United States : Electronic - Dow Electronic Materials Introduces New Metallization and Imaging Products for Printed Circuit Boards.Byline: manish03 Dow Electronic Materials introduced its new line of metallization Met`al`li`za´tion n. 1. The act or process of metallizing. and imaging products for printed circuit boards (PCB PCB: see polychlorinated biphenyl. PCB in full polychlorinated biphenyl Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound. ) at the recent TPCA TPCA Toyota Peugeot Citroën Automobile (Czech Republic) TPCA Texas Pest Control Association TPCA Texas Petroleum Marketers and Convenience Store Association TPCA Toxic Pits Cleanup Act TPCA Tennessee Primary Care Association show and IMPACT Conference These advanced materials provide high-performance, cost effective solutions with improved environmental profiles for the PCB industry, and address the demand for smaller, more sustainable, less expensive and better performing consumer electronics. Dow Electronic Materials introduced its new line of metallization and imaging products for printed circuit boards (PCB) at the recent TPCA show and IMPACT Conference. These advanced materials provide high-performance, cost effective solutions with improved environmental profiles for the PCB industry, and address the demand for smaller, more sustainable, less expensive and better performing consumer electronics. PCB Electrolytic e·lec·tro·lyt·ic adj. 1. Of or relating to electrolysis. 2. Produced by electrolysis. 3. Of or relating to electrolytes. e·lec Plating ? MICROFILL? EVF EVF Electronic Viewfinder EVF Eaton Vance Senior Income Trust EVF Éducation à la Vie Familiale EVF Early Vertical Forearm EVF European Venous Forum EVF Endovascular Forum EVF Eye View Finder (cameras/camcorders) Via Fill provides greatly enhanced via filling at exceptionally low surface thicknesses and is capable of simultaneous through-hole plating. It is suitable for both HDI HDI Human Development Index (UNDP yardstick of human welfare) HDI Help Desk Institute HDI Humpty Dumpty Institute (New York, New York) HDI High Density Interconnect and IC (Integrated Circuit) Substrate applications. The company received an Outstanding Paper Award at recent IMPACT Conference for its excellent achievement in this area. COPPER GLEAM? HV-101 and HVS-202 Acid Copper provide high plating efficiency which increases productivity and lowers plating cost for vertical continuous plating applications. COPPER GLEAM? MV-100 Acid Copper exhibits exceptionally good metal distribution and better performance for vertical in-line equipment with dramatic improvement in cycle time. Copyright : Euclid Infotech Pvt. Ltd. Provided by Syndigate.info an Albawaba.com company |
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