Printer Friendly
The Free Library
14,560,361 articles and books
Member login
User name  
Password 
 
Join us Forgot password?

Update Your Palomar Bonder with Performance Upgrade Packages.


Includes Bond Data Miner A program that analyzes activity in the computer. It may refer to legitimate analyses commonly performed by organizations internally (see data mining) or to spyware that secretly captures a user's Web surfing habits (see spyware).  Software

CARLSBAD, Calif. -- Palomar Technologies, provider of precision automation equipment and process development for microelectronic assembly, is making available bonder Performance Upgrade Packages for its CBT (Computer-Based Training) Using the computer for training and instruction. CBT programs are called "courseware" and provide interactive training sessions for all disciplines. 6000 and Model 8000 automatic wire bonders and the Model 3500 component placement work cell. The upgrade packages include the latest operating software, improved vision systems for pattern recognition, and new features like Bond Data Miner[TM] (known as BDM BDM Black Divorced Male
BDM Business Development Manager
BDM Background Debug(ger) Mode
BDM Bund Deutscher Mädel (League of German Girls during the Third Reich, akin to Hitler Youth) 
). BDM, included in Palomar's current bonder models, is a software package that monitors machine and process trends to provide increased yields and predictive maintenance Predictive maintenance (PdM) techniques help determine the condition of in-service equipment in order to predict when maintenance should be performed. This approach offers cost savings over routine or time-based preventive maintenance because tasks are performed only when . Bond Data Miner can: track and archive traceability data for each part, die, wire and bond; automatically adapt its process parameters to address lot to lot and/or part variations; capture and analyze process and machine trends to optimize yield; and report its own uptime and statistics to any computer in the world.

About Palomar Technologies

Palomar Technologies (formerly part of Hughes Aircraft Hughes Aircraft Company was a major aerospace and defense company founded by Howard Hughes. The group was based near Ballona Creek, in Culver City, California, USA, on the Pacific Coast.

Hughes Aircraft was acquired by General Motors in 1985.
 Company) is one of the world's principal suppliers of automated high-precision wire bonders and component placement systems to increase yield and lower costs for manufacturers of optoelectronic, RF, and microelectronic packages in the photonics photonics, the science and technology based on and concerned with the controlled flow of photons, or light particles. It is the optical equivalent of electronics, and the two technologies coexist in such innovations as optoelectronic integrated circuits. , wireless, microwave, automotive, aerospace, medical, and life sciences industries.

For more information, visit www.palomartechnologies.com or contact 760-931-3600.
COPYRIGHT 2007 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2007, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

 Reader Opinion

Title:

Comment:



 

Article Details
Printer friendly Cite/link Email Feedback
Publication:Business Wire
Date:Jan 4, 2007
Words:209
Previous Article:Light Sciences Oncology Purchases the Assets of Its Former Parent Company Light Sciences LLC in Equity Transaction.
Next Article:Minyard to Outsource Warehouse, Distribution.



Related Articles
CORDLESS BONDER.(Adhesive Technologies Inc.)(Brief Article)(Product Announcement)
Die Bonding in an Optoelectronic World -- PCB assemblers venturing into optoelectronics will encounter new substrates and package designs that call...
Palomar Technologies Offers Replacement Parts, Upgrades, and Service for Hughes Wire Bonders and Die Attach Machines.
Palomar Technologies intros Model 8000 high-speed wire bonder.
Wire bonders shipped to Thailand.(Asia Watch)(Brief Article)
Multi-chip Die Bonder.(Spotlight)
SUSS MicroTec teams up with IMEC for developing state-of-the-art bonding methods of MEMS packaging.
Automated gold wire bonder.(Product Spotlight)
Current trends in optoelectronics: EMS providers and equipment suppliers are working together to make high-volume optoelectronic component...
Automated gold wire bonder.(Product Spotlight)

Terms of use | Copyright © 2009 Farlex, Inc. | Feedback | For webmasters | Submit articles