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Thermal Management Properties of Plastics Crucial for Use in Electronic Devices.


DUBLIN, Ireland -- Research and Markets (http://www.researchandmarkets.com/reports/c46422) has announced the addition of "Advances in Plastics for Electronic Devices (Technical Insights)" to their offering.

This Frost & Sullivan research service entitled Advances in Plastics for Electronic Devices covers advances in plastics for electronics and electronic devices. It provides a comprehensive analysis of advanced electronic plastics, electrical/electronic plastic material trends, and global electronic device market drivers. It also covers advanced plastics in electronic technologies and applications in the areas of automotive electronics, consumer products electronics, as well as industrial device electronics. The research service provides information on major companies and academic institutions involved in the development of innovative plastic materials.

Market Sectors

Expert Frost & Sullivan analysts thoroughly examine the following market sectors in this research:

By Application Sector:

* Chemicals and Materials

* Electronic Devices

* Automation and Electronics

* Automotive and Transportation

* Environmental Technologies

* Surface Mount Technologies

* Mobile and Wireless Communications wireless communications

System using radio-frequency, infrared, microwave, or other types of electromagnetic or acoustic waves in place of wires, cables, or fibre optics to transmit signals or data.
 

Technologies

The following technologies are covered in this research:

* Resin Advances in Electronic Devices

* Specialty E/E E/E End-To-End
E/E Electrical/Electronics
 Compounds/Additives

* Flame Retardant Flame retardants are materials that inhibit or resist the spread of fire. Naturally occurring substances such as asbestos as well as synthetic materials, usually halocarbons such as polybrominated diphenyl ether (PBDEs), polychlorinated biphenyls (PCBs) and chlorendic acid  Systems

* Bioplastic FR Materials

* Inherently Conductive Polymers

* MID LDS LDs

See: Liquidated damages
 Materials

* Organic Electronics

Market Overview

Polymers for Use in Conductive Electronics to Witness Significant Growth

The exceptional insulation capabilities of plastics have been pivotal to the use of polymers in the development of electrical and electronic devices. In addition to insulation, the conductive properties of plastics combined with superior design/processing methods are offering economical solutions for the electrical/electronic (E/E) market. Plastic electronics based on inherently conductive polymers (ICPs) and flexible substrates are set to change the face of the electronics industry, says the analyst of this research service. The global demand for conductive electronic polymer products is forecast to expand by 14.5 per cent per year until 2008.

Future products include roll-up displays for computers and mobile phones, flexible solar panels for power portable equipment, as well as ultra-low-cost radio frequency identification See RFID.  (RFID (Radio Frequency IDentification) A data collection technology that uses electronic tags for storing data. The tag, also known as an "electronic label," "transponder" or "code plate," is made up of an RFID chip attached to an antenna. ) tags. Recently developed conductive transparent polymers are also functioning as organic light emitting diodes See LED.  in displays. New materials such as carbon nanotubes and organic molecules, with conducting and semiconducting properties are set to bring in sophisticated plastic electronic displays for cellular phones and other portable devices. With the ongoing trend toward miniaturization min·i·a·tur·ize  
tr.v. min·i·a·tur·ized, min·i·a·tur·iz·ing, min·i·a·tur·iz·es
To plan or make on a greatly reduced scale.



min
 and the consequent demand for high-performance plastics that provide tough, stable parts with thin walls, the search for specialty polymers is expected to intensify.

Thermal Management Properties of Plastics Crucial for Use in Electronic Devices

Compact and complex printed circuit boards with rising operating temperatures are pushing researchers to focus on the thermal management capabilities of plastics used in electronic devices. In addition to new resins, additives, and fillers to meet thin-wall and high-temperature requirements for molded parts, there is a need for more-efficient heat sinks that that are used to cool semiconductors, observes the analyst. While aluminium and copper account for much of the materials used for the development of heat sinks for electronics, thermally conductive thermoplastics are also offering some interesting alternatives.

The growing use of lead-free soldering to comply with the European Union European Union (EU), name given since the ratification (Nov., 1993) of the Treaty of European Union, or Maastricht Treaty, to the

European Community
 Restriction of Certain Hazardous Substances (RoHS) directive is adding to the demand for plastics with exceptional thermal management properties. New plastic materials must be able to accommodate higher soldering temperatures (250- 260 degrees Celsius), especially for electronic parts that undergo surface-mount reflow soldering Reflow soldering is the most common means to attach a surface mounted component to a circuit board, and typically consists of applying solder paste, positioning the devices, and reflowing the solder in a conveyorized oven. . Compounds made of high-temperature thermoplastics such as liquid crystal polymer Liquid crystal polymers (LCPs) are a unique class of wholly aromatic polyester polymers that provide previously unavailable high performance properties. In particular, they are highly inert chemically and highly resistant to fire.  and polyethersulfone used in molded interconnect devices and low-k dielectric polymers in semiconductor fabrication fabrication (fab´rikā´shn),
n the construction or making of a restoration.
 are expected to register strong growth.

Companies Mentioned:

* Genestar

* Lanxess

* Ticona

* Degussa

* Mitsubishi

* Dow Cornings

* Konarka Technologies

* Techmer Lehvoss

For more information visit http://www.researchandmarkets.com/reports/c46422
COPYRIGHT 2006 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2006, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Publication:Business Wire
Date:Dec 4, 2006
Words:601
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