Veeco Introduces New Nexus Ion Source; Next-Generation Design Improves 3D Etch Uniformity.WOODBURY, N.Y. -- Veeco Instruments Inc. (Nasdaq: VECO VECO Vernier Engine Cut Off ), the world leader in ion beam process solutions, announced today the introduction of the NEXUS(R) 420 Ion Source. Specifically designed to maximize the performance of Veeco's NEXUS Ion Beam Etch systems for next-generation thin film magnetic head (TFMH) production, this new ion source provides unsurpassed uniformity and repeatability in all TFMH etch processes, including perpendicular and longitudinal pole etch, air bearing surface contouring, and TMR TMR total mixed ration. TMR 1 Trainable mentally retarded 2 Transmyocardial revascularization, see there and CPP cpp - C preprocessor. sensor definition. "As areal densities continue to increase, our data storage customers must continually improve their processes to keep up with shrinking critical dimensions and tighter process controls. The new NEXUS 420 Ion Source extends Veeco's leadership position in ion beam technology and represents a breakthrough in source design," said Robert P. Oates, Vice President, General Manager of Veeco's Ion Beam Equipment group. "This robust ion source provides a wider dynamic energy range and a two to three-fold improvement in 3D uniformity, resulting in improved control of the etch process. Veeco has completed extensive beta testing (programming) beta testing - Testing a pre-release (potentially unreliable) version of a piece of software by making it available to selected users. This term derives from early 1960s terminology for product cycle checkpoints, first used at IBM but later standard throughout the of the new NEXUS source with key TFMH manufacturers, showing excellent process matching as evidenced by repeatable etch characteristics throughout the grid lifetime." The NEXUS 420 Ion Source has been designed to reduce the effect of grid variations for maximum process performance and allows for throughput improvement at low energies. In addition to exceptional uniformity and unmatched run-to-run repeatability, it features a wide energy range (100eV to 1500eV) that enables maximum control across varied wafer and slider etch processes. The Veeco NEXUS product lines utilize a common platform architecture that enables different Veeco process technologies (Ion Beam Etch, Ion Beam Deposition Ion Beam Deposition is a process of applying materials to a target through the application of an ion beam. In an ion source source materials - gases or evaporated solids - are ionized using electron ionization or by application of high electric fields (Penning ion source). , ALD ALD abbr. adrenoleukodystrophy ALD, n.pr See adrenoleukodystrophy. ALD aldolase. and PVD PVD abbr. peripheral vascular disease PVD Peripheral vascular disease, see there ) to work seamlessly on a common cluster tool configuration and common software. The NEXUS platform flexibility maximizes the use of capital assets capital assets n. equipment, property, and funds owned by a business. (See: capital, capital account) and enables development of next-generation TFMH designs. About Veeco Veeco Instruments Inc. provides solutions for nanoscale applications in the worldwide semiconductor, data storage, compound semiconductor/wireless and scientific research markets. Our Metrology products are used to measure at the nanoscale and our Process Equipment tools help create nanoscale devices. Veeco's manufacturing and engineering facilities are located in New York New York, state, United States New York, Middle Atlantic state of the United States. It is bordered by Vermont, Massachusetts, Connecticut, and the Atlantic Ocean (E), New Jersey and Pennsylvania (S), Lakes Erie and Ontario and the Canadian province of , New Jersey, California, Colorado, Arizona and Minnesota. Global sales and service offices are located throughout the United States, Europe, Japan and Asia Pacific. Additional information on Veeco can be found at http://www.veeco.com/. To the extent that this news release discusses expectations about market condition, market acceptance and future sales of Veeco's products, Veeco's future financial performance or disclosures, or otherwise makes statements about the future, such statements are forward-looking and are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include the challenges of continuing weakness in end market conditions and the cyclical nature of the compound semiconductor/wireless, data storage, semiconductor and research markets, risks associated with integrating acquired businesses and the acceptance of new products by individual customers and by the marketplace and other factors discussed in the Business Description and Management's Discussion and Analysis Management's discussion and analysis (MD&A) A report from management to shareholders that accompanies the firm's financial statements in the annual report. It explains the period's financial results and enables management to discuss topics that may not be apparent in the financial sections of Veeco's Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q and current reports on Form 8-K. |
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