The Chinese Mobile Phone Market: Semiconductor Components.DUBLIN, Ireland -- Research and Markets (http://www.researchandmarkets.com/reports/c45645) has announced the addition of Semiconductor Component Configuration of 100 Mobile Phone Models in the Chinese Market, 2005-2006 to their offering. This report provides a detailed list of semiconductor components for 100 mobile phone models in the Chinese market, including Processor, Power Management, Radio Frequency, Memory, Sound Source and the others. 90% of the selected phone models were launched in 2005, the rest are due to be launched in 2006. Processor: including digital baseband, analog baseband, camera back-end IC, and application processor. Power management: including main screen white light LED driver, sub-screen white light LED driver, keypad backlight back·light n. A type of spotlight, used in photography, that illuminates a subject from behind. tr.v. back·light·ed or back·lit , back·light·ing, back·lights LED driver, power management, DC/DC converter, flashlight driver RF: including power magnifier, transceiver, RF front-part Memory: including MCP (1) See Microsoft certification. (2) (MultiChip Package) A chip package that contains two or more chips. It is essentially a multichip module (MCM) that uses a laminated, printed-circuit-board-like substrate (MCM-L) rather than ceramic (MCM-C). memory, NAND (Not AND) A Boolean logic operation that is true if any single input is false. Two-input NAND gates are often used as the sole logic element on gate array chips, because all Boolean operations can be created from NAND gates. See flash memory. memory, NOR memory Sound source: Audio CODEC, Audio magnifier, Sound source (polyphony polyphony (pəlĭf`ənē), music whose texture is formed by the interweaving of several melodic lines. The lines are independent but sound together harmonically. ) Others: Including FM radio IC, EMI (ElectroMagnetic Interference) An electrical disturbance in a system due to natural phenomena, low-frequency waves from electromechanical devices or high-frequency waves (RFI) from chips and other electronic devices. Allowable limits are governed by the FCC. filter IC, Bluetooth IC, touch screen IC, infrared transmission, simulation switch IC. This report is also available in Chinese - please search our website for further details For more information visit http://www.researchandmarkets.com/reports/c45645 |
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