United Test Center and Tessera Technologies Announce Licensing and Technology Collaboration Agreement.Business Editors/High-Tech Writers TAIPEI, Taiwan--(BUSINESS WIRE)--Dec. 3, 2001 Agreement Will Enable UTC (Coordinated Universal Time, Temps Universel Coordonné) The international time standard (formerly Greenwich Mean Time, or GMT). Zero hours UTC is midnight in Greenwich, England, which is located at 0 degrees longitude. to Meet Customer Demand For High Performance Memory Applications Tessera tessera: see mosaic. Inc., a provider of intellectual property for chip-scale packaging (CSP (1) (Certified Systems Professional) An earlier award for successful completion of an ICCP examination in systems development. See ICCP. (2) (Commerce Service P ), and United Test Center Inc. (UTC), a Taiwanese semiconductor test and assembly company, today announced that they have signed a licensing and technology collaboration agreement. The agreement will leverage the strengths of both companies enabling them to provide semiconductor manufacturers worldwide with low-cost, high performance memory solutions integrating UTC and Tessera's wire-bonded CSP technologies. "UTC has recently expanded its offerings to include high-volume advanced packaging capabilities, which are initially focused on providing wire-bonded CSP technology to the memory market. Our collaboration with Tessera will allow us to offer our customers a range of package solutions for DRAM, including DDR (Double Data Rate) Refers to an SDRAM memory chip that increases performance by doubling the effective data rate of the frontside bus. For more details, see SDRAM. DDR - Double Data Rate Random Access Memory , RDRAM (Rambus DRAM) Pronounced "r-d-ram." A dynamic RAM chip technology from Rambus, Inc., Los Altos, CA (www.rambus.com). Rambus licensed its memory designs to semiconductor companies, which manufactured the chips. and SDRAM (Synchronous DRAM) A type of dynamic RAM (DRAM) memory chip that has been widely used since the late 1990s. SDRAM chips eliminated wait states by dividing the chip into two cell blocks and interleaving data between them. , as well as Flash and SRAM See static RAM. SRAM - static random-access memory devices, to Tessera's established base of customers," said Jeff Biar, vice president, business development at UTC. "By partnering with Tessera, the leading provider of advanced packaging technologies, we will be able to meet the growing demand for high performance, low-cost memory solutions in the computing and wireless markets." The initial application of Tessera's technology will be for UTC's wire-bonded WindowBGA(TM) package. UTC will partner with Tessera to evolve its packaging technologies in the area of stacked and multi-chip packages, allowing the company to expand its offerings and penetrate new markets. "Leading OEMs and semiconductor companies worldwide are turning to Tessera to help solve complex problems of miniaturization min·i·a·tur·ize tr.v. min·i·a·tur·ized, min·i·a·tur·iz·ing, min·i·a·tur·iz·es To plan or make on a greatly reduced scale. min , density and performance of their next-generation electronic products," said Chris Pickett, Tessera's senior vice president, licensing business. "This technology and marketing agreement with UTC will provide the semiconductor industry with a world-class, production-ready assembly and test facility in Taiwan that's capable of high volume package assembly." Asia Pacific is one of the world's leading centers for semiconductor packaging design and manufacturing, making Taiwan an important market for Tessera's chip-scale packaging IP and services. With single-chip (mu)BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. technology well established in the industry, Tessera is now focused on providing its customers with innovative integrated, multi-chip solutions and is setting new standards in performance, size and reliability. Both companies will work closely together to provide the industry worldwide with leading-edge packaging solutions and drive the broad adoption of CSP technologies. About United Test Center Inc. UTC Inc., an established provider of IC packaging and test services, offers complete turnkey solutions from advanced organic substrates through packaging, test and logistic management. UTC's advanced technologies integration and its proprietary CSP packaging process provide high reliability, low-cost IC packaging solutions to UTC's customers worldwide. UTC is based in Hsin Chu Science-Based Industrial Park in Taiwan. About Tessera Technologies Inc. Tessera provides intellectual property for chip-scale packaging to meet the accelerating demand for performance and miniaturization in wireless communications wireless communications System using radio-frequency, infrared, microwave, or other types of electromagnetic or acoustic waves in place of wires, cables, or fibre optics to transmit signals or data. , Internet access See how to access the Internet. , computing and consumer electronics products. Tessera's technology enables the semiconductor industry to overcome fundamental problems in performance, reliability and size. Tessera has licensed its advanced packaging technology to over 35 assembly and semiconductor companies. Tessera is based in San Jose, Calif. Note to Editors: Tessera and micronBGA are registered trademarks, and "We make it possible" is a service mark of Tessera Technologies Inc. All other brand and product names may be trademarks of their respective companies. |
|
||||||||||||||
Printer friendly
Cite/link
Email
Feedback
Reader Opinion