconnections at one end of the spectrum, to high-volume smart tags for countless end-use applications at the other."

Paul H. Metzinger, President and Chief Executive Officer of NanoPierce Technologies, Inc., stated: " Mr. Hoback brings an impressive depth of expertise and experience to our Board of Directors. He is our third independent director and will, I know, make significant contributions to the Company. I am truly happy for our shareholders that a man of his stature and reputation has joined our Board of Directors."

Additional information on Mr. John Hoback will soon be available on the Company's web site at www.nanopierce.com.

ABOUT NANOPIERCE TECHNOLOGIES, INC.

NanoPierce Technologies, Inc., of Denver, Colorado, U.S.A., is traded on the NASDAQ stock market (OTCBB:NPCT) as well as on the Frankfurt and Hamburg exchanges (OTC:NPI). In addition to the 12 patents it owns, NanoPierce has numerous applications pending, others in preparation, and various other intellectual properties related to NanoPierce's proprietary NCS (NanoPierce Connection System). This advanced system is designed to provide significant improvement over conventional electrical and mechanical interconnection methods for high-density circuit boards, components, sockets, connectors, semiconductor packaging and electronic systems.

ABOUT NANOPIERCE CARD TECHNOLOGIES, GmbH

NanoPierce Card Technologies, GmbH, located in Hohenbrunn, Munich, Germany, is a 100% subsidiary of NanoPierce Technologies, Inc. This subsidiary concentrates on application development and is responsible for the Company's worldwide marketing efforts.

ABOUT NANOPIERCE CONNECTION SYSTEMS INC.

NanoPierce Connection Systems, Inc., located in Colorado Springs, Colorado, is a 100% subsidiary of NanoPierce Technologies, Inc. NanoPierce Connections Systems, Inc., has been chartered to undertake high volume production WaferPierce(TM), a revolutionary and enabling semiconductor wafer treatment for ultra-low cost flip-chip without the necessity of wire bonding, conductive adhesives, or soldering. Typical end-use applications of WaferPierce(TM) include Smart Labels, Smart Cards, and LED arrays. The new subsidiary has taken over all operations and business activities conducted in the Colorado Springs facility. In addition to WaferPierce(TM) production, NanoPierce Connection Systems will be responsible for licensing and new applications of other NanoPierce technologies to add value to electronic components.

ABOUT EXYPNOTECH GmbH i.G.

ExypnoTech GmbH i.G., located in Rudolstadt, Germany, is a 100% subsidiary of NanoPierce Technologies, Inc. ExypnoTech will produce smart inlays using the benefits of the new WaferPierce(TM) flip-chip process developed by NanoPierce Connection Systems, Inc.

For more information on NanoPierce Technologies, Inc., please visit this web site: www.nanopierce.com.

This announcement contains forward-looking statements about NanoPierce Technologies, Inc. that may involve risks and uncertainties. Important factors relating to the company's operations could cause actual results to differ materially from those in forward-looking statements and are further detailed in filings with the Securities and Exchange Commission available at the SEC website (http://www.sec.gov). All forward-looking statements are based on information available to NanoPierce Technologies, Inc. on the date hereof, and NanoPierce Technologies, Inc. assumes no obligation to update such statements.