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Toshiba Announces New High Efficiency, Space Saving Multi-Chip Module for DC-DC Converters.

Toshiba Combines MOSBD With a MOSFET and Driver IC for Greater Power Output and Efficiency

IRVINE, Calif., Sept. 20 /PRNewswire/ -- To address the demand for higher current and higher frequency power solutions for DC-DC converters, Toshiba America Electronic Components, Inc. (TAEC)* with its parent company, Toshiba Corporation (Toshiba), today announced that the company has created a multi-chip module (MCM) that combines a driver IC with a MOSFET and Toshiba MOSBD(TM), a single-die combination of a power MOSFET and a Schottky Barrier Diode, in one compact package to achieve greater power output, higher efficiency, a faster response time and improved precision.

Developed by Toshiba, the first of these MCM's in a planned series for DC-DC converter applications is designated TB7001FL. The device features a wide input voltage range, a high operating frequency up to 1MHz, and a very small, thin package (8mm x 8mm x 0.85mm), to make it an ideal solution for use in applications such as notebook and desktop PCs, servers, and high-current point of load DC-DC converters.

The device includes a high side MOSFET, a MOSBD to handle low-side functions in the DC-DC converter, and a driver IC that includes a high speed MOS gate driver and level shifter functions to drive the high-side MOSFET. Built-in functions include low-side MOSBD shutdown input, thermal shutdown, and under-voltage protection. The MCM solution minimizes stray inductance because the bonding wires are very short. This enables the device to achieve a higher efficiency than would be achieved with comparable discrete solutions. The compact, innovative packaging radiates heat from the bottom of the MCM, dissipating it into the printed circuit board. This enables the device to achieve very low thermal resistance of approximately 3 degrees Celsius per watt, and high efficiency ratings of 84 percent (at V(in) = 12V, V(out) = 1.5V, I(out) = 20A and F(c) = 1MHz).

By adding the driver IC with supplementary capabilities including protection features such as the MOSBD shutdown input, thermal shutdown and under-voltage protection, the new TB7001FL MCM provides a level of integration beyond the dual-channel MOSBD, which combined a high-side MOSFET with a low-side MOSFET/Schottky Barrier Diode.

"With this device Toshiba is responding to customer demand for higher power, faster response time, increased precision, and higher efficiency all in a smaller structure for their portable devices," said Sam Abdeh, business development specialist for power products for TAEC. "This new MCM showcases Toshiba's expertise in innovative packaging for components targeted for use in ever-smaller consumer electronic devices by integrating three key devices into a single module to give design engineers the ability to produce more powerful, yet smaller mobile products."
 Technical Specifications

 Input Voltage: V(in) = up to 19V
 Output Voltage: V(out) = 1.5V
 Output Current: I(out) = 20A
 Switching Frequency: F(sw) = 1MHz
 Efficiency: Greater than 84% (at V(in) = 12V, V(out) = 1.5V,
 I(out) = 20A, F(c) = 1MHz)
 Supply Voltage: V(dd) = 5V




Toshiba's TB7001FL MCM device for DC-DC converters are Lead(Pb)-Free(1), and are RoHS-compatible(2) which means they are compatible with the proposed requirements of the European Union's Reduction of Hazardous Substances (RoHS) Directive(3), scheduled to take effect July 1, 2006.

Pricing and Availability

Customer samples of the TB7001FL are available now and priced in sample quantities at $4.50 each.

*About TAEC

Combining quality and flexibility with design engineering expertise, TAEC brings a breadth of advanced, next-generation technologies to its customers. This broad offering includes memory and flash memory-based storage solutions, a broad range of discrete devices, displays, medical tubes, ASICs, custom SOCs, microprocessors, microcontrollers and wireless components for the computing, wireless, networking, automotive and digital consumer markets.

TAEC is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corp. (Toshiba), Japan's second-largest semiconductor manufacturer and the world's ninth-largest integrated manufacturer of electric and electronic equipment. In almost 130 years of operation, Toshiba has recorded numerous firsts and made many valuable contributions to technology and society. For additional company and product information, please visit TAEC's Web site at http://chips.toshiba.com/. For technical inquiries, please e-mail Tech.Questions@taec.toshiba.com.

(1) Toshiba defines "Lead(Pb)-Free" in accordance with current industry standards as no more than 0.1 percent lead(Pb) by weight in homogenous materials. This does not mean that Toshiba products that are labeled "Lead(Pb)-Free" are entirely free of lead(Pb).

(2) Toshiba Semiconductor Company defines "RoHS-Compatible" semiconductor products as products that either (i) contain no more than a maximum concentration value of 0.1% by weight in homogeneous materials for lead, mercury, hexavalent chromium, polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs) and no more than 0.01% by weight in homogenous materials for cadmium; or (ii) fall within one of the stated exemptions set forth in the Annex to the RoHS Directive.

(3) Toshiba Semiconductor Company defines the "RoHS Directive" as the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment.

Information in this press release, including product pricing and specifications, content of services and contact information, is current on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at http://www.chips.toshiba.com/, or from your TAEC representative.

All trademarks and tradenames held within are the properties of their respective holders.

Reader Inquiries: Tech.Questions@taec.toshiba.com

CONTACT: Jan Johnson of MultiPath Communications, +1-714-633-4008, jan@multipathcom.com, for Toshiba America Electronic Components, Inc.; or Poloi Lin of Toshiba America Electronic Components, Inc., +1-949-623-3098, poloi.lin@taec.toshiba.com

Web site: http://www.chips.toshiba.com/

Web site: http://chips.toshiba.com/

Web site: http://www.toshiba.com/taec
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Geographic Code:9JAPA
Date:Sep 20, 2005
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