Thermal protection device.ALPHA CoolCap protects components and packages during lead-free reflow (1) The process of heating and melting the solder that has been screen printed onto a printed circuit board in order to bond chips and other components to the board. Surface mount chips (SMT) use the reflow method. Contrast with wave soldering. See also reflowable text. and rework re·work tr.v. re·worked, re·work·ing, re·works 1. To work over again; revise. 2. To subject to a repeated or new process. n. . Helps maintain yield and throughput, without process changes and redesign. Reusable re·use tr.v. re·used, re·us·ing, re·us·es To use again, especially after salvaging or special treatment or processing. re·us custom-fitted caps keep packages below 245[degrees]C or 260[degrees]C and minimize temperature variation within packages to 2[degrees] to 5[degrees]C, while minimizing warpage, popcorning and delamination delamination /de·lam·i·na·tion/ (de-lam?i-na´shun) separation into layers, as of the blastoderm. de·lam·i·na·tion n. 1. A splitting or separation into layers. 2. . Protects joints from unwanted softening or reflow. [ILLUSTRATION OMITTED] Cookson Electronics Assembly Materials, alphametals.com Booth 2443 |
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