Tokyo Electron, Sematech Partner on 3D Interconnect and High-Mobility Channel Materials.Tokyo, Japan, Jan 26, 2007 - (JCN JCN Japan Corporate News JCN Journal of Cognitive Neuroscience JCN Journal of Cardiovascular Nursing JCN Journal of Christian Nursing JCN Job Control Number JCN Journal of Child Neurology JCN joint communications network (US DoD) ) - Tokyo Electron Limited (TEL TEL Telephone TEL Telegram TEL Telugu (langauge) TEL Terrorist Exclusion List TEL Technology-Enhanced Learning TEL Transporter-Erector-Launcher TEL Tetra-Ethyl Lead TEL Team Deutsche Telekom ) and Texas-based Sematech announced a multi-year joint development program aimed at improving the prospects for using 3D interconnect (1) To attach one device to another. (2) A physical port (plug, socket) or wireless port (transmitter, receiver) used to attach one device to another. technology and high mobility channel materials in advanced semiconductor manufacturing. These programs mark the beginning of a new collaboration Working together on a project. See collaborative software. in which Sematech will partner with leading suppliers to address key technology challenges that are important to semiconductor customers. This offers suppliers lower R&D costs, accelerated results in technology development, and more efficient and effective technology implementation into leading-edge production fabs. Under agreements involving an exchange of intellectual property and funding, Sematech and TEL engineers will collaborate on two separate projects, one a three-year effort to transcend the barriers to 3D processing in volume manufacturing, and the other a two-year project to advance the feasibility of using silicon-germanium in transistor gate stacks to increase processing speed See MHz. . Copyright [c] 2007 Japan Corporate News Network. All rights reserved. |
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