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United States : Broadcom Intros BCM2074x Bluetooth Headset SoC Solutions.


Byline: Mamta03

Broadcom Corporation, a provider of semiconductors for wired and wireless communications wireless communications

System using radio-frequency, infrared, microwave, or other types of electromagnetic or acoustic waves in place of wires, cables, or fibre optics to transmit signals or data.
 solutions has reportedly launched the fourth generation of its enhanced Bluetooth headset Headphones combined with a microphone. Used in call centers and by people in telephone-intensive jobs, headsets provide the equivalent functionality of a telephone handset with hands-free operation. Many people use headsets at the computer so they can converse and type comfortably.  system-on-a-chip or SoC solutions. These solutions will offer an advanced power savings platform coupled with premium audio quality for next generation headset designs.

The new Broadcom (News - Alert) BCM BCM Baylor College of Medicine
BCM Become
BCM Business Communications Manager (Nortel)
BCM Broadcom Corporation
BCM Business Continuity Management
BCM Business Contact Manager (Microsoft) 
2074x family of Bluetooth headset SoC solutions is equipped with industry's first 65 nanometer One billionth of a meter. Nanometers are used to measure the wavelengths of light. See angstrom and metric system.  CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes.  headset chips and delivers a superior audio quality, key user interface enhancements and unrivaled power performance and talk time in comparison to the existing solutions.

These solutions will add to the benefits of the previous generation BCM2044 and BCM2044S devices, still available in popular headsets. The BCM2074x family features some innovative technologies and functionalities, including new wind noise reduction algorithms and multi-language 'voice prompt' technology. The solutions are equipped with an integrated fast-charging power innovation that helps headsets to charge five times faster than existing products. The low-cost architecture of the products by Broadcom will enable consumers to pay less for better quality and higher performing headsets.

Broadcom's smart audio technology has been incorporated into the newly launched solutions. The company has been constantly making effort to deliver superior voice and audio quality across all its communications products.

The company has included enhanced noise suppression suppression /sup·pres·sion/ (su-presh´un)
1. the act of holding back or checking.

2. sudden stoppage of a secretion, excretion, or normal discharge.

3.
 capabilities into the new BCM2074x family that can reduce background noise by nearly 40 percent over the existing noise cancellation (1) The elimination of unwanted signals in an electronic circuit. See noise and dynamic noise reduction.

(2) The elimination of unwanted noise in the environment using noise cancelling headphones.
 techniques. Features such as dynamic wind noise suppression and near-end speech enhancement algorithms that overcome the most challenging and annoying audio interferers have been added to the smart audio upgrades.

Usually, wind noise is a challenging issue to combat and the regular noise reduction techniques have little effect on wind noise because its characteristics are very different from different types of noise. The BCM2074x family utilizes innovative algorithmic techniques in both single and dual microphone configurations to identify and detect wind in real-time and then applies high-speed suppression to deliver a better and enhanced audio experience.

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1. As stated or indicated by; on the authority of: according to historians.

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 Craig Ochikubo, vice president and general manager, wireless personal area networking, Broadcom, the company has leveraged its leadership in the Bluetooth market to integrate superior audio quality and ease of use.

Copyright : Euclid Infotech Pvt. Ltd.

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Publication:TendersInfo
Date:Oct 27, 2009
Words:375
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