TranSwitch Corporation Introduces TEPro-Fx28 for Channelized T1/E1 Access Systems.Complete System-on-Chip Solution Offers Outstanding Functionality and Flexibility for Next Generation Access TranSwitch Corporation has announced the introduction of TEPro-Fx28, a complete single chip and software solution for next generation channelized Refers to an architecture that transmits data in channels. It often refers to the 64 Kbps channels in T1 lines, which were originally developed to handle digitized voice streams (TDM). See TDM. T1/E1/DS0 applications such as wireless access, Multi-Service Access Platforms (MSAPs), computer telephony, TDM (Time Division Multiplexing) A technology that transmits multiple signals simultaneously over a single transmission path. Each lower-speed signal is time sliced into one high-speed transmission. over Packet, and Echo Cancellation Units (ECUs). TEPro-Fx28 is a RISC RISC in full Reduced Instruction Set Computing Computer architecture that uses a limited number of instructions. RISC became popular in microprocessors in the 1980s. processor-based System-on- Chip (SoC) with embedded DD-AMPS firmware and host Application Programming Interface (API) that meets the requirements of advanced access systems by offering outstanding functionality and flexibility in a space-saving, cost- effective package. TEPro-Fx28, the latest addition to TranSwitch's family of highly integrated multi-service VLSI VLSI: see integrated circuit. (1) (Very Large Scale Integration) Between 100,000 and one million transistors on a chip. See SSI, MSI, LSI and ULSI. (2) (VLSI Technology, Inc., Tempe, AZ, www.semiconductors. solutions, features an on-board RISC processor to facilitate design of channelized T1/E1 access systems. Supporting either 28 DS1 or 21 E1 line interfaces, TEPro-Fx28 can be configured for a variety of operating modes for greater design versatility. The on-chip processor is addressed by the host via an abstracted, encapsulated, message-based API, which eliminates the need for low level programming. The benefits to telecom OEMs and carriers include easier software integration and faster product development and time-to-market. "As with our TEPro device, TEPro-Fx28's SoC design and software package raise the industry standard in terms of a complete product offering," stated Brian Stroehlein, TranSwitch Product Marketing Manager. "TEPro-Fx28's software suite and high level of integration deliver a lower project cost and accelerated time-to-market for our OEM customers. We estimate that the firmware and host API that we provide customers royalty- and license-free is worth approximately $750,000 in OEM project budget savings. In addition, savings may approach the million dollar range, depending on the project, when 'cost of delay' in getting to market is taken into account." TEPro-Fx28 integrates a 28-channel DS1 framer; a 21-channel E1 framer; a 28- channel DS1/E1 cross-connect; a 672 x 4,096 channel non-blocking DS0 cross- connect for grooming, concentration, switching and multiplexing; a message mailbox FIFO (First In First Out) A storage method that retrieves the item stored for the longest time. Contrast with LIFO. See traffic engineering methods. FIFO - first-in first-out ; a multi-channel HDLC (High-level Data Link Control) A data link protocol from ISO for point-to-point communications over serial links. Derived from IBM's SDLC protocol, HDLC has been the basis for numerous protocols including X.25, ISDN, T1, SS7, GSM, CDPD, PPP and others. for SS7 and ISDN-PRI ISDN-PRI Integrated Services Digital Network Primary Rate Interface signaling (3rd-party stacks required); MVIP and H.100/H.110 TDM bus interfaces; and a high- performance, on-chip RISC processor for flexible, programmable control. TEPro-Fx28 is priced at $121 each in 1K quantities with samples available Q1 2004. The device is packaged in a 27mm X 27mm 456-lead Plastic Ball Grid Array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. (PBGA) and is pin- and API-compatible with TranSwitch's T3BwP and TEPro devices. |
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