Tevet Introduces a New In-Situ Metrology System to Measure Semiconductor Film Thickness.Business Editors/High-Tech Writers YOKNEA'M, Israel--(BUSINESS WIRE)--July 17, 2001 ISTMS Addresses Industry Need for Advanced Integrated and In-Situ Metrology Solutions; Yield, Throughput and Uptime Can All be Enhanced Tevet Process Control Technology , a start up company in the area of advanced metrology solutions for the semiconductor industry, today announced the introduction of its ISTMS -- In-Situ Thickness Measurement System, after completion of beta testing (programming) beta testing - Testing a pre-release (potentially unreliable) version of a piece of software by making it available to selected users. This term derives from early 1960s terminology for product cycle checkpoints, first used at IBM but later standard throughout the in multiple customer sites. Installed in beta sites An organization or group that is beta testing hardware and/or software. See beta test. just one year ago, the ISTMS has demonstrated its cost-saving capabilities in measuring film thickness while integrated with commercial single wafer CVD CVD Cardiovascular disease, see there processing tools in a production fab. The ability to measure critical parameters during the manufacturing process could prevent much of the wafer-to-wafer and device-to-device variation in finished products, and speeds the correction time of process excursions. Tevet's thickness decomposition method In constraint satisfaction, a decomposition method translates a constraint satisfaction problem into another constraint satisfaction problem that is binary and acyclic. Decomposition methods work by grouping variables into sets, and solving a subproblem for each set. (TM) was specifically developed to address the special requirements needed for advanced process control using in-situ or integrated metrology. Tevet's solution relies on rapid, broad spectral analysis Spectral analysis may refer to:
Integrated measurement modules are integrated with the process tool, within the footprint of the process tool, but outside the process chamber. In addition to the hardware integration, the measurement data is used directly by the process tool to adjust its control parameters Control parameters In a nonlinear dynamic system, the coefficient of the order parameter; the determinant of the influence of the order parameter on the total system. See: Order Parameter. on a wafer-by-wafer basis. In-Situ measurement systems are also integrated in the process tool, but are measuring while the wafer is being processed. The process may be interrupted to make a measurement, then completed based on the measurement feedback, or process and measurements can be performed in parallel. Using in-situ measurements, a fab could theoretically be free of mis-processed wafers because real-time corrections could be made on each wafer. Examples of what the ISTMS can measure include: multiple films stacked on the product wafer, thickness on top of complicated patterns, dense structures without the need for pattern recognition or vision, and measurement on moving (or spinning) wafers. Films measured would include oxide, nitride nitride Any of a class of chemical compounds in which nitrogen is combined with an element of similar or lower electronegativity, such as boron, silicon, and most metals. Some examples of nitrides include boron nitride, calcium nitride, aluminum nitride, and cyanogen. , poly, barrier metals, STI STI systolic time intervals. trench, photoresists and SOD (spin-on dielectrics). "ISTMS entails a new approach for performing integrated and in-situ measurements," said Ofer Du-Nour, president and director of technology of Tevet. "Unlike traditional integrated metrology solutions that rely mainly on re-packaging of existing, classical metrology solutions into a new modular package, Tevet is employing a new measurement scheme that relies on unique technology and algorithms that make it more suitable for in-situ or integrated measurements." Tevet will market the ISTMS to both IC manufacturers and OEM (Original Equipment Manufacturer) The rebranding of equipment and selling it. The term initially referred to the company that made the products (the "original" manufacturer), but eventually became widely used to refer to the organization that buys the products and processing equipment manufacturers that have a clear need for an Integrated Metrology solution as an independent option or as part of an APC (1) (American Power Conversion Corporation, West Kingston, RI, www.apcc.com) The leading manufacturer of UPS systems and surge suppressors, founded in 1981 by Rodger Dowdell, Neil Rasmussen and Emanual Landsman, three electronic power engineers who had worked at MIT. (Advanced Process Control) scheme. About Tevet pct: Founded in 1999, Tevet develops innovative metrology and advanced process control solutions for the semiconductor processing industry. Tevet's solutions rely on its unique measurement modules that are integrated into the processing equipment used for manufacturing of semiconductor devices. |
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