Printer Friendly
The Free Library
5,671,888 articles and books
Member login
User name  
Password 
 
Join us Forgot password?

Toshiba Takes a License for Tessera's Micro BGA Package.


SAN JOSE, Calif.--(BUSINESS WIRE)--Sept. 7, 1999--

Tessera tessera: see mosaic. , Inc. announced it has extended licensing of its chip scale package A chip scale package (CSP) (sometimes, chip-scale package with a hyphen) is a type of integrated circuit chip carrier. According to the IPC, to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die that is being packaged.  (CSP (1) (Certified Systems Professional) An earlier award for successful completion of an ICCP examination in systems development. See ICCP.

(2) (Commerce Service P
) technology to Japan's Toshiba Corporation.

Toshiba will use Tessera's Micro Ball Grid Array “BGA” redirects here. For other uses, see BGA (disambiguation).

A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits.
 (Micro BGA(R)) technology for its applicable products, including Rambus DRDRAMs. According to Tessera, most Rambus licensees are packaging their DRDRAMs using the Micro BGA technology. Chips using Tessera's CSP technology can be mounted on both sides of a Rambus-in-line memory module (RIMM (Rambus Inline Memory Module) See RDRAM. See also RIM. ), which enable modules with capacities of 256 and 288 megabytes. Toshiba has a good reason for producing DRDRAMs in volume given strong demand for such devices from PC OEMs.

Toshiba has decided to use a variation of the standard Micro BGA technology, which uses wirebonds as opposed to the more standard integral bond leads used by most of Tessera licensees.

Tessera's president and CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. , Bruce McWilliams, said, "Toshiba is a world class company and we are proud to have them as a licensee. We applaud Toshiba for its ingenuity. We are ready to support them in every way that we can."

The Micro BGA package's rapid acceptance owes much to the ease with which it fits the existing infrastructure for surface-mounted IC assembly and packaging materials. In production, it lowers the end user's overall cost, while the Micro BGA package's enhanced reliability and performance reduces the user's risks.

About Tessera

Founded in 1990, Tessera designs, manufactures and licenses chip interconnect and packaging systems that reduce the size and cost of high-density integrated circuit packaging Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.

In the integrated circuit industry it is called simply packaging and sometimes semiconductor device assembly, or simply assembly.
. The company's Micro BGA package is a breakthrough that opens up the next generation of very-large-scale IC technology.

Current packaging and interconnect methods limit system performance by their size, material constraints or high manufacturing costs. Tessera has developed methods for chip-scale packaging that enable the IC to be housed in a package no larger than the chip itself. Tessera has 21 assembly licensees for its Micro BGA package and over 250 companies supporting the package with materials, equipment and test solutions.

In addition to Toshiba, Tessera's current assembly licensees for the Micro BGA package include Amkor/Anam Technology Inc., Advanced Micro Devices, Advanced Semiconductor Engineering, ChipPAC, Hitachi Cable Co., Hitachi Ltd., Hyundai Electronics Ltd., The Integrated Packaging Assembly Corp., Infineon AG, Intel Corp., LG Semicon, Mitsui Hightec, Samsung Electronics Co., ST Microelectronics, Sharp Corp., Shinko Electric Industries, Siliconware Precision Industries Ltd., Sony Corp. and Texas Instruments. Tessera Compliant Mounting Tape (TCMT TCMT Tail Catcher Muon Tracker
TCMT Tactical Communication Maintenance Technician
) licensees include 3M, Compeq, Flexera, Hitachi, Ltd., Hitachi Cable, LG Micron, Mitsui Co., North Corporation, Samsung Aerospace, and Shinko Electric. For detailed information, visit the Tessera website at www.tessera.com.
COPYRIGHT 1999 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 1999, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

 Reader Opinion

Title:

Comment:



 

Article Details
Printer friendly Cite/link Email Feedback
Publication:Business Wire
Date:Sep 7, 1999
Words:433
Previous Article:Guidant Announces FDA Clearance of the RX HERCULINK 14 Biliary Stent System.
Next Article:Tivoli Builds Leadership in Delivery of SAP Management Solutions.
Topics:



Related Articles
Tessera Licenses Chip-Scale Packaging Technology to Taiwan IC Assembler ChipMOS.
Less Than Half the Thickness of a Dime, Amkor's Extremely Thin Chip Scale IC Package Helps Toshiba Squeeze a 2 Gigabyte Hard Drive Into a PC Card.
Toshiba and Tessera Announce Innovative Technology Licensing Agreement.
SST OFFERS FLASH MEMORY PRODUCTS IN INDUSTRY'S SMALLEST MICRO-BGA PACKAGE.(Product Announcement)
Toshiba and Tessera Sign Expanded Licensing and Technology Agreement for Chip-Scale Packages.
Plexus and Tessera sign agreement.(EMSI News, People, Places)(Plexus Corp.)(Tessera Technologies Inc.)(Brief Article)
CSP solution.(Product Spotlight)(Tessera Inc.)(Brief Article)
Land patterns for BGA packages: routing, spacing and soldermask requirements for coarse- and fine-pitch ball grid arrays.(BGA Footprints)
Tessera and Matsushita Sign Technology Licensing Agreement.
For consumer products, thin is in: but the ideal package solution is up for debate.(On the Forefront)

Terms of use | Copyright © 2009 Farlex, Inc. | Feedback | For webmasters | Submit articles