Toshiba Announces Its New Surface Mount Thin Flat Package.IRVINE, Calif.--(BUSINESS WIRE)--Nov. 8, 1999-- Toshiba America Electronic Components Inc. Monday announced the development of a new thin and compact package for power semiconductors. The Thin Flat Package (TFP TFP Total Factor Productivity TFP Tradition, Family and Property TFP Time for Prints TFP Transference-Focused Psychotherapy TFP Trade for Prints (modeling) TfP Training for Peace (South Africa) ) is 40 percent smaller than Toshiba's TO-220SM package (or D2-PAK) and is 62 percent thinner than the size of a TO-220 package. Toshiba was able to achieve this size reduction by reducing the bonding wire size and optimizing the internal frame structure. Toshiba developed unique flat leads along the rear side of the new TFP package. The shorter lead bonding structure of this new package and the special heat sink A material that absorbs heat. Typically made of aluminum, heat sinks are widely used in amplifiers and other electronic devices that build up heat. Small heat sinks are the most economical method for cooling microprocessors and other chips. design allows for 20 percent lower thermal dissipation Dissipation See also Debauchery. Breitmann, Hans lax indulger. [Am. Lit.: Hans Breitmann’s Ballads] Burley, John wasteful ne’er-do-well. [Br. Lit. when compared with a D2-PAK. These unique features make the TFP package ideal for applications where real estate space is a premium and where reducing heat dissipation Noun 1. heat dissipation - dissipation of heat chilling, cooling, temperature reduction - the process of becoming cooler; a falling temperature is a key design criteria Noun 1. design criteria - criteria that designers should meet in designing some system or device; "the job specifications summarized the design criteria" criterion, standard - the ideal in terms of which something can be judged; "they live by the standards of their . These applications include DC/DC converters, power supplies for cellular phones and other high-current and high-speed switching products. "As the leader in power semiconductors, Toshiba continually con·tin·u·al adj. 1. Recurring regularly or frequently: the continual need to pay the mortgage. 2. strives to enhance our product offering through new developments," stated Lupita Ho, business development manager for TAEC's power semiconductors. "With the development of the new TFP package, we are now able to offer designers a package solution that meets their need for ever decreasing board space."
TFP dimensions:
-- Foot print area: 9mm x 9mm
-- Package width: 9mm
-- Package height: 2.8mm
-- Weight: 0.75g
-- Other: Two source terminals are applied to the power
MOSFET
Toshiba's new TFP package will initially be offered in the
company's line of Power MOSFETs, Schottky Barrier Diodes and High
Efficiency Diodes.
TFP in Power MOSFETs
Part Number Rating Application Production
Schedule
2SK3387 150V/18A/80mohm DC/DC converter 4Q '99
2SK3388 250V/20A/105mohm DC/DC converter 4Q '99
2SK3389 30V/75A/4mohm DC/DC converter 4Q '99
S2Y59 60V/75A/8mohm High current & 1Q '00
speed switching
S2Y60 100V/75A/15mohm High current & 1Q '00
speed switching
S2Y61 150V/65A/28mohm High current & 1Q '00
speed switching
S2Y62 200V/45A/55mohm High current & 1Q '00
speed switching
S2Y63 250V/30A/105mohm High current & 1Q '00
speed switching
TFP in Schottky Barrier Diodes
Part Number Rating Application Production
Schedule
U30FWJ2C53M 30V/30A/0.47V DC/DC converter 2Q '00
U30QWK2C53 120V/30A/0.85V DC/DC converter 4Q '99
TFP in High Efficiency Diodes
Part Number Rating Application Production
Schedule
U20DL2C53A 200V/20A/35ns DC/DC converter 4Q '99
U20GL2C53A 400V/20A/35ns DC/DC converter 2Q '00
Pricing Pricing for the new TFP packages range from $0.45 to $5, depending on the diode or MOSFET (Metal Oxide Semiconductor Field Effect Transistor) The most popular and widely used type of field effect transistor (see FET). MOSFETs are either NMOS (n-channel) or PMOS (p-channel) transistors, which are fabricated as individually packaged family and the quantity. About Toshiba Toshiba America Electronic Components Inc. (TAEC TAEC Toshiba America Electronic Components, Inc. TAEC Thailand Atomic Energy Commission ) is the North American North American named after North America. North American blastomycosis see North American blastomycosis. North American cattle tick see boophilusannulatus. engineering, manufacturing, marketing and sales arm of Toshiba Semiconductor Co. and Display Devices and Components Co. TAEC is recognized as one of the world's largest suppliers of semiconductor, electronic component and storage solutions. Toshiba's Semiconductor Co. is one of the world's leading manufacturers and suppliers of semiconductor products including LSIs, microprocessors This is a list of microprocessors. Intel
(2) One of two major categories of transistor; the other is "field effect transistor" (FET). Although the first transistors and first silicon chips were bipolar, most chips today are field effect transistors wired as CMOS logic, which components. The company is also responsible for global sales and marketing of other major electronic components including liquid crystal displays liquid crystal display (LCD) Optoelectronic device used in displays for watches, calculators, notebook computers, and other electronic devices. Current passed through specific portions of the liquid crystal solution causes the crystals to align, blocking the passage of light. , color display and picture tubes, lithium-ion and other secondary batteries. For additional information, visit TAEC's Web site at, http://www.toshiba.com/taec. Note to editors: Reader inquiries publish 800/879-4963, ext. 256 Photo available upon request, contact Kim Buckley, 714/245-7500. |
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