The IEEE Components, Packaging, and Manufacturing Technology Society Announces its 2003 Award Winners.
"These individuals represent excellence in the industry. Their contributions are furthering today's technologies, and ultimately improve the quality of life for everyone," stated Rao Bonda, Ph.D. Chair, CPMT Society Awards Program.
The following is a detailed listing of the awards and award winners: * Dr. Dennis Olsen (Consultant, Scottsdale, Ariz.) -- The David Feldman Outstanding Contribution Award -- for his exceptional service to the IEEE and the CPMT Society and its conferences for over 20 years. Formerly with Motorola, he earned recognition through a variety of distinguished awards, such as the Patent of the Year Award in 1993. Over the years, Dr. Olsen was issued five patents covering a broad spectrum of electronic packaging, ranging from a state-of-matter patent for lead-free solder alloy to a proke card for testing unencapsulated semiconductors for known good die applications. He continues to demonstrate exceptional service to the Society, the industry and its technology through active leadership in organizing conference programs, serving on numerous committees, and organizing and being elected as the 1st chair of the CPMT Society Phoenix, Ariz. Chapter. He is also a past president of the CPMT Society. * Dr. Thiam Beng Lim (Deputy Director, Institute of Microelectronics, Singapore) -- Outstanding Sustained Technical Contribution Award -- for his leading edge research in advanced packaging technologies, and for managing and transferring the electronic packaging research and development to the industry and other research organizations worldwide. Dr. Lim has championed Singapore's influence in the electronics industry. His work and dedication have helped it evolve from a low-end high volume manufacturing industry to the development and manufacturing of leading-edge products competing with the best in the world. He is also a founding committee member of the prestigious IEEE CPMT Society's Electronics Packaging Technology Conference (EPTC) held in Singapore. * Mr. Bruce Freyman (Amkor Technology, Chandler, Ariz.) -- Electronics Manufacturing Technology Award -- for his pioneering work in developing the PBGA package and for his vision and drive in making the PBGA package and its format commercially successful. Mr. Freyman is the co-inventor and co-developer of the overmolded plastic ball grid array and holds 13 patents pertaining to array. He is a recognized leader in the sub- contract packaging industry with over 20 years in the industry, the last ten with Amkor Technology. He was formerly Motorola's Communications Sector's I.C. Packaging Manager. It was his leadership, vision and hard work that drove he and his sales team at Amkor to be the messengers of PBGA technology at virtually every semiconductor company in the world in 1993 and 1994, changing the way the technology is applied today. * Mr. Michael B. McShane, Mr. Paul Lin and Mr. Howard Wilson (Motorola, Austin, Tex. -- Paul and Howard were formerly with Motorola) -- Exceptional Technical Achievement Award -- for co-inventing the PBGA package that resulted in new and revolutionary applications for the electronic packaging technologies. In fact, this innovation is now accepted worldwide as the preferred packaging technology for new products. The PBGA package technology has also driven a new supporting infrastructure, such as assembly and test equipment. In 2001, Mr. McShane was recognized as the Microelectronic Packaging Technologist of the Year by Advanced Packaging Magazine and MEPTEC. Mr. McShane was most recently the General Chairman of the 2002 ECTC, and an active senior member of IEEE for 13 years. He is also on a past member of the CPMT Society's Board of Governors. * Prof. Emmanouil (Manos) Tentzeris (Georgia Institute of Technology, Atlanta, Ga.) -- Outstanding Young Engineer Award -- for his contributions to RF circuit design of high performance IC devices and to IEEE and CPMT Society sponsored conferences and activities. His numerous contributions include the development of the wavelet-based MultiResolution Time-Domain (MRTD) technique that allows for the system- level simulation of RF-Packaging structures with demonstrated significant savings in memory and execution time requirements on one and two order of magnitude, respectively with respect to the conventional full-wave simulation tools. MRDT was applied for the modeling and the evaluation of the most popular RF packaging structures, mainly of flip- chip, wirebonds and embedded passives, that led to the full-wave system- level analysis of packaged wireless multilayer modules for the first time ever. Prof. Tentzeris is a member of the CPMT Society, and a member of IEEE for over 13 years. He remains active in reviewing technical papers, organizing conferences and other volunteer-leader activities.
The awards will be presented at the 53rd Electronics Components & Technology Conference (ECTC) in New Orleans, Louisiana, USA, during the CPMT Society luncheon on May 29, 2003. The exception is the Electronics Manufacturing Technology Award, which will be presented at the International Electronics Manufacturing Technology (IEMT) Symposium and SEMICON West 2003 in San Jose, California, USA, July 16 - 18.
About the CPMT Society
IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacture. Members include world-renowned authorities in microelectronics, optoelectronics, semiconductor processing, materials and connector technologies at companies, universities, government research centers and allied enterprises around the globe. The CPMT Society (http://www.cpmt.org/) promotes technical excellence and professional development, information exchange and networking opportunities through its journals, conferences and workshops, committee activities, chapter events, educational programs and awards. The Institute of Electrical and Electronics Engineers, Inc. (IEEE), CPMT Society's parent organization, is the world's largest international technical professional society with more than 360,000 members in over 150 countries.
CONTACT: Bob Conrad, +1-202-466-7391, ext. 1123, for IEEE Components, Packaging and Manufacturing Technology Society
Web site: http://www.cpmt.org/
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|Date:||May 6, 2003|
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