TriQuint's RF Vision Simplifies Next-Generation Global Network Connectivity.

Responding to Market Demand TriQuint Develops More Highly-Integrated Modules, Packages More Die-Level Devices, Streamlines Access to RF Front-End Products

HILLSBORO, Ore. -- TriQuint Semiconductor (Nasdaq: TQNT), a leading manufacturer of RF products, today released its Network Business Unit's global vision for simplifying connectivity in consumer voice, data, music and video for fixed and mobile environments. New TriQuint products supporting the company's vision will premier at the 2007 IEEE MTT-S International Microwave Symposium in Honolulu, Hawaii (5th-7th June).

TriQuint will simplify next-generation RF designs through products created with unique gallium arsenide (GaAs), surface and bulk acoustic wave (SAW / BAW) technologies used to integrate multiple functions into smaller, more efficient modules. These products in turn can simplify the manufacturing process for device and equipment makers. Additionally, TriQuint is packaging more of its extensive catalog of gallium arsenide die-level MMICs, to give manufacturers industry-leading surface mount amplifiers and switches. In the past TriQuint's collection of die-level products were accessible mainly to manufacturers equipped to handle non-packaged components. More packaged products will give existing and new customers greater access to a broader selection of manufacturing options, and enable them to enter new markets. TriQuint is also simplifying the sales channels and tools used to access company products.

"Our customers want integrated devices for size and cost-constrained applications, more packaged product options, especially for higher frequency applications, and a simpler way to get those products. Our vision is about anticipating these needs and helping them increase productivity. Our customers are developing next-generation products that will enable connectivity convergence, which is about 'networking' in the human sense; it's the ability to work wherever a person is, staying in touch with family, playing games, sharing pictures, having access to 'data' such as digital music, movies, TV or spreadsheets, and web surfing. People want access when and where they choose, without service quality issues, hence the need for fixed and mobile wireless high-speed connectivity and the products that enable it. And they want it simple. Equipment makers have the same expectation," said Brian Balut, TriQuint Networks Vice President.

Integration is a key aspect of TriQuint's vision, Balut explained. TriQuint is leveraging its recognized expertise in GaAs and SAW technology to create highly-integrated products that handle RF power, switching or filtering functions more efficiently while occupying less space on a PC board. Smaller, more efficient modules are more cost effective and can speed the manufacturing process, thereby reducing time to market. For example: TriQuint's unique commercial GaAs E/D pHEMT process, the first of its kind, enables multi-band, die level integration of amplifiers, switches, filters and low-noise amplifiers to support Wireless LAN a, b, g, and n standards. This critical ability benefits new multiple-input, multiple-output (MIMO) designs at the heart of efforts to shrink network and CPE wideband wireless connections.

"For the consumer, MIMO will mean smaller devices that will be easier to configure and use in the community, workplace or home," Balut explained. "But there's another bonus: MIMO will also bring 'diversity', which in this context means 'cleaner' signals. This can virtually eliminate dropped calls, digital fade or data interruption that can now occur when downloading or uploading music, video or other data. TriQuint technology is enabling these next-generation wireless products while helping reduce the size of the RF component through our highly integrated modules."

TriQuint is also enabling next-generation communications designs by packaging devices that were once only available as die-level MMIC (monolithic microwave integrated circuit) products. By packaging these high frequency parts TriQuint gives manufacturers access to a broader selection of the company's vast die-level product collection. The ability to choose packaged devices promotes more creative ways to solve manufacturing challenges and can reduce costs or shorten time-to-market roll-outs.

"One consumer product market where we have already seen what the packaging revolution can do is in two-way satellite ground terminals used for providing high-speed Internet connections. For example, TriQuint has reduced the die surface area for the transmit power amplifier by more than 60% while continuing to improve performance. Products that were once difficult to package or required multiple die in a single package to achieve performance goals are now offered in a selection of packages, making for easier, less-specialized manufacturing. Die shrink has led to cost reductions; TriQuint pioneered in this area," said Balut.

As the third component to its 'Simplifying Connectivity' vision, TriQuint is improving worldwide product access to enable greater productivity for RF engineers across the globe. In its first step, TriQuint announced in early May that it is simplifying its European coverage model by restructuring the distribution and sales channel. This will give engineers convenient, local access to RF professionals who will augment the TriQuint sales team as well as provide service from a world class logistics system to enhance delivery.

Another aspect of TriQuint's vision of simplified connectivity comes in the form of its first Product Selection Guide to be released June 5th. The Guide puts virtually all the company's large portfolio of amplifier, filter and switch products into one easy-to-use volume, thus streamlining product access while leaving open the option of custom solutions for unique needs. The Guide will enable designers and purchasing agents to more easily browse nearly the entire RF product line-up through the printed volume or on the web. By making RF engineers more aware of leading RF products, by providing them with a local interface and by easing the purchase process for timely samples and production volumes, TriQuint is helping simplify connectivity challenges.

TriQuint will release a number of new products at this year's MTT-S IMS exhibition in support of its vision including new RF front-end devices for WiMAX radio links as well as packaged HFET (heterostructure field-effect transistor) products for base station and point-to-point radio connections. These products will be joined by new packaged amplifiers for satellite ground terminals along with newly packaged Multi-Function Circuit (MFC) devices for next-generation point-to-point radios.

"TriQuint's Networks and Broadband vision is market focused. Highly-integrated module products and discrete parts will simplify Network solutions. Similar to the Handset market, TriQuint's Network vision simplifies the design, manufacturing and purchasing processes. These same trends are being realized in our Military product lines where more defense contractors than ever are expressing preferences for high-performing integrated and packaged devices.

"TriQuint's vision is to use our technology portfolio to build integrated RF front-end solutions for all fixed and mobile applications. We're packaging more devices than ever and we're making our products more readily available. Collectively, this simplifies the design and manufacturing process for connectivity convergence," said Balut.

See TriQuint in action along with new highly efficient, cost effective products at the IEEE MTT-S International Microwave Symposium and Exhibition in Honolulu June 5th-7th.

FORWARD LOOKING STATEMENTS

This TriQuint Semiconductor, Inc. (Nasdaq: TQNT) press release contains forward-looking statements made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Readers are cautioned that forward-looking statements such as statements of TriQuint's "unique technologies" and "recognized expertise" are statements that involve risks and uncertainties. The cautionary statements made in this press release should be read as being applicable to all related statements wherever they appear. Statements containing such words as "enabling next generation technology" or similar terms are considered to contain uncertainty and are forward-looking statements. A number of factors affect TriQuint's operating results and could cause its actual future results to differ materially from any results indicated in this press release or in any other forward-looking statements made by, or on behalf of, TriQuint, including, but not limited to: those associated with the unpredictability and volatility of customer acceptance of and demand for our products and technologies, the ability of our production facilities and those of our vendors to meet demand, the ability of our production facilities and those of our vendors to produce product with yields sufficient to maintain profitability, as well as the other "Risk Factors" set forth in TriQuint's most recent 10-Q report filed with the Securities and Exchange Commission. This and other reports can be found on the SEC web site, www.sec.gov. A reader of this release should understand that these and other risks could cause actual results to differ materially from expectations expressed / implied in forward-looking statements.

FACTS ABOUT TRIQUINT

TriQuint Semiconductor supplies high-performance modules and components to the world's leading communications companies. Our diverse markets include wireless handsets, base stations, broadband communications, military. We "Connect the digital world to the global network"[TM]. TriQuint creates standard and custom products using advanced processes that include gallium arsenide (GaAs), surface acoustic wave (SAW) and bulk acoustic wave (BAW) technologies. TriQuint has manufacturing facilities in Oregon, Texas, and Florida, a production plant in Costa Rica, and design centers in North America and Germany. These manufacturing and production facilities are certified to the ISO9001 international quality standard. TriQuint is headquartered at 2300 NE Brookwood Parkway, Hillsboro, Oregon 97124 (USA) and can be reached at [phone] (Fax: [phone]). Visit TriQuint at www.triquint.com.