Third Annual Tin Whisker Workshop Scheduled for May 30 at ECTC; Event co-sponsored by iNEMI, the IEEE CPMT Society and ECTC.HERNDON, Va. and PISCATAWAY, NJ -- The International Electronics Manufacturing Initiative (iNEMI), will co-sponsor the third annual Tin Whisker Workshop with the IEEE (Institute of Electrical and Electronics Engineers, New York, www.ieee.org) A membership organization that includes engineers, scientists and students in electronics and allied fields. Components, Packaging and Manufacturing Technology Society (CPMT CPMT Components, Packaging and Manufacturing Technology (IEEE Society) CPMT Civilian Protection Monitoring Team CPMT Central Pre-Medical Test (India) CPMT Channel Path Measurement Tool ), and the 56th Electronic Components and Technology Conference (ECTC ECTC Electronic Components and Technology Conference ECTC Erosion Control Technology Council ECTC Earth Commission for Thermostatic Control (from environmentalist book The Weather Makers) ECTC Expected Cost to Company ). The workshop is scheduled for May 30, 2006, at ECTC in San Diego, Calif. The workshop will provide participants an update on recent activities in both the testing and modeling of tin whiskers. In addition, a roundtable discussion will focus on implementation of the JEDEC/IPC specifications relating to tin whiskers: JESD JESD Jobs and Employment Services Department 201, "Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes;" JEDEC/IPC joint publication JP002, "Current Tin Whiskers Theory and Mitigation Practices Guideline;" and JESD22A121, "Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes." The goal of the workshop is to help industry identify strategies to help assure that long lifecycle applications will not be subject to tin whisker failures. The workshop is chaired by Ron Gedney, iNEMI consultant. Maureen Williams, mechanical engineer for NIST (National Institute of Standards & Technology, Washington, DC, www.nist.gov) The standards-defining agency of the U.S. government, formerly the National Bureau of Standards. It is one of three agencies that fall under the Technology Administration (www.technology. is co-chair. Dr. Henning Leidecker chief engineer of the Parts, Packaging and Assembly Technologies Office of NASA NASA: see National Aeronautics and Space Administration. NASA in full National Aeronautics and Space Administration Independent U.S. , will serve as moderator. For additional information about the workshop, visit: http://www.inemi.org/cms/calendar/06_ECTC_TW_Workshop.html "These workshops have proven valuable for bringing industry, government and academia together to share knowledge about, and expand our understanding of, tin whiskers," said Carol Handwerker, professor of materials engineering at Purdue University, who is the former chief of the Metallurgy Division at NIST and moderator of the first Tin Whisker Workshop. "The first workshop focused the efforts of the electronics community by clarifying our understanding of when and how whiskers See metal whiskers. grow. The second workshop assessed state-of-the art analytical techniques, such as focused ion beam Focused ion beam, also known as FIB, is a technique used particularly in the semiconductor and materials science fields for site-specific analysis, deposition, and ablation of materials. The FIB is a scientific instrument that resembles a scanning electron microscope. (FIB fib n. An insignificant or childish lie. intr.v. fibbed, fib·bing, fibs To tell a fib. See Synonyms at lie2. ), electron backscatter diffraction Electron backscatter diffraction (EBSD), also known as backscatter Kikuchi diffraction (BKD) is a microstructural-crystallographic technique used to elucidate the crystallographic texture or preferred orientation of any crystalline or polycrystalline materials. (EBSD EBSD Electron Backscatter Diffraction ) and wafer curvature, that could be used to separate the complex effects of stress, composition and structure on whisker formation. This workshop will discuss the risks that remain, based on our current understanding of how whiskers form, and how recent standards specifications are being implemented." "As the commercial market moves towards environmentally friendly products free of lead, it becomes more important than ever for the industry to understand the tin whisker phenomenon," said Torsten Wipiejewski, ECTC program chair. "ECTC is a proud to once again host this timely and informative workshop." About ECTC The Electronic Components and Technology Conference (ECTC) is an international conference that brings together the best in packaging, components and microelectronic systems science, technology and education. Technical sessions focus on developments in several areas, including: electronic components, materials assembly, packaging, system packaging, optoelectronics, reliability, and simulation. Emerging technology sessions covering issues such as nanotechnology and biotechnology explore tomorrow's development's today. ECTC is sponsored by the IEEE Components, Packaging and Manufacturing Technology Society (CPMT), and the Electronic Industries Alliance (EIA (Electronic Industries Alliance, Arlington, VA, www.eia.org) A membership organization founded in 1924 as the Radio Manufacturing Association. It sets standards for consumer products and electronic components. ). For more information, visit www.ectc.net. About iNEMI The International Electronics Manufacturing Initiative's mission is to assure leadership of the global electronics manufacturing supply chain. Based in Herndon, Va., the industry-led consortium is made up of approximately 70 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. For additional information about iNEMI, visit www.inemi.org. About the IEEE CPMT Society The IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for professionals engaged in the research, design and development of advances in microsystems packaging and manufacture. Members include authorities in microelectronics, nanotechnology, semiconductor processing, materials and connector technologies at companies, universities, government research centers and allied enterprises around the globe. For additional information, visit www.cpmt.org. |
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