Veeco Introduces Dimension Atomic Force Profiler; New High-Performance, Non-Destructive Metrology Solution for In-Line Semiconductor Process Control.WOODBURY, N.Y. -- Veeco Instruments Inc. (Nasdaq: VECO VECO Vernier Engine Cut Off ), announced today that it has introduced the Dimension(R) Atomic Force Profiler (AFP (1) (AppleTalk Filing Protocol) The file sharing protocol used in an AppleTalk network. In order for non-Apple networks to access data in an AppleShare server, their protocols must translate into the AFP language. See file sharing protocol. ), designed for a broad range of metrology applications in the semiconductor fab. The fully integrated Dimension AFP is Veeco's next generation system, combining the superb resolution of an atomic force microscope atomic force microscope (AFM), device that uses a spring-mounted probe to image individual atoms on the surface of a material. Unlike the scanning tunneling microscope, which is also a scanning probe microscope, the AFM can be used on materials that do not conduct (AFM (Atomic Force Microscope) A device used to image materials at the atomic level. AFMs are used to solve processing and materials problems in electronics, telecom, biology and other high-tech industries. ) with the long-scan capability of an atomic force profiler to offer semiconductor manufacturers the highest performance, fastest AFM solution for in-line process control. Veeco's new AFP is ideal for some of today's most challenging in-fab metrology applications such as chemical mechanical planarization (CMP CMP (cytidine monophosphate): see cytosine. (1) (CMP Media LLC, Manhasset, NY, www.cmp.com) Part of United Business Media, CMP is a leading integrated media company that offers a wide variety of publications and services in the information ), etch depth, step heights, roughness and die maps for advanced technology nodes. "The Dimension AFP is the world's only AFM single-tool fab solution, designed for both CMP and etch metrology at 65nm," stated Jeannine Sargent, Executive Vice President, Veeco Metrology & Instrumentation. "In addition to being gauge capable, the Dimension AFP has twice the throughput of previous AFMs, thereby speeding critical device performance monitoring in such process steps as STI STI systolic time intervals. (shallow trench isolation Shallow trench isolation (STI) is an integrated circuit feature which prevents electrical current leakage between adjacent semiconductor device components. STI is generally used on CMOS process technology nodes of 250 nanometers and smaller. ) CMP and STI Etch. Veeco is the clear market leader in AFM, having sold over 300 automated AFMs to semiconductor customers worldwide. This new high-performance system further strengthens our in-fab footprint." Paul Clayton, Veeco's Automated AFM Business Unit Manager, commented, "As semiconductor linewidths continue to shrink, Veeco's state-of-the-art, field-proven AFM technology allows within-die, non-destructive feature measurement, which is critical as the correlation to test features breaks down around the 65nm node. Results from our customer testing have shown that the Dimension AFP's increased productivity can deliver the required critical in-line monitoring solutions for advanced technology nodes." With extensive automation and fab-ready connectivity, the versatile AFP represents a truly complete solution for in-line CMP and Etch process monitoring and control. Like all Veeco instrumentation, the Dimension AFP is backed by Veeco's worldwide service and support organization. The Dimension AFP joins Veeco's broad suite of automated surface metrology solutions: --The Dimension X3D X3D Next Generation Three Dimensional X3D Extensible Three Dimensional : gauge-capable, automated metrology system to deliver three-dimensional (X, Y, and Z), in-line characterization of critical dimension (CD) feature shape control for 65nm and 45nm advanced process development. This system gathers detailed data on crucial CD elements encountered in lithography and advanced etch processing including gate, STI, dual-damascene structures, sidewalls and line-edge variation. --The Dimension X: The Dimension X is designed specifically to address the semiconductor industry's need for higher-resolution etch depth metrology. It enables chipmakers to measure etch related structures that are 65nm and below for depth uniformity control in high production environments. This system has the ability to take repeatable, in-line measurements of shallow trench isolation (STI) and gate structures, as well as contacts and vias in high aspect ratio depth metrology without damaging the device or sacrificing a wafer for cross-sectioned measurements. --The Dimension Vx 340: The Dimension Vx340 Atomic Force Profiler (AFP) automated metrology system for characterization and control of multiple processes. It is a versatile system that is designed to replace standard profilers with improved AFM resolution and faster throughput. About Veeco Veeco Instruments Inc. provides solutions for nanoscale applications in the worldwide semiconductor, data storage, HB-LED/wireless and scientific research markets. Our Metrology products are used to measure at the nanoscale and our Process Equipment tools help create nanoscale devices. Veeco's manufacturing and engineering facilities are located in New York New York, state, United States New York, Middle Atlantic state of the United States. It is bordered by Vermont, Massachusetts, Connecticut, and the Atlantic Ocean (E), New Jersey and Pennsylvania (S), Lakes Erie and Ontario and the Canadian province of , New Jersey, California, Colorado, Arizona and Minnesota. Global sales and service offices are located throughout the United States, Europe, Japan and Asia Pacific. Additional information on Veeco can be found at http://www.veeco.com/. To the extent that this news release discusses expectations about market condition, market acceptance and future sales of Veeco's products, Veeco's future financial performance, future disclosures, or otherwise makes statements about the future, such statements are forward-looking and are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include the challenges of continuing weakness in end market conditions and the cyclical nature of the compound semiconductor/wireless, data storage, semiconductor and research markets, risks associated with integrating acquired businesses and the acceptance of new products by individual customers and by the marketplace and other factors discussed in the Business Description and Management's Discussion and Analysis Management's discussion and analysis (MD&A) A report from management to shareholders that accompanies the firm's financial statements in the annual report. It explains the period's financial results and enables management to discuss topics that may not be apparent in the financial sections of Veeco's Annual Report on Form 10-K Form 10-K A report required by the SEC from exchange-listed companies that provides for annual disclosure of certain financial information. Form 10-K See 10-K. , subsequent Quarterly Reports on Form 10-Q Form 10-Q See 10-Q. and current reports on Form 8-K Form 8-K The form required by the SEC when a publicly held company incurs any event that might affect its financial situation or the share value of its stock. Form 8-K See 8-K. . Veeco does not undertake any obligation to update any forward-looking statements to reflect future events or circumstances after the date of such statements. |
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