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Thermoplastics Aim for Electronic Encapsulation.


Nine thermoplastic compounds for protecting sensitive electronic parts from moisture have been launched by RTP Co., Winona, Minn. RTP says its new electronic component encapsulation compounds have better dielectric and heat-dissipation properties than do the thermoset materials more commonly used in these applications. Other benefits are said to be reduced coefficient of thermal expansion coefficient of thermal expansion,
n See expansion, thermal coefficient.
 and an improved hermeticity (i.e., sealability) of parts.

Matrix resins in the "([ec).sup.2]" line include PBT, PPS (Packets Per Second) The measurement of activity in a local area network (LAN). In LANs such as Ethernet, Token Ring and FDDI, as well as the Internet, data is broken up and transmitted in packets (frames), each with a source and destination address. , PEEK, LCP, PPA (polyphthalamide from BP Amoco), thermoplastic polyimide, and syndiotactic A syndiotactic macromolecule in polymer chemistry is a tacticity essentially comprising alternating enantiomeric configurational base units which have chiral or prochiral atoms in the main chain in a unique arrangement with respect to their adjacent constitutional units.  polystyrene (SPS), a new crystalline polymer from Dow Plastics.

Blends of chopped glass and non-conductive minerals are used to control the compounds' coefficients of thermal expansion and ensure good adhesion of encapsulant en·cap·su·lant  
n.
A material used for encapsulating.
. Colored and laser-markable versions are offered.
COPYRIGHT 2001 Gardner Publications, Inc.
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2001, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Title Annotation:new from RTP Co.
Comment:Thermoplastics Aim for Electronic Encapsulation.(new from RTP Co.)
Publication:Plastics Technology
Article Type:Brief Article
Geographic Code:1USA
Date:Jun 1, 2001
Words:123
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