Verteq Goldfinger Mach2 HP Doubles Throughput.

Business Editors/High-Tech Writers

SANTA ANA, Calif.--(BUSINESS WIRE)--Aug. 5, 2003

Verteq, a leading global supplier of critical feature cleaning technologies and equipment, today announced its Goldfinger(TM) Mach2 HP(TM) single-wafer cleaning system. The Mach2 HP model doubles the process chambers of the Mach2(TM) system from two to four. The four chambers combined with robotic scheduler improvements net up to a 100 percent increase in throughput for most applications, at only a 30 percent increase in footprint with no increase in tool width.

The Mach2 HP model leverages the original modular vision for the Mach platform, which allowed a relatively simple rearrangement of major sub-modules of the original Mach2 system. The new Mach2 HP unit utilizes the same process chamber, wafer handling and sub-systems of the Mach platform, enabling retention of the excellent reliability, gained through continuous improvement, of the Mach2 systems introduced in 2001. The Mach2 HP four-chamber cleaning system is only 38.9 sq. ft., with less than a 4-foot width for both 200mm and 300mm wafer configurations.

The single-wafer cleaning system uses a megasonic-enhanced process to effectively remove organic debris and particles from both FEOL and BEOL critical features such as gate stacks, bit and aluminum lines, trenches, and vias at 130nm and smaller IC generations without causing circuit or film damage.

"Removing particles from ultra-fine geometries has challenged traditional cleaning technologies. The Goldfinger Mach technologies were developed to provide a solution for effective, non-damaging particle removal from 130nm to 70nm geometries, while causing no more than 1 angstrom of film loss," said Rich Wiley, vice president and general manager of Verteq's single wafer business unit. He added, "The new Mach2 HP system revs up the productivity capabilities of this platform and provides a high-throughput tool much smaller than competitive products, which lowers costs and allows greater flexibility for deployment in the fab."

The patented Goldfinger(R) megasonics and Sahara(TM) drying technologies enable the use of lower-cost dilute chemistries, faster and higher performance cleaning and rinsing, and water spot-free drying, which combine to provide higher performance and greater productivity compared with other single-wafer cleaning offerings.

The Goldfinger Mach2 HP platform houses four process chambers with the patented Goldfinger megasonic, on-demand injection from single or multiple chemistry sources, solvent reclaim capability, simultaneous independent front and back side cleaning with independent chemistry control, and Verteq's integrated Sahara surface tension gradient drying process. It has two E.15 compliant load ports, which along with the system's robotics, can be fitted for 200mm SMIF or 300mm FOUP use.

Verteq Background

Verteq is a leading supplier of advanced wafer cleaning technologies and solutions for single-wafer and batch applications. The company's Goldfinger Mach advanced-megasonic, single-wafer technology provides non-damaging particle removal from critical IC features to enhance yields for 130nm to 70nm IC generations. Utilizing leading-edge process and equipment technologies, Verteq is providing the highest levels of wafer cleanliness and manufacturing productivity in cleaning processes for gate stacks and bit lines, deep vias, pre-diffusion, post-CMP, initial and monitor wafer, and other cleaning steps. In combining process expertise, equipment ingenuity and worldwide service support, Verteq is a valuable resource to both end-users and OEMs looking for a competitive advantage through wafer cleaning performance.

Verteq has headquarters in Santa Ana, and maintains sales and service locations throughout North America, Europe and Asia.

Editors' note: Downloadable photo of Mach2 at 300dpi is available at the following URLs:

http://www.verteq.com/media/imgs/verteq_goldfinger_mach2_hp.sit

http://www.verteq.com/media/imgs/verteq_goldfinger_mach2_hp.zip